Abstract: A button module is provided. The button module comprises a base, a pressing part, and an elastic part. The pressing part includes a fixed end and a free end. The fixed end is pivotally connected to the base in a first axial direction. The elastic part is disposed on a side of the pressing part facing the base. The elastic part includes a first damping portion and a second damping portion selectively pressing against the base, where a hardness of the first damping portion is different from a hardness of the second damping portion.

Abstract: A write assist circuit can include a control circuit and a voltage generator. The control circuit can be configured to receive memory address information associated with a memory write operation for memory cells. The voltage generator can be configured to provide a reference voltage to one or more bitlines coupled to the memory cells. The voltage generator can include two capacitive elements, where during the memory write operation, (i) one of the capacitive elements can be configured to couple the reference voltage to a first negative voltage, and (ii) based on the memory address information, both capacitive elements can be configured to cumulatively couple the reference voltage to a second negative voltage that is lower than the first negative voltage.

Abstract: Semiconductor devices and methods of forming the same are provided. A method according to the present disclosure includes forming a first wafer including a plurality of electronic integrated circuits (EICs), forming a second wafer including a plurality of photonic integrated circuits (PICs), bonding the first wafer to the second wafer to form a first stacked wafer. The bonding of the first wafer to the second wafer includes vertically aligning each of the plurality of the EICs with one of the plurality of the PICs.

Abstract: Provided is a multi-segment rotation robotic arm which contains a plurality of concatenated robotic arm segments which can rotate 360 degrees along an adjacent oblique section thereof. Any one of the concatenated robotic arm segments of the multi-segment rotation robotic arm can be arbitrarily concatenate in accordance with use requirements. When the concatenated robotic arm segments rotate relatively, they can rotate 360 degrees without affecting the electric supply, and can also reduce the volume increase by rotated joints. Therefore, the multi-segment rotation robotic arm of the present invention can effectively adapt to complex and tortuous spaces in the body cavity to reduce the possibility of expanding the opening of the minimally invasive surgery and causing damage to organs or tissues in the body cavity.

Abstract: A semiconductor package includes a first integrated circuit, a first conductive via, a second conductive via, a second integrated circuit, a third conductive via and an encapsulant. The first conductive via is disposed in a first passivation layer over the first integrated circuit. The second conductive via is disposed in a second passivation layer over the first passivation layer. The second conductive via is electrically connected to the first conductive via. The third conductive via is disposed over the second integrated circuit, wherein a surface of the third conductive via is substantially coplanar with a surface of the third conductive via. The encapsulant encapsulates the first integrated circuit, the first passivation layer, the second passivation layer, the second integrated circuit and the third conductive via.

Abstract: Methods of forming connectors and packaged semiconductor devices are disclosed. In some embodiments, a connector is formed by forming a first photoresist layer over an interconnect structure, and patterning the first photoresist layer. The patterned first photoresist layer is used to form a first opening in an interconnect structure. The patterned first photoresist is removed, and a second photoresist layer is formed over the interconnect structure and in the first opening. The second photoresist layer is patterned to form a second opening over the interconnect structure in the first opening. The second opening is narrower than the first opening. At least one metal layer is plated through the patterned second photoresist layer to form the connector.

Abstract: Methods of forming connectors and packaged semiconductor devices are disclosed. In some embodiments, a connector is formed by forming a first photoresist layer over an interconnect structure, and patterning the first photoresist layer. The patterned first photoresist layer is used to form a first opening in an interconnect structure. The patterned first photoresist is removed, and a second photoresist layer is formed over the interconnect structure and in the first opening. The second photoresist layer is patterned to form a second opening over the interconnect structure in the first opening. The second opening is narrower than the first opening. At least one metal layer is plated through the patterned second photoresist layer to form the connector.

Abstract: A system and a method using matrix barcode information to process documents are provided. A document-processing apparatus generates matrix barcode information and establishes a wireless link with a mobile apparatus through the matrix barcode information. When the document-processing apparatus establishes the wireless link with the mobile apparatus, the document-processing apparatus creates a file transfer zone, performs a corresponding automatic document-processing action, such as scanning or printing, according to a driving command received from the mobile apparatus, and exchanges the generated image information with the mobile apparatus through the file transfer zone. Given the matrix barcode information, the document-processing apparatus can be directly controlled by the mobile apparatus to achieve direct information exchange and enhanced efficiency and security of the document-processing system.

Abstract: An embodiment semiconductor package includes a bare semiconductor chip, a packaged semiconductor chip adjacent the bare semiconductor chip, and a redistribution structure bonded to the bare semiconductor chip and the packaged semiconductor chip. The redistribution structure includes a first redistribution layer having a first thickness; a second redistribution layer having a second thickness; and a third redistribution layer between the first redistribution layer and the second redistribution layer. The third redistribution layer has a third thickness greater than the first thickness and the second thickness. The package further includes an underfill disposed between the bare semiconductor chip and the redistribution structure and a molding compound encapsulating the bare semiconductor chip, the packaged semiconductor chip, and the underfill.

Abstract: Provided is a multi-segment rotation robotic arm which contains a plurality of concatenated robotic arm segments which can rotate 360 degrees along an adjacent oblique section thereof. Any one of the concatenated robotic arm segments of the multi-segment rotation robotic arm can be arbitrarily concatenate in accordance with use requirements. When the concatenated robotic arm segments rotate relatively, they can rotate 360 degrees without affecting the electric supply, and can also reduce the volume increase by rotated joints. Therefore, the multi-segment rotation robotic arm of the present invention can effectively adapt to complex and tortuous spaces in the body cavity to reduce the possibility of expanding the opening of the minimally invasive surgery and causing damage to organs or tissues in the body cavity.

Abstract: An embodiment semiconductor package includes a bare semiconductor chip, a packaged semiconductor chip adjacent the bare semiconductor chip, and a redistribution structure bonded to the bare semiconductor chip and the packaged semiconductor chip. The redistribution structure includes a first redistribution layer having a first thickness; a second redistribution layer having a second thickness; and a third redistribution layer between the first redistribution layer and the second redistribution layer. The third redistribution layer has a third thickness greater than the first thickness and the second thickness. The package further includes an underfill disposed between the bare semiconductor chip and the redistribution structure and a molding compound encapsulating the bare semiconductor chip, the packaged semiconductor chip, and the underfill.

Abstract: A method of searching an image file includes: utilizing a login module to log in a user account; utilizing an input module to store an image file at a predetermined location; utilizing an information capturing module to capture at least one image information of the image file stored at the predetermined location; utilizing an index building module to build at least one index tag corresponding to the image file according to the at least one image information captured by the information capturing module; utilizing a searching module to receive at least one searching condition so as to search the at least one index tag according to the at least one searching condition; and utilizing a display module to display a searching result corresponding to the image file when the at least one index tag matches with the at least one searching condition.

Abstract: Embodiments of mechanisms for forming a package structure are provided. The package structure includes a semiconductor die and a substrate. The package structure includes a pillar bump and an elongated solder bump bonded to the semiconductor die and the substrate. A height of the elongated solder bump is substantially equal to a height of the pillar bump. The elongated solder bump has a first width, at a first horizontal plane passing through an upper end of a sidewall surface of the elongated solder bump, and a second width, at a second horizontal plane passing through a midpoint of the sidewall surface. A ratio of the second width to the first width is in a range from about 0.5 to about 1.1.

Abstract: A semiconductor device includes a passivation layer formed on a semiconductor substrate, a protective layer overlying the passivation layer and having an opening, an interconnect structure formed in the opening of the protective layer, a bump formed on the interconnect structure, and a molding compound layer overlying the interconnect structure and being in physical contact with a lower portion of the bump.

Abstract: A system and a method using matrix barcode information to perform point-to-point information exchange are provided. An electronic device is connected to a document-processing device by way of wired connection and instantly exchange information with a mobile device held by a user. The electronic device and the mobile device are wirelessly connected through matrix barcode information. The electronic device provides a file transfer zone for storing information to be transmitted. When the user transmits a remote command to the electronic device through the mobile device, the electronic device directly drives the document-processing device according to the remote command for the document-processing device to perform a corresponding automated document-processing action, such as scanning or printing. Given the instant information exchange scheme established based on the matrix barcode information, the document-processing efficiency can be enhanced.

Abstract: The present disclosure, in some embodiments, relates to an integrated chip structure. The integrated chip structure includes a bump structure disposed on a first substrate and a molding compound in physical contact with the bump structure. The bump structure protrudes from the molding compound. A conductive region is on a second substrate and contacts the bump structure. A no-flow underfill (NUF) material is vertically between the molding compound and the second substrate and laterally surrounds the bump structure. The NUF material is separated from the molding compound.

Abstract: A system and a method using matrix barcode information to process documents are provided. A document-processing apparatus generates matrix barcode information and establishes a wireless link with a mobile apparatus through the matrix barcode information. When the document-processing apparatus establishes the wireless link with the mobile apparatus, the document-processing apparatus creates a file transfer zone, performs a corresponding automatic document-processing action, such as scanning or printing, according to a driving command received from the mobile apparatus, and exchanges the generated image information with the mobile apparatus through the file transfer zone. Given the matrix barcode information, the document-processing apparatus can be directly controlled by the mobile apparatus to achieve direct information exchange and enhanced efficiency and security of the document-processing system.

Abstract: A system and a method using matrix barcode information to perform point-to-point information exchange are provided. An electronic device is connected to a document-processing device by way of wired connection and instantly exchange information with a mobile device held by a user. The electronic device and the mobile device are wirelessly connected through matrix barcode information. The electronic device provides a file transfer zone for storing information to be transmitted. When the user transmits a remote command to the electronic device through the mobile device, the electronic device directly drives the document-processing device according to the remote command for the document-processing device to perform a corresponding automated document-processing action, such as scanning or printing. Given the instant information exchange scheme established based on the matrix barcode information, the document-processing efficiency can be enhanced.

Abstract: A semiconductor device includes a passivation layer formed on a semiconductor substrate, a protective layer overlying the passivation layer and having an opening, an interconnect structure formed in the opening of the protective layer, a bump formed on the interconnect structure, and a molding compound layer overlying the interconnect structure and being in physical contact with a lower portion of the bump.

Abstract: Methods of forming connectors and packaged semiconductor devices are disclosed. In some embodiments, a connector is formed by forming a first photoresist layer over an interconnect structure, and patterning the first photoresist layer. The patterned first photoresist layer is used to form a first opening in an interconnect structure. The patterned first photoresist is removed, and a second photoresist layer is formed over the interconnect structure and in the first opening. The second photoresist layer is patterned to form a second opening over the interconnect structure in the first opening. The second opening is narrower than the first opening. At least one metal layer is plated through the patterned second photoresist layer to form the connector.