Abstract: The present invention is a method and an apparatus for side-type heat dissipation. According to the present invention, a heat dissipation unit is deposed on a CPU to absorb the heat it generates; a cover is covered on the unit, where two openings are at two opposite ends and one of the openings has an inclined plane as well as a fan, and one of the openings is corresponding to a fan on the computer case; and an air flow is guided by a fan to the heat dissipation unit and is directed to a fan of a power supplier to be blown out of the computer case. By doing so, no thermal cycling will occur in the computer case and better heat-dissipation efficiency can be obtained.

Abstract: The present invention is a guiding fin heat sink, where a heat-dissipation unit is stuck on a CPU by a base and the unit has guiding channels passing through two ends; heat pipes are located between the base and the unit at one end, the other end is made penetrating through the guiding channels, and one end surface of the guiding channels is corresponding to an opening on a side wall of a computer case; and, after the heat of the CPU is absorbed by the base, it is directed to the heat-dissipation unit and the heat pipes and is carried to the outside of the computer case by an air flow made a fan between the case and the unit, so that no heat re-cycling is in the case and better heat dissipation efficiency is obtained.

Abstract: The present invention is a method and an apparatus for side-type heat dissipation. According to the present invention, a heat dissipation unit is deposed on a CPU to absorb the heat it generates; a cover is covered on the unit, where two openings are at two opposite ends and one of the openings has an inclined plane as well as a fan, and one of the openings is corresponding to a fan on the computer case; and an air flow is guided by a fan to the heat dissipation unit and is directed to a fan of a power supplier to be blown out of the computer case. By doing so, no thermal cycling will occur in the computer case and better heat-dissipation efficiency can be obtained.

Abstract: The present invention is a symmetrical heat sink module with a heat pipe for spreading of heat, comprising a first and a second sets of fins each with a first and a second heat dissipation areas where the first and the second heat dissipation areas each comprises corresponding concave parts; a curved heat pipe between the concave parts with the bottom being convex out of the bottom of the first and the second sets of fins; and a base at the convex bottom of the curved heat pipe. Accordingly, the first and the second sets of fins are corresponding to each other so that the heat sink module obtains larger heat dissipation area and the function of two-side dissipation to achieve better heat dissipation efficiency.