Patents by Inventor Hung-Chun Huang
Hung-Chun Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240136117Abstract: A multi-phase coupled inductor includes a first iron core, a second iron core, and a plurality of coil windings. The first iron core includes a first body and a plurality of first core posts. The plurality of first core posts are connected to the first body. The second iron core is opposite to the first iron core. The second iron core and the first body are spaced apart from each other by a gap. The plurality of coil windings wrap around the plurality of first core posts, respectively. Each of the coil windings has at least two coils.Type: ApplicationFiled: October 1, 2023Publication date: April 25, 2024Inventors: HUNG-CHIH LIANG, PIN-YU CHEN, HANG-CHUN LU, YA-WEN YANG, YU-TING HSU, WEI-ZHI HUANG
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Publication number: 20240124350Abstract: A quantum dot composite structure and a method for forming the same are provided. The quantum dot composite structure includes: a glass particle including a glass matrix and a plurality of quantum dots located in the glass matrix, wherein at least one of the plurality of quantum dots includes an exposed surface in the glass matrix; and an inorganic protective layer disposed on the glass particle and covering the exposed surface.Type: ApplicationFiled: October 13, 2023Publication date: April 18, 2024Inventors: Ching LIU, Wen-Tse HUANG, Ru-Shi LIU, Pei Cong YAN, Chai-Chun HSIEH, Hung-Chun TONG, Yu-Chun LEE, Tzong-Liang TSAI
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Publication number: 20240096781Abstract: A package structure including a semiconductor die, a redistribution circuit structure and an electronic device is provided. The semiconductor die is laterally encapsulated by an insulating encapsulation. The redistribution circuit structure is disposed on the semiconductor die and the insulating encapsulation. The redistribution circuit structure includes a colored dielectric layer, inter-dielectric layers and redistribution conductive layers embedded in the inter-dielectric layers. The electronic device is disposed over the colored dielectric layer and electrically connected to the redistribution circuit structure.Type: ApplicationFiled: March 20, 2023Publication date: March 21, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chun-Ti Lu, Hao-Yi Tsai, Chia-Hung Liu, Yu-Hsiang Hu, Hsiu-Jen Lin, Tzuan-Horng Liu, Chih-Hao Chang, Bo-Jiun Lin, Shih-Wei Chen, Hung-Chun Cho, Pei-Rong Ni, Hsin-Wei Huang, Zheng-Gang Tsai, Tai-You Liu, Po-Chang Shih, Yu-Ting Huang
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Patent number: 11923413Abstract: Semiconductor structures are provided. The semiconductor structure includes a substrate and nanostructures formed over the substrate. The semiconductor structure further includes a gate structure surrounding the nanostructures and a source/drain structure attached to the nanostructures. The semiconductor structure further includes a contact formed over the source/drain structure and extending into the source/drain structure.Type: GrantFiled: February 7, 2022Date of Patent: March 5, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Ta-Chun Lin, Kuo-Hua Pan, Jhon-Jhy Liaw, Chao-Ching Cheng, Hung-Li Chiang, Shih-Syuan Huang, Tzu-Chiang Chen, I-Sheng Chen, Sai-Hooi Yeong
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Patent number: 11795021Abstract: A method for assembling an information handling system display may include attaching a first side of a strip of double-sided tape to a display panel cover. A display panel may then be aligned with the display panel cover, and, when aligned, the display panel may be in contact with a release paper attached to a second side of the double-sided tape. The release paper may then be removed from the double-sided tape while the display panel is in contact with the release paper. A first surface of the display panel may be attached to the second side of the double-sided tape as the release paper is removed.Type: GrantFiled: September 17, 2020Date of Patent: October 24, 2023Assignee: Dell Products L.P.Inventors: Chin-Chung Wu, Tsai Chien Lin, James Gossett, Wan Li Chen, Jing-Tang Wu, Hung-Chun Huang
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Publication number: 20220081244Abstract: A method for assembling an information handling system display may include attaching a first side of a strip of double-sided tape to a display panel cover. A display panel may then be aligned with the display panel cover, and, when aligned, the display panel may be in contact with a release paper attached to a second side of the double-sided tape. The release paper may then be removed from the double-sided tape while the display panel is in contact with the release paper. A first surface of the display panel may be attached to the second side of the double-sided tape as the release paper is removed.Type: ApplicationFiled: September 17, 2020Publication date: March 17, 2022Applicant: Dell Products L.P.Inventors: Chin-Chung Wu, Tsai Chien Lin, James Gossett, Wan Li Chen, Jing-Tang Wu, Hung-Chun Huang
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Publication number: 20150354690Abstract: A system for the monitoring a preload in a ball screw includes a ball screw, a detecting device, a capturing device and a processing device. The ball screw has a preload. The detecting device detects an operating signal of the ball screw. The operating signal contains information about the ball screw's rotating speed and status. The status refers to a vibration or a sound generated by the operating ball screw. The capturing device is connected to the detecting device and acquires the operating signal. The processing device is connected to the capturing device, and has a threshold. The processing device processes and converts the operating signal into a ball-passing signal. When the ball-passing signal surpasses the threshold, the processing device determines that the ball screw's preload has vanished. Thereby, the system is enabled to determine the current state of the ball screw's preload reliably.Type: ApplicationFiled: September 3, 2014Publication date: December 10, 2015Inventors: CHIH-CHUN CHENG, PING-CHUN TSAI, WEN-NAN CHENG, HUNG-CHUN HUANG, KAI-HUNG LO, CHI-RUNG LI, TENG-DER TSAI, FU-CHING WANG, FU-HAN XU
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Publication number: 20140229125Abstract: A method of detecting a preload of a ball screw is to acquire an operational signal of the ball screw, to process the operational signal via a theoretical ball pass order and an order tracking analysis procedure to acquire an actual ball pass order, to compare and judge the relationship between the actual ball pass order and the theoretical ball pass order via a preload judgment procedure, and finally to observe the proportion of occurrence of side band of the actual ball pass order to determine the preload status of the ball screw.Type: ApplicationFiled: February 8, 2013Publication date: August 14, 2014Applicant: NATIONAL CHUNG CHENG UNIVERSITYInventors: Chih-Chun CHENG, Ping-Chun TSAI, Hung-Chun HUANG, Kai-Hung LO, Wen-Nan CHENG, Teng-Der TSAI, Fu-Ching WANG, Chi-Rung LI
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Patent number: 8559174Abstract: A computer case for installing computer parts such as a motherboard therein is provided. Two casings (including a first casing and a second casing) of the same size, specification and type are assembled opposite to each other to form a complete case. In this way, the manufacturing cost can be greatly saved, and the finished product can be further equipped with panels or baffle plates of different specifications or types according to user requirements, so as to meet the manufacturing requirements for high customization.Type: GrantFiled: March 6, 2012Date of Patent: October 15, 2013Assignee: Aopen IncorporatedInventors: Sheng-Hsiung Cheng, Te-An Lin, Hung-Chun Huang
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Publication number: 20130234571Abstract: A computer case for installing computer parts such as a motherboard therein is provided. Two casings (including a first casing and a second casing) of the same size, specification and type are assembled opposite to each other to form a complete case. In this way, the manufacturing cost can be greatly saved, and the finished product can be further equipped with panels or baffle plates of different specifications or types according to user requirements, so as to meet the manufacturing requirements for high customization.Type: ApplicationFiled: March 6, 2012Publication date: September 12, 2013Inventors: Sheng-Hsiung CHENG, Te-An Lin, Hung-Chun Huang