Abstract: A filter apparatus may be provided. The filter apparatus may include a multi-port valve; a strainer coupled in flow communication to the multi-port valve, wherein the strainer may include a conical portion and an attachment portion extending away therefrom; a diffusing column coupled to the strainer and coupled in flow communication to the multi-port valve; and an equalizer column coupled in flow communication to the strainer.

Abstract: A method for manually reattaching solder balls onto a plurality of contact areas arranged in a pattern on a device to be reballed is provided. First, a single use preform with a plurality of solder balls arranged in a pattern corresponding to the pattern of contact areas on the device is provided. The solder balls are held in respective apertures in the preform by an adhesive layer on the preform that defines a closed end of the apertures and are partially exposed on one side of the preform. A solder paste or paste flux is applied to, at least, the contact areas of the device. The device is manually aligned with the exposed solder balls of the preform and the device and the exposed balls of the preform are manually brought into contact. The aligned device and preform are heated to reflow the solder balls onto the land areas of the device. The preform including the adhesive layer is then removed from the device with the solder balls being retained on the device.

Abstract: The present invention relates to a process for the rework of bottom terminated leadless devices as well as a pair of stencils for the manual reattachment of such devices (commonly known as a QFN, LGA or MLF packages). This process is used to remount these devices once they have been removed from the printed circuit board or placing new devices on an already populated PCB. It is also used to add bumps to the bottom side of an electronic device package or pads.

Abstract: A filter apparatus may be provided. The filter apparatus may include a multi-port valve; a strainer coupled in flow communication to the multi-port valve, wherein the strainer may include a conical portion and an attachment portion extending away therefrom; a diffusing column coupled to the strainer and coupled in flow communication to the multi-port valve; and an equalizer column coupled in flow communication to the strainer.

Abstract: A system is described for collecting, filtering and removing dirt, debris, detritus, active organic materials, chemicals and toxins from water in fish ponds and general aqua-culture applications. This system includes a filter tank with supporting base containing biological filtration media, a multi-port valve, a strainer, a diffuser head, and a quick drain assembly. The filter tank is fabricated using transparent material allowing for visual inspection of the mechanical and biological activities inside the filter tank. The strainer and diffuser head are slotted so as to capture debris, retain filter media, and maintain unrestricted water flow. The quick drain is a vertical tube covered by drainage slots. The top end of the tube is capped. The bottom end of the tube extends through the filter tank wall to the exterior where a drain valve is attached.

Abstract: A method for manually reattaching solder balls onto a plurality of contact areas arranged in a pattern on a device to be reballed is provided. First, a single use preform with a plurality of solder balls arranged in a pattern corresponding to the pattern of contact areas on the device is provided. The solder balls are held in respective apertures in the preform by an adhesive layer on the preform that defines a closed end of the apertures and are partially exposed on one side of the preform. A solder paste or paste flux is applied to, at least, the contact areas of the device. The device is manually aligned with the exposed solder balls of the preform and the device and the exposed balls of the preform are manually brought into contact. The aligned device and preform are heated to reflow the solder balls onto the land areas of the device. The preform including the adhesive layer is then removed from the device with the solder balls being retained on the device.

Abstract: Embodiments of the invention generally provide an apparatus and a method for cleaning the bevel edge of a semiconductor substrate, while simultaneously providing a protection layer over the production surface of the substrate. The method for forming the protection layer generally includes rotating the semiconductor substrate on a substrate support member, dispensing an etching solution onto the bevel of the substrate with a first pivotally mounted fluid dispensing nozzle, and dispensing a protective fluid onto a central portion of the substrate simultaneously with the dispensing of the etching solution with a second pivotally mounted fluid dispensing nozzle.

Abstract: A system is described for collecting, filtering and removing dirt, debris, detritus, active organic materials, chemicals and toxins from water in fish ponds and general aqua-culture applications. This system includes a filter tank with supporting base containing biological filtration media, a multi-port valve, a strainer, a diffuser head, and a quick drain assembly. The filter tank is fabricated using transparent material allowing for visual inspection of the mechanical and biological activities inside the filter tank. The strainer and diffuser head are slotted so as to capture debris, retain filter media, and maintain unrestricted water flow. The quick drain is a vertical tube covered by drainage slots. The top end of the tube is capped. The bottom end of the tube extends through the filter tank wall to the exterior where a drain valve is attached.

Abstract: Embodiments of the invention generally provide a method for cleaning the bevel edge of a semiconductor substrate, while simultaneously providing protection layer over the production surface of the substrate. The protection layer operates to shield the production surface from contact with any cleaning fluid that is applied to the bevel edge of the substrate. The protection layer may include a thin layer of deionized water applied to the center of the substrate while the substrate is rotated. The method for forming the protection layer generally includes rotating the semiconductor substrate on a substrate support member, dispensing an etching solution onto the bevel of the substrate with a first pivotally mounted fluid dispensing nozzle, and dispensing a protective fluid onto a central portion of the substrate simultaneously with the dispensing of the etching solution with a second pivotally mounted fluid dispensing nozzle.