Patents by Inventor Hung-Hsien Ko
Hung-Hsien Ko has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240130686Abstract: A coupled physiological signal measuring device is provided. The coupled physiological signal measuring device includes at least two measuring electrodes, a signal processing unit and a multiplex feedback circuit unit. The measuring electrodes are used to obtain a real-time physiological signal through measurement. The signal processing unit includes a discharge control element. If an electrostatic surge of the real-time physiological signal meets a condition, a discharge control signal is outputted. The multiplex feedback circuit unit is used to discharge the measuring electrodes according to the discharge control signal.Type: ApplicationFiled: January 20, 2023Publication date: April 25, 2024Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Yun-Yi HUANG, Yu-Chiao TSAI, Hung-Hsien KO, Heng-Yin CHEN
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Patent number: 11963295Abstract: Provided are a circuit apparatus, a manufacturing method thereof, and a circuit system. The circuit apparatus includes a flexible circuit board, a flexible packaging material layer and an electronic device. The flexible circuit board has at least one hollow pattern, wherein the flexible circuit board has an inner region and a peripheral region surrounding the inner region, and has a first surface and a second surface opposite to each other. The flexible packaging material layer is disposed in the at least one hollow pattern. The electronic device is disposed on the first surface of the flexible circuit board and electrically connected with the flexible circuit board.Type: GrantFiled: January 27, 2022Date of Patent: April 16, 2024Assignee: Industrial Technology Research InstituteInventors: Hung-Hsien Ko, Yi-Cheng Lu, Heng-Yin Chen, Hao-Wei Yu, Te-Hsun Lin
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Publication number: 20240004474Abstract: A film deformation element includes a first stack and a second stack. The first stack includes a first passivation layer, a first substrate, a first metal layer and a first dielectric layer. The first substrate is disposed on the first passivation layer. The first metal layer is disposed on the first substrate. The first dielectric layer is disposed on the first metal layer. The second stack is bonded to the first stack, to form a sealing space. The second stack includes a second passivation layer, a second substrate, a second metal layer and a second dielectric layer. The second dielectric layer is disposed on and faces the first dielectric layer. The second metal layer is disposed on the second dielectric layer. The second substrate is disposed on the second metal layer. The second passivation layer is disposed on the second substrate.Type: ApplicationFiled: June 29, 2023Publication date: January 4, 2024Applicant: Industrial Technology Research InstituteInventors: Chen-Tsai Yang, Heng-Yin Chen, Wan-Chen Yang, Jui-Chang Chuang, Hung-Hsien Ko, Min-Hsiung Liang, Chih-Cheng Cheng
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Patent number: 11729905Abstract: A stretchable circuit is provided in the invention. The stretchable circuit comprises a plurality of segments. Each segment includes a plurality of sub-segments. Each sub-segment includes at least one main line, at least one secondary line, and rib lines, and in each sub-segment, the main lines and the secondary lines are electrically connected to the rib lines.Type: GrantFiled: April 2, 2021Date of Patent: August 15, 2023Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Yu-Lin Hsu, Hung-Hsien Ko, Ting-Yu Ke, Ting-Yu Wang
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Publication number: 20230147556Abstract: A flexible hybrid electronic substrate and electronic textile including the same are provided. The flexible hybrid electronic substrate includes a first region and a second region. There is a joint between the first region and the second region. Each of the first region and the second region includes at least one selected from the group consisting of the following structure features: multilayer structure feature, anisotropic structure feature and pre-strained structure feature.Type: ApplicationFiled: January 27, 2022Publication date: May 11, 2023Applicant: Industrial Technology Research InstituteInventors: I-Hung Chiang, Hung-Hsien Ko, Min-Hsiung Liang, Te-Hsun Lin, Chen-Tsai Yang, Hao-Wei Yu
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Publication number: 20230140585Abstract: A multiple sensor-fusing based interactive training system, including a posture sensor, a sensing module, a computing module, and a display module, is provided. The posture sensor is configured to sense posture data and myoelectric data related to a training action. The sensing module is configured to output limb torque data according to the posture data, and output muscle group activation time data according to the myoelectric data. The computing module is configured to respectively convert the limb torque data and the muscle group activation time data into a moment-skeleton coordinate system and a muscle strength eigenvalue-skeleton coordinate system according to a skeleton coordinate system, perform fusion calculation, calculate evaluation data based on a result of the fusion calculation, and judge that the training action corresponds to a known exercise action according to the evaluation data. The display module is configured to display the evaluation data and the known exercise action.Type: ApplicationFiled: October 28, 2022Publication date: May 4, 2023Applicant: Industrial Technology Research InstituteInventors: Hung-Hsien Ko, Heng-Yin Chen, Chen-Tsai Yang
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Publication number: 20230138696Abstract: Provided are a circuit apparatus, a manufacturing method thereof, and a circuit system. The circuit apparatus includes a flexible circuit board, a flexible packaging material layer and an electronic device. The flexible circuit board has at least one hollow pattern, wherein the flexible circuit board has an inner region and a peripheral region surrounding the inner region, and has a first surface and a second surface opposite to each other. The flexible packaging material layer is disposed in the at least one hollow pattern. The electronic device is disposed on the first surface of the flexible circuit board and electrically connected with the flexible circuit board.Type: ApplicationFiled: January 27, 2022Publication date: May 4, 2023Applicant: Industrial Technology Research InstituteInventors: Hung-Hsien Ko, Yi-Cheng Lu, Heng-Yin Chen, Hao-Wei Yu, Te-Hsun Lin
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Patent number: 11408730Abstract: A stress measuring device and a stress measuring method for measuring a stress distribution of an object are provided. The stress measuring method includes: receiving a first-dimension image of the object; marking an area of the first-dimension image to generate a marked area; calculating a first stress applied to the marked area and transforming the marked area to a strained marked area corresponding to a second-dimension image to generate a determination result; and calculating the stress distribution corresponding to the first-dimension image of the object according to the determination result.Type: GrantFiled: November 19, 2019Date of Patent: August 9, 2022Assignee: Industrial Technology Research InstituteInventors: I-Hung Chiang, Hung-Hsien Ko, Cheng-Ta Pan, Wen-Yung Yeh, Cheng-Chung Lee
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Publication number: 20220183149Abstract: A stretchable circuit is provided in the invention. The stretchable circuit comprises a plurality of segments. Each segment includes a plurality of sub-segments. Each sub-segment includes at least one main line, at least one secondary line, and rib lines, and in each sub-segment, the main lines and the secondary lines are electrically connected to the rib lines.Type: ApplicationFiled: April 2, 2021Publication date: June 9, 2022Inventors: Yu-Lin HSU, Hung-Hsien KO, Ting-Yu KE, Ting-Yu WANG
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Publication number: 20210404795Abstract: A compression state measuring method is adapted to measure a compressed state of a compressed object compressed by a compressing object. First, at least one image of a first surface region of the compressed object not covered by the compressing object is captured. A first strain distribution value of the first surface region is obtained according to the at least one image. At least one strain distribution function is obtained according to the first strain distribution value. A second strain distribution value of a second surface region of the compressed object covered by the compressing object is obtained according to the at least one strain distribution function.Type: ApplicationFiled: September 26, 2020Publication date: December 30, 2021Applicant: Industrial Technology Research InstituteInventors: Wan-Hsin Chen, Hung-Hsien Ko, Chang-Ying Chen, I-Hung Chiang
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Patent number: 11204240Abstract: A strain measurement method includes disposing a 3D camera module at a first measurement position; using the 3D camera module to acquire a first 3D image of a to-be-measured object at a first to-be-measured position; acquiring a second 3D image of the to-be-measured object at the first to-be-measured position; and splicing the first and second 3D images to obtain an initial 3D image. The method still includes: moving the 3D camera module from the first measurement position to a second measurement position; using the 3D camera module to acquire a third 3D image of the to-be-measured object at a second to-be-measured position; acquiring a fourth 3D image of the to-be-measured object at the second to-be-measured position; and splicing the third and fourth 3D images to obtain a deformed 3D image. The method further includes comparing the initial 3D image and the deformed 3D image to output 3D deformation information.Type: GrantFiled: July 24, 2020Date of Patent: December 21, 2021Assignee: Industrial Technology Research InstituteInventors: I-Hung Chiang, Hung-Hsien Ko, Cheng-Ta Pan, Yu-Lin Hsu, Kuo-Hua Tseng
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Publication number: 20210356403Abstract: A strain measurement method includes disposing a 3D camera module at a first measurement position; using the 3D camera module to acquire a first 3D image of a to-be-measured object at a first to-be-measured position; acquiring a second 3D image of the to-be-measured object at the first to-be-measured position; and splicing the first and second 3D images to obtain an initial 3D image. The method still includes: moving the 3D camera module from the first measurement position to a second measurement position; using the 3D camera module to acquire a third 3D image of the to-be-measured object at a second to-be-measured position; acquiring a fourth 3D image of the to-be-measured object at the second to-be-measured position; and splicing the third and fourth 3D images to obtain a deformed 3D image. The method further includes comparing the initial 3D image and the deformed 3D image to output 3D deformation information.Type: ApplicationFiled: July 24, 2020Publication date: November 18, 2021Applicant: Industrial Technology Research InstituteInventors: I-Hung Chiang, Hung-Hsien Ko, Cheng-Ta Pan, Yu-Lin Hsu, Kuo-Hua Tseng
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Patent number: 11048851Abstract: A stretchable electronics generating apparatus and layout method thereof are provided. The layout method includes: establishing a layout database, wherein the layout database recodes a plurality of layout selection information respectively corresponding to a plurality of strain/stress information; detecting a layout target area to obtain a strain/stress distribution status of the layout target area; generating a wire routing information according to the strain/stress distribution status based on the layout database; and transporting the wire routing information to a manufacture device of the conductive wires for disposing a plurality of physical conductive wires on the layout target area by the manufacture device.Type: GrantFiled: November 18, 2019Date of Patent: June 29, 2021Assignee: Industrial Technology Research InstituteInventors: Cheng-Ta Pan, Hung-Hsien Ko, Cheng-Chung Lee, Chang-Ying Chen, Wen-Yung Yeh
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Publication number: 20200159982Abstract: A stretchable electronics generating apparatus and layout method thereof are provided. The layout method includes: establishing a layout database, wherein the layout database recodes a plurality of layout selection information respectively corresponding to a plurality of strain/stress information; detecting a layout target area to obtain a strain/stress distribution status of the layout target area; generating a wire routing information according to the strain/stress distribution status based on the layout database; and transporting the wire routing information to a manufacture device of the conductive wires for disposing a plurality of physical conductive wires on the layout target area by the manufacture device.Type: ApplicationFiled: November 18, 2019Publication date: May 21, 2020Applicant: Industrial Technology Research InstituteInventors: Cheng-Ta Pan, Hung-Hsien Ko, Cheng-Chung Lee, Chang-Ying Chen, Wen-Yung Yeh
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Publication number: 20200158493Abstract: A stress measuring device and a stress measuring method for measuring a stress distribution of an object are provided. The stress measuring method includes: receiving a first-dimension image of the object; marking an area of the first-dimension image to generate a marked area; calculating a first stress applied to the marked area and transforming the marked area to a strained marked area corresponding to a second-dimension image to generate a determination result; and calculating the stress distribution corresponding to the first-dimension image of the object according to the determination result.Type: ApplicationFiled: November 19, 2019Publication date: May 21, 2020Applicant: Industrial Technology Research InstituteInventors: I-Hung Chiang, Hung-Hsien Ko, Cheng-Ta Pan, Wen-Yung Yeh, Cheng-Chung Lee