Abstract: A method for forming a wire bonding substrate is disclosed. A substrate comprising a first surface and a second surface is provided. A through hole is formed in the substrate. A conductive layer is formed on the first surface and the second surface of the substrate and covers a sidewall of the through hole. The conductive layer on the first surface of the substrate is patterned to form at least a first conductive pad, and the conductive layer on the second surface of the substrate is patterned to form at least a second conductive pad. An insulating layer is formed on the first surface and the second surface of the substrate and covers the first conductive pad and the second conductive pad. The insulating layer is recessed until top surfaces of the first conductive pad and the second conductive pad are exposed. A first metal layer is electroplated on the first conductive pad by applying current from the second conductive pad to the first conductive pad through the conductive layer passing the through hole.

Abstract: A method for forming a wire bonding substrate is disclosed. A substrate comprising a first surface and a second surface is provided. A through hole is formed in the substrate. A conductive layer is formed on the first surface and the second surface of the substrate and covers a sidewall of the through hole. The conductive layer on the first surface of the substrate is patterned to form at least a first conductive pad, and the conductive layer on the second surface of the substrate is patterned to form at least a second conductive pad. An insulating layer is formed on the first surface and the second surface of the substrate and covers the first conductive pad and the second conductive pad. The insulating layer is recessed until top surfaces of the first conductive pad and the second conductive pad are exposed. A first metal layer is electroplated on the first conductive pad by applying current from the second conductive pad to the first conductive pad through the conductive layer passing the through hole.

Abstract: The present invention provides a method of manufacturing a double-sided printed circuit board. An insulation substrate is first formed by creating a plurality of through holes on a Copper Clad Laminate (CCL) whose copper foil surface has been removed. Next, an electro-less copper layer is plated on the substrate for forming a plurality of plated through holes. After a wire pattern is formed on the substrate, a solder preventive layer is formed on top of the wire pattern. Next, a plurality of openings is created in between the solder preventive layer for exposing the contact pads. Finally, a protective layer is plated on top of the contact pads.

Abstract: A method for manufacturing a rigid-flex board is disclosed. After the formation of each layer of the rigid-flex board, a laser-etched groove is formed at the interface between a rigid part and a bending area of the rigid-flex board. After the laser etching process, a circuit-board routing process is performed to remove materials along the sideward perimeter of the bending area. The exposed copper layer is then removed from inside the laser-etched groove. Thereafter, a redundancy rigid structure within the bending area is readily removed to expose the flex board within the bending area.

Abstract: This invention provides a method for forming a micro blind via on a copper clad laminate (CCL) substrate. A CCL substrate having a dielectric layer sandwiched by a first copper layer and a second copper layer is prepared. A laser absorbing layer is formed on the first copper layer. The laser absorbing layer is subjected to laser drilling. A micro blind via is drilled into the first copper layer and the dielectric layer in one step.

Abstract: The present invention provides a method of manufacturing a double-sided printed circuit board. An insulation substrate is first formed by creating a plurality of through holes on a Copper Clad Laminate (CCL) whose copper foil surface has been removed. Next, an electro-less copper layer is plated on the substrate for forming a plurality of plated through holes. After a wire pattern is formed on the substrate, a solder preventive layer is formed on top of the wire pattern. Next, a plurality of openings is created in between the solder preventive layer for exposing the contact pads. Finally, a protective layer is plated on top of the contact pads.

Abstract: The present invention provides a method of manufacturing a double-sided printed circuit board. An insulation substrate is first formed by creating a plurality of through holes on a Copper Clad Laminate (CCL) whose copper foil surface has been removed. Next, an electro-less copper layer is plated on the substrate for forming a plurality of plated through holes. After a wire pattern is formed on the substrate, a solder preventive layer is formed on top of the wire pattern. Next, a plurality of openings is created in between the solder preventive layer for exposing the contact pads. Finally, a protective layer is plated on top of the contact pads.