Abstract: A display device includes a display panel, a backlight module and a circuit. The display panel includes multiple regions. The back light module includes multiple light emitting units, and each region corresponds to at least one of the light emitting units. The circuit includes a calibration lookup table corresponding to a first light emitting unit. The calibration lookup table records a parameter and multiple duty cycles. The circuit accesses the calibration lookup table and determines an output duty cycle according to the duty cycles. The circuit determines a current value of the first light emitting unit to drive the first light emitting unit according to the output duty cycle and the parameter.

Abstract: A solder screen printing process comprises: providing a wafer having a plurality of chips thereon, and a passivation layer covering the chips while exposing a plurality of bonding pads of the chips, wherein the bonding pads have a plurality of under bump metal (UBM) structures formed thereon; forming a pattern layer on the wafer, wherein the pattern layer has a plurality of first openings that defines the locations on the chips where bumps are to be subsequently formed; providing a carrier that has a wafer mounting location, providing a mounting support means that is mounted on the carrier, wherein the mounting support means has a second opening of the wafer size, such that the wafer mounting location of the carrier is exposed through the second opening; mounting the wafer on the carrier through the second opening of the mounting support means; and filling the first openings with a solder paste.

Abstract: A solder screen printing process comprises: providing a wafer having a plurality of chips thereon, and a passivation layer covering the chips while exposing a plurality of bonding pads of the chips, wherein the bonding pads have a plurality of under bump metal (UBM) structures formed thereon; forming a pattern layer on the wafer, wherein the pattern layer has a plurality of first openings that defines the locations on the chips where bumps are to be subsequently formed; providing a carrier that has a wafer mounting location; providing a mounting support means that is mounted on the carrier, wherein the mounting support means has a second opening of the wafer size, such that the wafer mounting location of the carrier is exposed through the second opening, mounting the wafer on the carrier through the second opening of the mounting support means; and filling the first openings with a solder paste.