Patents by Inventor Hung-Chun Liu

Hung-Chun Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240106104
    Abstract: An electronic device includes a device body and an antenna module disposed in the device body and including a conductive structure and a coaxial cable including a core wire, a shielding layer wrapping the core wire, and an outer jacket wrapping the shielding layer. The conductive structure includes a structure body and a slot formed on the structure body and penetrating the structure body in a thickness direction of the structure body. A section of the shielding layer extends from the outer jacket and is connected to the structure body. A physical portion of the structure body and the section of the shielding layer are respectively located on two opposite sides of the slot in a width direction of the slot. A section of the core wire extends from the section of the shielding layer and overlaps the slot and the physical portion in the thickness direction.
    Type: Application
    Filed: September 8, 2023
    Publication date: March 28, 2024
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Hung-Yu Yeh, Shih-Chia Liu, Yen-Hao Yu, Li-Chun Lee, Chih-Heng Lin, Jui-Hung Lai
  • Publication number: 20240096781
    Abstract: A package structure including a semiconductor die, a redistribution circuit structure and an electronic device is provided. The semiconductor die is laterally encapsulated by an insulating encapsulation. The redistribution circuit structure is disposed on the semiconductor die and the insulating encapsulation. The redistribution circuit structure includes a colored dielectric layer, inter-dielectric layers and redistribution conductive layers embedded in the inter-dielectric layers. The electronic device is disposed over the colored dielectric layer and electrically connected to the redistribution circuit structure.
    Type: Application
    Filed: March 20, 2023
    Publication date: March 21, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chun-Ti Lu, Hao-Yi Tsai, Chia-Hung Liu, Yu-Hsiang Hu, Hsiu-Jen Lin, Tzuan-Horng Liu, Chih-Hao Chang, Bo-Jiun Lin, Shih-Wei Chen, Hung-Chun Cho, Pei-Rong Ni, Hsin-Wei Huang, Zheng-Gang Tsai, Tai-You Liu, Po-Chang Shih, Yu-Ting Huang
  • Patent number: 8837135
    Abstract: An expansion module for an interface card includes a transfer circuit-board, an expansion slot, a bottom-plate, a lateral-frame, and a latch. The transfer circuit-board has an electrical connector to be inserted into a card slot of a main circuit-board. The expansion slot is disposed on the transfer circuit-board and used for the interface card to be inserted into it, so as to connect the interface card to the main circuit-board. The transfer circuit-board is mounted onto the bottom-plate. The lateral-frame extends from the bottom-plate to define an accommodating space between the bottom-plate and the lateral-frame, and the transfer circuit-board is located in the accommodating space. The latch is pivoted to the lateral-frame and moves between a releasing position and a latching position. The latch has a first clamping element, and at the latching position the latch clamps and fixes the interface card with the first clamping element.
    Type: Grant
    Filed: December 23, 2011
    Date of Patent: September 16, 2014
    Assignee: Wistron Corporation
    Inventors: Yong-Liang Zheng, Hung-Chun Liu
  • Publication number: 20130088831
    Abstract: An expansion module for an interface card includes a transfer circuit-board, an expansion slot, a bottom-plate, a lateral-frame, and a latch. The transfer circuit-board has an electrical connector to be inserted into a card slot of a main circuit-board. The expansion slot is disposed on the transfer circuit-board and used for the interface card to be inserted into it, so as to connect the interface card to the main circuit-board. The transfer circuit-board is mounted onto the bottom-plate. The lateral-frame extends from the bottom-plate to define an accommodating space between the bottom-plate and the lateral-frame, and the transfer circuit-board is located in the accommodating space. The latch is pivoted to the lateral-frame and moves between a releasing position and a latching position. The latch has a first clamping element, and at the latching position the latch clamps and fixes the interface card with the first clamping element.
    Type: Application
    Filed: December 23, 2011
    Publication date: April 11, 2013
    Applicant: Wistron Corporation
    Inventors: Yong-Liang Zheng, Hung-Chun Liu
  • Publication number: 20100007252
    Abstract: A rack server includes a replaceable module, and a frame for supporting the replaceable module. Two slots are formed on both sides of the frame respectively. The rack server further includes a cover installed on the slots in a slidable manner. The cover includes a first housing and a second housing pivoted to the first housing. When the second housing rotates to a first position relative to the first housing, the second housing covers the replaceable module. When the second housing rotates to a second position relative to the first housing, the second housing can not cover the replaceable module. The rack server further includes a first fixing mechanism installed on a side of the slot of the frame for fixing the second housing on the frame when the second housing rotates to the first position relative to the first housing.
    Type: Application
    Filed: March 3, 2009
    Publication date: January 14, 2010
    Inventor: Hung-Chun Liu