Abstract: According to an embodiment of the present invention, an electromagnetic radiation apparatus includes a ground plane and an integrally formed antenna structure. The integrally formed antenna structure may include a radiation plate perpendicular to or with an angle larger than 45 degrees to the ground plane and a shielding structure configured to restrict radiation of the radiation plate.

Abstract: An antenna structure includes a radiating element and an antenna radome. The antenna radome has at least one dielectric layer, which has an upper surface having many S-shaped metal patterns and a lower surface having many inverse S-shaped metal patterns corresponding to the S-shaped metal patterns. The S-shaped metal patterns are respectively coupled to the corresponding inverse S-shaped metal patterns to converge radiating beams outputted from the radiating element.

Abstract: An antenna radome is provided. The antenna radome comprises an antenna radome substrate and a unit cell. The unit cell is formed on a surface of the antenna radome substrate, and the unit cell is perpendicular to a magnetic field direction of an antenna.

Abstract: An antenna structure includes a radiating element and an antenna radome. The antenna radome has at least one dielectric layer, which has an upper surface having many S-shaped metal patterns and a lower surface having many inverse S-shaped metal patterns corresponding to the S-shaped metal patterns. The S-shaped metal patterns are respectively coupled to the corresponding inverse S-shaped metal patterns to converge radiating beams outputted from the radiating element.

Abstract: A micro-electromechanical (MEM) process for fabrication of integrated multi-frequency communication passive components is fused into co-fired ceramics by way of “flip chip” for fabrication of a low-cost, high-performance, and high-reliability hybrid communication passive component applicable in the frequency range of 0.9 GHz˜100 GHz. The basic structure of the passive component is a double-layer substrate comprising a low-loss ceramic or glass bottom-layer substrate and a glass or plastic poly-molecular top-layer substrate and an optional ceramic substrate at the lowest layer. As the materials used and the processing temperature in the MEM process is compatible with the CMOS process, thus this invention is fit for serving as a post process following the CMOS process.

Abstract: A micro-electromechanical (MEM) process for fabrication of integrated multi-frequency communication passive components is fused into co-fired ceramics by way of “flip chip” for fabrication of a low-cost, high-performance, and high-reliability hybrid communication passive component applicable in the frequency range of 0.9 GHz˜100 GHz. The basic structure of the passive component is a double-layer substrate comprising a low-loss ceramic or glass bottom-layer substrate and a glass or plastic poly-molecular top-layer substrate and an optional ceramic substrate at the lowest layer. As the materials used and the processing temperature in the MEM process is compatible with the CMOS process, thus this invention is fit for serving as a post process following the CMOS process.