Patents by Inventor Hung-Hsiang Yeh

Hung-Hsiang Yeh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250038089
    Abstract: An electronic device includes a first metal layer, a first insulating layer disposed on the first metal layer, a second metal layer, a second insulating layer, a third metal layer, a third insulating layer, a fourth metal layer, a fourth insulating layer and an electronic component. The second metal layer is disposed on the first insulating layer. The second insulating layer is disposed on the second metal layer. The third metal layer is disposed on the second insulating layer. The third insulating layer is disposed on the third metal layer. The fourth metal layer is disposed on the third insulating layer. The fourth insulating layer is disposed on the fourth metal layer. The electronic component is disposed on the fourth insulating layer and electrically connected to the fourth metal layer. A Young's modulus of the third insulating layer is less than a Young's modulus of the first insulating layer.
    Type: Application
    Filed: October 13, 2024
    Publication date: January 30, 2025
    Applicant: Innolux Corporation
    Inventors: Hung-Sheng Chou, Wen-Hsiang Liao, Kuo-Jung Fan, Heng-Shen Yeh, Cheng-Chi Wang
  • Publication number: 20250029881
    Abstract: A wireless transistor outline (TO) package structure includes a carrying module, a chip and a lead frame both mounted on the carrying module, a sheet-like bonding module mounted on the chip and the lead frame in a flip chip manner, and an encapsulant that covers the above components therein. A connection pad of the chip and a connection segment of the lead frame are coplanar with each other. The sheet-like bonding module includes a ceramic substrate and a plurality of circuit layers that are stacked and formed on the ceramic substrate in a direct plated copper (DPC) manner. Areas of the circuit layers gradually decrease in a direction away from the ceramic substrate, and thicknesses of the circuit layers gradually increase in the same direction. The circuit layer arranged away from the ceramic substrate connects the connection pad and the connection segment for establishing an electrical connection therebetween.
    Type: Application
    Filed: September 26, 2023
    Publication date: January 23, 2025
    Inventors: HUNG-HSIANG YEH, JIA-YI WU
  • Patent number: 11688837
    Abstract: A light-emitting device, including a mount substrate, at least one light emitting element, a first light transparent member, a second light transparent member and a covering member, is disclosed. The at least one light emitting element is disposed on the mount substrate in a flip-chip manner. The first light transparent member is configured to receive the incident light emitting from the light emitting element, wherein the first light transparent member is formed of an inorganic substance and an inorganic phosphor, and includes a top surface and a first side surface contiguous to the top surface. The second light transparent member is disposed on the top surface of the first light transparent member and is formed of the inorganic substance and contains no the inorganic phosphor, and includes an externally exposed light emission surface and a second side surface contiguous to the externally exposed light emission surface.
    Type: Grant
    Filed: November 23, 2020
    Date of Patent: June 27, 2023
    Assignee: EVERLIGHT ELECTRONICS CO., LTD.
    Inventors: Hung-Hsiang Yeh, Robert Yeh, Tsung-Yuan Chen, Bo-Yu Chen
  • Publication number: 20210313493
    Abstract: A light-emitting device, including a mount substrate, at least one light emitting element, a first light transparent member, a second light transparent member and a covering member, is disclosed. The at least one light emitting element is disposed on the mount substrate in a flip-chip manner. The first light transparent member is configured to receive the incident light emitting from the light emitting element, wherein the first light transparent member is formed of an inorganic substance and an inorganic phosphor, and includes a top surface and a first side surface contiguous to the top surface. The second light transparent member is disposed on the top surface of the first light transparent member and is formed of the inorganic substance and contains no the inorganic phosphor, and includes an externally exposed light emission surface and a second side surface contiguous to the externally exposed light emission surface.
    Type: Application
    Filed: November 23, 2020
    Publication date: October 7, 2021
    Inventors: Hung-Hsiang YEH, Robert YEH, Tsung-Yuan CHEN, Bo-Yu CHEN
  • Publication number: 20050228520
    Abstract: A compressed digital music adapting apparatus for vehicles is described, which includes an adaptor having both a USB port and a cigarette-lighter charger port, a power regulator, and an FM modulator/transmitter. The power regulator regulates the voltage of the USB port and the cigarette-lighter charger port, and the FM modulator/transmitter modulates compressed digital music from a digital music player and then transmits the modulated music to an FM receiver of a vehicle when the adapting apparatus is docked such that the compressed digital music is broadcasted inside the vehicle. Moreover, the digital music player, as well as a power switch and an audio switch, may be integrated into the adaptor. As a result, the adapting apparatus possesses the broader functionality of broadcasting the compressed digital music through the USB port to a computer or through the cigarette-lighter charger port to a vehicle.
    Type: Application
    Filed: April 19, 2004
    Publication date: October 13, 2005
    Inventor: Hung-Hsiang Yeh