Abstract: An embodiment semiconductor package includes a bare semiconductor chip, a packaged semiconductor chip adjacent the bare semiconductor chip, and a redistribution structure bonded to the bare semiconductor chip and the packaged semiconductor chip. The redistribution structure includes a first redistribution layer having a first thickness; a second redistribution layer having a second thickness; and a third redistribution layer between the first redistribution layer and the second redistribution layer. The third redistribution layer has a third thickness greater than the first thickness and the second thickness. The package further includes an underfill disposed between the bare semiconductor chip and the redistribution structure and a molding compound encapsulating the bare semiconductor chip, the packaged semiconductor chip, and the underfill.

Abstract: An embodiment semiconductor package includes a bare semiconductor chip, a packaged semiconductor chip adjacent the bare semiconductor chip, and a redistribution structure bonded to the bare semiconductor chip and the packaged semiconductor chip. The redistribution structure includes a first redistribution layer having a first thickness; a second redistribution layer having a second thickness; and a third redistribution layer between the first redistribution layer and the second redistribution layer. The third redistribution layer has a third thickness greater than the first thickness and the second thickness. The package further includes an underfill disposed between the bare semiconductor chip and the redistribution structure and a molding compound encapsulating the bare semiconductor chip, the packaged semiconductor chip, and the underfill.

Abstract: A method for CMP includes following operations. A first metal layer and a second metal layer are formed in a dielectric structure. The second metal layer is formed over a portion of the first metal layer. A first composition is provided to remove a portion of the first metal layer. A second composition is provided to form a protecting layer over the second metal layer. The protecting layer is removed to expose the second metal layer. A CMP operation is performed to remove a portion of the first metal layer, a portion of the second metal layer and a portion of the dielectric structure.

Abstract: A camera assembly adaptable to a display device is provided. The camera assembly comprises a fixed base, a lifting component, an elastic element and a camera module. The fixed base is disposed in the display device and fixed with the display device. The lifting component is movably connected to the fixed base. The elastic element is connected with the lifting component and the fixed base respectively. The camera module is pivotally connected to the lifting component. The elastic element provides elastic force to drive the lifting component to raise the camera module so that the camera module is exposed from the display device, and the camera module pivots relative to the lifting component to tilt the display device.

Abstract: A functional assembly disposed on a display device is provided. The display device has a display surface. The functional assembly includes a first bracket disposed on a back surface of the display device, a second bracket pivotally connected to the one end of the first bracket and rotatable with respect to the first rotation shaft, and a base pivotally connected to the one end of the second bracket and rotatable with respect to the second rotation shaft. One end of the first bracket has a first rotation shaft. One end of the second bracket has a second rotation shaft. One of the first and second rotation shafts is perpendicular to the display surface, and the other one is parallel to the display surface. The base can be shielded from the back surface of the display device and can be exposed on the one side of the display device.

Abstract: A camera assembly adaptable to a display device is provided. The camera assembly comprises a fixed base, a lifting component, an elastic element and a camera module. The fixed base is disposed in the display device and fixed with the display device. The lifting component is movably connected to the fixed base. The elastic element is connected with the lifting component and the fixed base respectively. The camera module is pivotally connected to the lifting component. The elastic element provides elastic force to drive the lifting component to raise the camera module so that the camera module is exposed from the display device, and the camera module pivots relative to the lifting component to tilt the display device.

Abstract: A display device including a display panel, a shaft, a correcting sensor and a driving module is provided. The display panel has a display surface. The shaft has an axial end and a correcting end opposite the axial end. The correcting sensor is disposed on the correcting end. When the shaft is rotated relative to the axial end, the correcting sensor is moved to a second position from a first position and faces the display surface at the second position. The driving module is configured to translate the shaft when the correcting sensor is at the second position, such that the correcting sensor can be moved to a detecting position from the second position, wherein the distance of the second position relative to the display surface is greater than the distance of the detecting position relative to the display surface.

Abstract: A display device including a display panel, a shaft, a correcting sensor and a driving module is provided. The display panel has a display surface. The shaft has an axial end and a correcting end opposite the axial end. The correcting sensor is disposed on the correcting end. When the shaft is rotated relative to the axial end, the correcting sensor is moved to a second position from a first position and faces the display surface at the second position. The driving module is configured to translate the shaft when the correcting sensor is at the second position, such that the correcting sensor can be moved to a detecting position from the second position, wherein the distance of the second position relative to the display surface is greater than the distance of the detecting position relative to the display surface.

Abstract: A display device including a housing, a display module, a carrier and a color correction module is provided. The display module is disposed in the housing and exposes a display plane, which faces a first direction vertical to the display plane. The carrier is movably connected to the housing and disposed outside the housing or disposed on a back side of the display module. The back side faces to a second direction opposite to the first direction. The color correction module is disposed on the carrier and has a sensing face. The carrier is selectively disposed at a first position or a second position with respect to the housing. When the carrier is at the second position, the sensing face of the color correction module is moved to face the display plane.

Abstract: A display device including a housing, a display module, a carrier and a color correction module is provided. The display module is disposed in the housing and exposes a display plane, which faces a first direction vertical to the display plane. The carrier is movably connected to the housing and disposed outside the housing or disposed on a back side of the display module. The back side faces to a second direction opposite to the first direction. The color correction module is disposed on the carrier and has a sensing face. The carrier is selectively disposed at a first position or a second position with respect to the housing. When the carrier is at the second position, the sensing face of the color correction module is moved to face the display plane.