Abstract: A method for CMP includes following operations. A metal stack is received. The metal layer stack includes at least a first metal layer and a second metal layer, and a top surface of the first metal layer and a top surface of the second metal layer are exposed. A protecting layer is formed over the second metal layer. A portion of the first metal layer is etched. The protecting layer protects the second metal layer during the etching of the portion of the first metal layer. A top surface of the etched first metal layer is lower than a top surface of the protecting layer. The protecting layer is removed from the second metal layer.

Abstract: A package structure and a method of forming the same are provided. The package structure includes a first die, a second die, a first encapsulant, and a buffer layer. The first die and the second die are disposed side by side. The first encapsulant encapsulates the first die and the second die. The second die includes a die stack encapsulated by a second encapsulant encapsulating a die stack. The buffer layer is disposed between the first encapsulant and the second encapsulant and covers at least a sidewall of the second die and disposed between the first encapsulant and the second encapsulant. The buffer layer has a Young's modulus less than a Young's modulus of the first encapsulant and a Young's modulus of the second encapsulant.

Abstract: A package structure including a photonic, an electronic die, an encapsulant and a waveguide is provided. The photonic die includes an optical coupler. The electronic die is electrically coupled to the photonic die. The encapsulant laterally encapsulates the photonic die and the electronic die. The waveguide is disposed over the encapsulant and includes an upper surface facing away from the encapsulant. The waveguide includes a first end portion and a second end portion, the first end portion is optically coupled to the optical coupler, and the second end portion has a groove on the upper surface.

Abstract: A package includes a photonic layer on a substrate, the photonic layer including a silicon waveguide coupled to a grating coupler; an interconnect structure over the photonic layer; an electronic die and a first dielectric layer over the interconnect structure, where the electronic die is connected to the interconnect structure; a first substrate bonded to the electronic die and the first dielectric layer; a socket attached to a top surface of the first substrate; and a fiber holder coupled to the first substrate through the socket, where the fiber holder includes a prism that re-orients an optical path of an optical signal.

Abstract: A power control system, a power control method, and a computer system thereof are disclosed. The power control system comprises a control module for receiving a control signal. A power management module is used for receiving a power signal and outputting an auxiliary power. A first switch module receives the control signal and controls the power management module to output the auxiliary power to the control module by the control signal. A second switch module controls the first switch module. After receiving the control signal, the control module determines whether the control signal is continuously received until a predetermined time. If yes, the control module controls the first switch module to transmit the auxiliary power continuously with the second switch module and receives the power signal to execute a boot procedure.

Abstract: A power control system, a power control method, and a computer system thereof are disclosed. The power control system comprises a control module for receiving a control signal. A power management module is used for receiving a power signal and outputting an auxiliary power. A first switch module receives the control signal and controls the power management module to output the auxiliary power to the control module by the control signal. A second switch module controls the first switch module. After receiving the control signal, the control module determines whether the control signal is continuously received until a predetermined time. If yes, the control module controls the first switch module to transmit the auxiliary power continuously with the second switch module and receives the power signal to execute a boot procedure.

Abstract: The present invention relates to a single component performing light polarization and color filtering, and to a production process making the component. The component comprises a polarization plate with photo resistant material of three primary colors distributed at a plurality of dot locations on one of its surface, and with light absorbing material disposed between any adjacent two of the dot locations. The production process comprises the steps of forming a dot matrix on a surface of the polarization plate and filling photo resistant material onto the dots of the dot matrix.