Patents by Inventor HUNG CHUNG KUO
HUNG CHUNG KUO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240162109Abstract: In an embodiment, a package includes an integrated circuit device attached to a substrate; an encapsulant disposed over the substrate and laterally around the integrated circuit device, wherein a top surface of the encapsulant is coplanar with the top surface of the integrated circuit device; and a heat dissipation structure disposed over the integrated circuit device and the encapsulant, wherein the heat dissipation structure includes a spreading layer disposed over the encapsulant and the integrated circuit device, wherein the spreading layer includes a plurality of islands, wherein at least a portion of the islands are arranged as lines extending in a first direction in a plan view; a plurality of pillars disposed over the islands of the spreading layer; and nanostructures disposed over the pillars.Type: ApplicationFiled: January 10, 2023Publication date: May 16, 2024Inventors: Hung-Yi Kuo, Chen-Hua Yu, Kuo-Chung Yee, Yu-Jen Lien, Ke-Han Shen, Wei-Kong Sheng, Chung-Shi Liu, Szu-Wei Lu, Tsung-Fu Tsai, Chung-Ju Lee, Chih-Ming Ke
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Publication number: 20240128122Abstract: Semiconductor package includes substrate, first barrier layer, second barrier layer, routing via, first routing pattern, second routing pattern, semiconductor die. Substrate has through hole with tapered profile, wider at frontside surface than at backside surface of substrate. First barrier layer extends on backside surface. Second barrier layer extends along sidewalls of through hole and on frontside surface. Routing via fills through hole and is separated from sidewalls of through hole by at least second barrier layer. First routing pattern extends over first barrier layer on backside surface and over routing via. First routing pattern is electrically connected to end of routing via and has protrusion protruding towards end of routing via in correspondence of through hole. Second routing pattern extends over second barrier layer on frontside surface. Second routing pattern directly contacts another end of routing via. Semiconductor die is electrically connected to routing via by first routing pattern.Type: ApplicationFiled: December 25, 2023Publication date: April 18, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Wei-Chung Chang, Ming-Che Ho, Hung-Jui Kuo
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Publication number: 20240096849Abstract: A semiconductor structure includes a semiconductor die, a redistribution circuit structure, and a terminal. The redistribution circuit structure is disposed on and electrically coupled to the semiconductor die. The terminal is disposed on and electrically coupled to the redistribution circuit structure, where the redistribution circuit structure is disposed between the semiconductor die and the terminal, and the terminal includes an under-bump metallization (UBM) and a capping layer. The UBM is disposed on and electrically coupled to the redistribution circuit structure, where the UBM includes a recess. The capping layer is disposed on and electrically coupled to the UBM, where the UBM is between the capping layer and the redistribution circuit structure, and the capping layer fills the recess of the UBM.Type: ApplicationFiled: January 9, 2023Publication date: March 21, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Wei-Chung Chang, Ming-Che Ho, Hung-Jui Kuo
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Publication number: 20240087961Abstract: The embodiments described herein are directed to a method for reducing fin oxidation during the formation of fin isolation regions. The method includes providing a semiconductor substrate with an n-doped region and a p-doped region formed on a top portion of the semiconductor substrate; epitaxially growing a first layer on the p-doped region; epitaxially growing a second layer different from the first layer on the n-doped region; epitaxially growing a third layer on top surfaces of the first and second layers, where the third layer is thinner than the first and second layers. The method further includes etching the first, second, and third layers to form fin structures on the semiconductor substrate and forming an isolation region between the fin structures.Type: ApplicationFiled: November 21, 2023Publication date: March 14, 2024Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Hung-Ju CHOU, Chih-Chung Chang, Jun-Ming Kuo, Che-Yuan Hsu, Pei-Ling Kao, Chen-Hsuan Liao
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Patent number: 11923250Abstract: The embodiments described herein are directed to a method for reducing fin oxidation during the formation of fin isolation regions. The method includes providing a semiconductor substrate with an n-doped region and a p-doped region formed on a top portion of the semiconductor substrate; epitaxially growing a first layer on the p-doped region; epitaxially growing a second layer different from the first layer on the n-doped region; epitaxially growing a third layer on top surfaces of the first and second layers, where the third layer is thinner than the first and second layers. The method further includes etching the first, second, and third layers to form fin structures on the semiconductor substrate and forming an isolation region between the fin structures.Type: GrantFiled: July 28, 2022Date of Patent: March 5, 2024Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Hung-Ju Chou, Chih-Chung Chang, Jiun-Ming Kuo, Che-Yuan Hsu, Pei-Ling Gao, Chen-Hsuan Liao
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Patent number: 11676117Abstract: An example operation includes one or more of capturing message content from messages between a sender and receiver which comprise information about a transfer of value from the sender to the receiver, detecting information about a compliance check within the message content which indicates whether the transfer of value complies with jurisdictional regulations, and recording the message content including the detected information about the compliance check via a blockchain.Type: GrantFiled: May 7, 2020Date of Patent: June 13, 2023Assignee: International Business Machines CorporationInventors: Nitin Gaur, Malavan Balanavaneethan, Mayuran Satchithanantham, Hung Chung Kuo, Chung Yu Huang
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Patent number: 11599858Abstract: An example operation includes one or more of transferring, via a blockchain, a digital value from a sender to a receiver, the digital value representing an off-chain transfer of value, monitoring a message flow between the sender and the receiver, detecting a settlement of the off-chain transfer of value based on message content within messages of the message flow, and returning, via the blockchain, the transferred digital value from the receiver to the sender based on the detected settlement.Type: GrantFiled: May 7, 2020Date of Patent: March 7, 2023Assignee: International Business Machines CorporationInventors: Nitin Gaur, Malavan Balanavaneethan, Mayuran Satchithanantham, Hung Chung Kuo, Ruby Cheng, Wing Lun Chung
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Publication number: 20210350458Abstract: An example operation includes one or more of transferring, via a blockchain, a digital value from a sender to a receiver, the digital value representing an off-chain transfer of value, monitoring a message flow between the sender and the receiver, detecting a settlement of the off-chain transfer of value based on message content within messages of the message flow, and returning, via the blockchain, the transferred digital value from the receiver to the sender based on the detected settlement.Type: ApplicationFiled: May 7, 2020Publication date: November 11, 2021Inventors: Nitin Gaur, MALAVAN BALANAVANEETHAN, MAYURAN SATCHITHANANTHAM, HUNG CHUNG KUO, Ruby Cheng, Wing Lun Chung
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Publication number: 20210350343Abstract: An example operation includes one or more of capturing message content from messages between a sender and receiver which comprise information about a transfer of value from the sender to the receiver, detecting information about a compliance check within the message content which indicates whether the transfer of value complies with jurisdictional regulations, and recording the message content including the detected information about the compliance check via a blockchain.Type: ApplicationFiled: May 7, 2020Publication date: November 11, 2021Inventors: Nitin Gaur, MALAVAN BALANAVANEETHAN, MAYURAN SATCHITHANANTHAM, HUNG CHUNG KUO, Chung Yu Huang