Abstract: Provided is a substrate structure, including: a substrate body having a conductive contact; an insulating layer formed on the substrate body with the conductive contact exposed therefrom; and an insulating protection layer formed on a portion of a surface of the insulating layer, and having a plurality of openings corresponding to the conductive contact, wherein at least one of the openings is disposed at an outer periphery of the conductive contact. Accordingly, the insulating protection layer uses the openings to dissipate and disperse residual stresses in a manufacturing process of high operating temperatures.

Abstract: A packaging substrate is provided, which includes: a substrate body having a first region with a plurality of conductive pads and a second region adjacent to the first region, and a material layer formed on the second region to prevent the substrate body from warping. An electronic package having the packaging substrate is also provided.

Abstract: A substrate structure is provided, including a substrate body having a conductive pad, an insulation layer formed on the substrate body and exposing the conductive pad, a conductive pillar disposed on the conductive pad, and a metal pad disposed on the insulation layer and electrically connected to the conductive pillar. A conductive component can be coupled to the metal pad. During a high-temperature process, the conductive pillar and the metal pad disperse the remaining stress generated due to heat, thereby preventing the conductive component from being cracked.

Abstract: Provided is a substrate structure, including: a substrate body having a conductive contact; an insulating layer formed on the substrate body with the conductive contact exposed therefrom; and an insulating protection layer formed on a portion of a surface of the insulating layer, and having a plurality of openings corresponding to the conductive contact, wherein at least one of the openings is disposed at an outer periphery of the conductive contact. Accordingly, the insulating protection layer uses the openings to dissipate and disperse residual stresses in a manufacturing process of high operating temperatures.

Abstract: A substrate structure is provided, which includes a substrate having a plurality of conductors and at least a receiving space formed on a surface of the substrate with the receiving space free from penetrating the substrate. During an encapsulating process, an encapsulant can be filled in the receiving space so as to strengthen the bonding between the substrate and the encapsulant, thereby preventing delamination from occurring therebetween.

Abstract: A substrate structure is provided, including a substrate body having a conductive pad, an insulation layer formed on the substrate body and exposing the conductive pad, a conductive pillar disposed on the conductive pad, and a metal pad disposed on the insulation layer and electrically connected to the conductive pillar. A conductive component can be coupled to the metal pad. During a high-temperature process, the conductive pillar and the metal pad disperse the remaining stress generated due to heat, thereby preventing the conductive component from being cracked.

Abstract: A packaging substrate is provided, which includes: a substrate body having a first region with a plurality of conductive pads and a second region adjacent to the first region, and a material layer formed on the second region to prevent the substrate body from warping. An electronic package having the packaging substrate is also provided.

Abstract: A method for fabricating an electronic package is provided, including the steps of: providing an interposer having a plurality of conductive vias and at least an opening formed at a periphery of the conductive vias; disposing at least an electronic element on the interposer; and bonding a cover plate to the electronic element and forming an encapsulant between the cover plate and the interposer so as to encapsulate the electronic element and fill the opening, thus allowing the encapsulant in the opening to come into contact with air. As such, during a subsequent high temperature process, evaporated solvents can flow out of the encapsulant through the opening without forming bubbles in the encapsulant, thereby preventing a bubble explosion from occurring. The invention further provides an electronic package.

Abstract: A cloud servicing system is provided to support a consumer for interactively programming a programmable product such as programmable toys or home security system. A consumer friendly path driven programming method is introduced to supplement the servicing cloud and support the new world of intelligent home and consumer programmable applications. The system may comprise a consumer programmed smart phone/touch pad as well as proprietary smart phone circuit.

Abstract: A method for fabricating a semiconductor device, wherein the method comprises steps as follows: Firstly, a device wafer is provided and a patterned bonding layer is then formed within a scribe line region of the device wafer. Subsequently a handle wafer is bonded to the device wafer by the patterned bonding layer. Next, a dicing process is performed along the scribe line region in order to divide the device wafer into a plurality of dices and remove the patterned bonding layer simultaneously, whereby the divided dices can be separated from the handle wafer.

Abstract: A cloud servicing system is provided to support a consumer for interactively programming a programmable product such as programmable toys or home security system. A consumer friendly path driven programming method is introduced to supplement the servicing cloud and support the new world of intelligent home and consumer programmable applications. The system may comprise a consumer programmed smart phone/touch pad as well as proprietary smart phone circuit.

Abstract: A method for fabricating a semiconductor device, wherein the method comprises steps as follows: Firstly, a device wafer is provided and a patterned bonding layer is then formed within a scribe line region of the device wafer. Subsequently a handle wafer is bonded to the device wafer by the patterned bonding layer. Next, a dicing process is performed along the scribe line region in order to divide the device wafer into a plurality of dices and remove the patterned bonding layer simultaneously, whereby the divided dices can be separated from the handle wafer.

Abstract: A cassette holder is positioned within cleaning equipment. The cleaning equipment includes a solution tank, at least one pipe positioned on an internal wall of the solution tank, and a cassette in which at least one semiconductor wafer is placed. The cassette holder has a loading plate in the solution tank for holding the cassette. Pluralities of guide blocks mounted on the loading plate prevent movement of the cassette. A side-frame is positioned at an end of the loading plate proximate to the pipe. The bottom of the loading plate has a plurality of neck feet, and each neck foot is covered by a first tube that enhances support strength of the neck foot. The cassette holder further includes at least one weight to overcome buoyancy.