Abstract: A write once recording medium comprising an inorganic material serving as a recording layer is disclosed. The inorganic material has a formula, A(1?y)My, wherein A is comprised of Si or Sn; M is comprised of Al, Ag, Au, Zn, Ti, Ni, Cu, Co, Ta, Fe, W, Cr, V, Ga, Pb, Mo, In or Te; and y is in the range of 0.02˜0.8.

Abstract: Liquid leaks from a vessel cause shorts between at least one elongate sensing wire and another conductor when the fluid absorbs into the porous sheath of the sensing wire. The other conductor may comprise a second elongate sensing wire having similar porous sheath or a conductive tray or other conductive collection means. The sensing wire is placed in proximity to the vessel, such as beneath or immediately adjacent. Shorts are detected from the electrical characteristics of a circuit including the sensing wire and location is determined therefrom.

Abstract: A write once recording medium comprising an inorganic material serving as a recording layer is disclosed. The inorganic material has a formula, A(1-y)My, wherein A is comprised of Si or Sn; M is comprised of Al, Ag, Au, Zn, Ti, Ni, Cu, Co, Ta, Fe, W, Cr, V, Ga, Pb, Mo, In or Te; and y is in the range of 0.02˜0.8.

Abstract: Semiconductor wafer tray positioning, such as can be used in rapid thermal processing (RTP), rapid thermal annealing (RTA), and other semiconductor fabrication processes, is disclosed. A housing, such as a quartz tube, to receive a wafer tray includes at least four positioning kits. Each positioning kit includes a primary outside edge and an inside edge. The primary outside edge at least substantially corresponds to an interior sidewall of the housing. The inside edge is opposite of the primary outside edge, and has a groove that at least substantially corresponds to a part of a frame of the wafer tray. The groove is receptive to the part of the frame of the wafer tray, to assist maintaining the wafer tray in a stable position when the tray is completely positioned in the housing.

Abstract: Semiconductor wafer tray positioning, such as can be used in rapid thermal processing (RTP), rapid thermal annealing (RTA), and other semiconductor fabrication processes, is disclosed. A housing, such as a quartz tube, to receive a wafer tray includes at least four positioning kits. Each positioning kit includes a primary outside edge and an inside edge. The primary outside edge at least substantially corresponds to an interior sidewall of the housing. The inside edge is opposite of the primary outside edge, and has a groove that at least substantially corresponds to a part of a frame of the wafer tray. The groove is receptive to the part of the frame of the wafer tray, to assist maintaining the wafer tray in a stable position when the tray is completely positioned in the housing.

Abstract: Liquid leaks from a vessel cause shorts between at least one elongate sensing wire and another conductor when the fluid absorbs into the porous sheath of the sensing wire. The other conductor may comprise a second elongate sensing wire having similar porous sheath or a conductive tray or other conductive collection means. The sensing wire is placed in proximity to the vessel, such as beneath or immediately adjacent. Shorts are detected from the electrical characteristics of a circuit including the sensing wire and location is determined therefrom.