Patents by Inventor Hung-Hsun Chou
Hung-Hsun Chou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11942448Abstract: An integrated circuit and method of making an integrated circuit is provided. The integrated circuit includes an electrically conductive pad having a generally planar top surface that includes a cavity having a bottom surface and sidewalls extending from the bottom surface of the cavity to the top surface of the pad. An electronic device is attached to the top surface of the electrically conductive pad. A wire bond is attached from the electronic device to the bottom surface of the cavity. A molding compound encapsulates the electronic device.Type: GrantFiled: July 16, 2021Date of Patent: March 26, 2024Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Bo-Hsun Pan, Hung-Yu Chou, Chung-Hao Lin, Yuh-Harng Chien
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Patent number: 11749050Abstract: A sheet processing apparatus includes first and second sheet processing modules, a connecting module, and a storage module. In each of the first and second sheet processing modules, a sheet received from an entrance port is identified by an identifying unit, and if the sheet is qualified, the sheet is transported to a first communication port through a first transport path. In the connecting module, a first diverter mechanism is configured to permit sheet transport between a second communication port and a selected one of the first and second sheet processing modules. The storage module is disposed for receiving and storing the sheet from the connecting module.Type: GrantFiled: June 15, 2020Date of Patent: September 5, 2023Assignee: MASTERWORK AUTOMODULES TECH CORP. LTD.Inventors: Hung-Hsun Chou, Wen-Hsien Tsai
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Publication number: 20200410805Abstract: A sheet processing apparatus includes first and second sheet processing modules, a connecting module, and a storage module. In each of the first and second sheet processing modules, a sheet received from an entrance port is identified by an identifying unit, and if the sheet is qualified, the sheet is transported to a first communication port through a first transport path. In the connecting module, a first diverter mechanism is configured to permit sheet transport between a second communication port and a selected one of the first and second sheet processing modules. The storage module is disposed for receiving and storing the sheet from the connecting module.Type: ApplicationFiled: June 15, 2020Publication date: December 31, 2020Inventors: Hung-Hsun CHOU, Wen-Hsien TSAI
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Patent number: 10565815Abstract: A cashbox includes a box body with a first opening, an anti-theft plate with a second opening, and an anti-theft plate locking mechanism mounted to the box body and including a first latch member that includes a first main body pivotally connected to the box body and a latch portion extending from the first main body. The anti-theft plate is movable to an opening position, where the second opening communicates with the first opening. The anti-theft plate locking mechanism is switchable between a locking state, where the latch portion prevents the first opening from moving to the opening position, and an unlocking state, where the latch portion allows the anti-theft plate to move to the opening position.Type: GrantFiled: January 9, 2018Date of Patent: February 18, 2020Assignee: MASTERWORK AUTOMODULES TECH CORP. LTD.Inventors: Hung-Hsun Chou, Wen-Hsien Tsai
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Patent number: 10377599Abstract: A convey path switching module includes a body and a switching mechanism. The body has first, second and third convey paths. The switching mechanism includes a first switching assembly, a first actuator, a second switching assembly and at least one elastic member. The first actuator drives the first switching assembly to pivotally rotate. The second switching assembly is adapted to pivotally rotate and is restored by an elastic force of the elastic member. By pivotally rotating of the first and second switching assemblies, the switching mechanism is switched to a first state to open the first convey path and close the second and third convey paths, is switched to a second state to open the second convey path and close the first and third convey paths, and is switched to a third state to open the third convey path and close the first and second convey paths.Type: GrantFiled: February 8, 2018Date of Patent: August 13, 2019Assignee: Masterwork Automodules Tech Corp. LtdInventors: Hung-Hsun Chou, Poobalan Subramani, Wen-Hsien Tsai
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Publication number: 20190213823Abstract: A cashbox includes a box body with a first opening, an anti-theft plate with a second opening, and an anti-theft plate locking mechanism mounted to the box body and including a first latch member that includes a first main body pivotally connected to the box body and a latch portion extending from the first main body. The anti-theft plate is movable to an opening position, where the second opening communicates with the first opening. The anti-theft plate locking mechanism is switchable between a locking state, where the latch portion prevents the first opening from moving to the opening position, and an unlocking state, where the latch portion allows the anti-theft plate to move to the opening position.Type: ApplicationFiled: January 9, 2018Publication date: July 11, 2019Inventors: Hung-Hsun CHOU, Wen-Hsien TSAI
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Publication number: 20180370746Abstract: A convey path switching module includes a body and a switching mechanism. The body has first, second and third convey paths. The switching mechanism includes a first switching assembly, a first actuator, a second switching assembly and at least one elastic member. The first actuator drives the first switching assembly to pivotally rotate. The second switching assembly is adapted to pivotally rotate and is restored by an elastic force of the elastic member. By pivotally rotating of the first and second switching assemblies, the switching mechanism is switched to a first state to open the first convey path and close the second and third convey paths, is switched to a second state to open the second convey path and close the first and third convey paths, and is switched to a third state to open the third convey path and close the first and second convey paths.Type: ApplicationFiled: February 8, 2018Publication date: December 27, 2018Applicant: Masterwork Automodules Tech Corp. LtdInventors: Hung-Hsun Chou, Poobalan Subramani, Wen-Hsien Tsai
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Patent number: 10053318Abstract: A paper sheet handling apparatus includes a housing, a first unit, a second unit, and a joint module. At least one of the first and second units is a slidable paper sheet module slidably disposed at a rail on the housing and includes a module channel. The joint module is disposed in the housing and includes a main body, a moving shaft, a joint conveying channel, and a limiting member. The main body is located at a side of the rail. The moving shaft is slidably connected to the main body and configured to slide relative to the rail. The joint conveying channel is connected to the moving shaft. The limiting member is disposed on the main body and configured to limit the moving shaft to move between an outer point and an inner point. The outer point is located closer to the rail than the inner point.Type: GrantFiled: July 26, 2017Date of Patent: August 21, 2018Assignee: MASTERWORK AUTOMODULES TECHNOLOGY CORP., LTDInventors: Hung-Hsun Chou, Wen-Hsien Tsai
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Patent number: 9994409Abstract: The present disclosure is to provide a document storage assembly including a housing, a guiding plate, a supporting plate, and a displacement assembly. The supporting plate has at least one engagement structure, in which the guiding plate and the supporting plate define a storage space therebetween. The displacement assembly is configured to move the supporting plate towards or away from the guiding plate along a direction, in which the displacement assembly includes at least one first belt, at least one second belt, and a synchronous transmission assembly. The first belt has an engaging section parallel to the direction and is engaged with the engagement structure. The second belt is located under the storage space and has a supporting section parallel to the direction. The synchronous transmission assembly is configured to drive the engaging section and the supporting section to move at the same speed.Type: GrantFiled: November 6, 2017Date of Patent: June 12, 2018Assignee: MASTERWORK AUTOMODULES TECHNOLOGY CORP., LTDInventor: Hung-Hsun Chou
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Publication number: 20180040188Abstract: A paper sheet handling apparatus includes a housing, a first unit, a second unit, and a joint module. At least one of the first and second units is a slidable paper sheet module slidably disposed at a rail on the housing and includes a module channel. The joint module is disposed in the housing and includes a main body, a moving shaft, a joint conveying channel, and a limiting member. The main body is located at a side of the rail. The moving shaft is slidably connected to the main body and configured to slide relative to the rail. The joint conveying channel is connected to the moving shaft. The limiting member is disposed on the main body and configured to limit the moving shaft to move between an outer point and an inner point. The outer point is located closer to the rail than the inner point.Type: ApplicationFiled: July 26, 2017Publication date: February 8, 2018Inventors: Hung-Hsun CHOU, Wen-Hsien TSAI
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Patent number: 8331037Abstract: An optical lens includes a main body having an outer convex surface and a bottom surface opposite to the outer convex surface. The bottom surface has an inner concave surface which is concave toward the outer convex surface. The outer convex surface and the inner concave surface cooperatively form two positive lens portions and a negative lens portion. The positive lens portions and the negative lens portion are arranged in a triangular configuration.Type: GrantFiled: August 30, 2010Date of Patent: December 11, 2012Assignee: Edison Opto CorporationInventors: Mu-Yin Lu, Hung-Hsun Chou
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Publication number: 20120050889Abstract: An optical lens includes a main body having an outer convex surface and a bottom surface opposite to the outer convex surface. The bottom surface has an inner concave surface which is concave toward the outer convex surface. The outer convex surface and the inner concave surface cooperatively form two positive lens portions and a negative lens portion. The positive lens portions and the negative lens portion are arranged in a triangular configuration.Type: ApplicationFiled: August 30, 2010Publication date: March 1, 2012Inventors: Mu-Yin LU, Hung-Hsun Chou
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Publication number: 20120051047Abstract: A street lamp includes a lamp post, a lamp holder connected to the lamp post, and a lighting module mounted on the lamp holder. The lighting module includes a printed circuit board, a plurality of light emitting diodes arranged on the printed circuit board and a plurality of optical lenses. Each of the optical lenses has a main body having an outer convex surface and a bottom surface opposite to the outer convex surface. The bottom surface has an inner concave surface concave toward the outer convex surface. The inner concave surface defines a cavity for containing at least a part of one of the light emitting diodes. The outer convex surface and the inner concave surface cooperatively form two positive lens portions and a negative lens portion. The positive lens portions and the negative lens portion are arranged in a triangular configuration.Type: ApplicationFiled: August 30, 2010Publication date: March 1, 2012Inventors: Mu-Yin Lu, Hung-Hsun Chou
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Patent number: 7808004Abstract: A light emitting diode package structure having a heat-resistant cover and a method of manufacturing the same include a base, a light emitting diode chip, a plastic shell, and a packaging material. The plastic shell is in the shape of a bowl and has an injection hole thereon. After the light emitting diode chip is installed onto the base, the plastic shell is covered onto the base to fully and air-tightly seal the light emitting diode chip, and the packaging material is injected into the plastic shell through the injection hole until the plastic shell is filled up with the packaging material to form a packaging cover, and finally the plastic shell is removed to complete the LED package structure.Type: GrantFiled: March 17, 2006Date of Patent: October 5, 2010Assignee: Edison Opto CorporationInventors: Tsung-Ting Sun, Hung-Ta Laio, Hung-Hsun Chou, Tz-Shiuan Yan, Kuo-Shih Hsu
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Patent number: 7755282Abstract: A method is performed for the fabrication of LED and its structure. The LED is capable of emitting uniform white light and includes a substrate, an LED die, a holding frame and fluorescent substance where the holding frame is of hollow shape. The LED contains a die emitting blue light, and the fluorescent substance is a yellow phosphor. As the LED die is mounted on the substrate, the holding frame is seated on the die, and a bond wiring is performed. The holding frame is filled with the fluorescent substance in a uniform distribution on the die to form a layer of fluorescence. Finally the structure of the LED is accomplished as the packaging is completed.Type: GrantFiled: May 12, 2006Date of Patent: July 13, 2010Assignee: Edison Opto CorporationInventors: Tsung-Ting Sun, Hung-Ta Laio, Hung-Hsun Chou, Kuo-Shih Hsu, Pao-Shen Chen
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Publication number: 20070262713Abstract: A method is performed for the fabrication of LED and its structure. The LED is capable of emitting uniform white light and includes a substrate, an LED die, a holding frame and fluorescent substance where the holding frame is of hollow shape. The LED contains a die emitting blue light, and the fluorescent substance is a yellow phosphor. As the LED die is mounted on the substrate, the holding frame is seated on the die, and a bond wiring is performed. The holding frame is filled with the fluorescent substance in a uniform distribution on the die to form a layer of fluorescence. Finally the structure of the LED is accomplished as the packaging is completed.Type: ApplicationFiled: May 12, 2006Publication date: November 15, 2007Inventors: Tsung-Ting Sun, Hung-Ta Laio, Hung-Hsun Chou, Kuo-Shih Hsu, Pao-Shen Chen
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Publication number: 20070215896Abstract: A light emitting diode package structure having a heat-resistant cover and a method of manufacturing the same include a base, a light emitting diode chip, a plastic shell, and a packaging material. The plastic shell is in the shape of a bowl and has an injection hole thereon. After the light emitting diode chip is installed onto the base, the plastic shell is covered onto the base to fully and air-tightly seal the light emitting diode chip, and the packaging material is injected into the plastic shell through the injection hole until the plastic shell is filled up with the packaging material to form a packaging cover, and finally the plastic shell is removed to complete the LED package structure.Type: ApplicationFiled: March 17, 2006Publication date: September 20, 2007Inventors: Tsung-Ting Sun, Hung-Ta Laio, Hung-Hsun Chou, Tz-Shiuan Yan, Kuo-Shih Hsu
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Publication number: 20070165392Abstract: A light emitting diode structure using a heat conducting medium as a grounding circuit includes a heat dissipating body, a support frame, and a base, wherein the upper half of the heat dissipating body has a circular heat dissipating column having a plane for preinstalling a light emitting diode chip, and the lower half of the heat dissipating body has a circular contact disc, and both left and right ends of the support frame separately include a plurality of pins, and a pin is connected to a circular contact end for fixing the heat dissipating column of the heat dissipating body, and then both are buried inside the base, and the bottom surface of the heat dissipating body contact disc is protruded from the bottom of the base, and the plurality of pins of the support frame is extended outward from both left and right sides of the base.Type: ApplicationFiled: January 13, 2006Publication date: July 19, 2007Inventors: Tsung-Ting Sun, Hung-Ta Laio, Hung-Hsun Chou, Tz-Shiuan Yan