Abstract: A cooling device configured to cool a heat source includes a tank, a bellow and a solenoid valve. The tank contains a coolant, and the heat source is immersed in the coolant. The solenoid valve includes a first channel, a second channel, a third channel and a piston. The first channel is connected to the tank. The second channel is connected to the bellow. The third channel is connected to an external space. The piston is configured to seal the second channel and the third channel. The piston is configured to connect the first channel to one of the second channel and the third channel. When the heat source is initially activated, the piston is moved to connect the first channel to the third channel. When the heat source operates, the piston is moved to connect the first channel to the second channel.

Abstract: The invention provides a cooling system for a server. The cooling system includes a casing and a first heat dissipation device. The casing includes a tank and a cover. The tank has an accommodation space. The cover is movably mounted on the tank, and the cover covers the accommodation space so as to form an airtight space with the tank. The first heat dissipation device is mounted on the cover and located within the airtight space of the casing.

Abstract: An immersion cooling system configured to store a coolant configured for cooling a heat source and including a liquid container, a tube and a gas regulating assembly. The liquid container is configured to store the coolant configured to cool the heat source. One end of the tube is connected to the liquid container. The gas regulating assembly is located above the tube and includes a valve, a cooler, and a gas container. The valve includes a first pipe, a second pipe and a third pipe. The valve is switchable to connect the first pipe to the second pipe or connect the first pipe to the third pipe. The first pipe of the valve is connected to the tube via the cooler. The second pipe is connected to ambient air, and the third pipe is connected to the gas container.

Abstract: A computer system connected to an external heat dissipation device and including a casing, a circuit board, a heat source, an open type heat dissipation device and a closed type heat dissipation device. The circuit board is disposed on the casing. The heat source is disposed on the circuit board. The open type heat dissipation device includes a liquid cold plate and two connectors. The liquid cold plate is disposed on the circuit board and spaced apart from the heat source. The liquid cold plate is configured to be connected to the external heat dissipation device via the two connectors. The closed type heat dissipation device includes an evaporator and a condenser that are connected to each other. The evaporator is in thermal contact with the heat source, and the condenser is in thermal contact with the liquid cold plate.

Abstract: A cooling device configured to cool a heat source includes a tank, a bellow and a solenoid valve. The tank contains a coolant, and the heat source is immersed in the coolant. The solenoid valve includes a first channel, a second channel, a third channel and a piston. The first channel is connected to the tank. The second channel is connected to the bellow. The third channel is connected to an external space. The piston is configured to seal the second channel and the third channel. The piston is configured to connect the first channel to one of the second channel and the third channel. When the heat source is initially activated, the piston is moved to connect the first channel to the third channel. When the heat source operates, the piston is moved to connect the first channel to the second channel.

Abstract: A container for immersion cooling system includes a plural of container sidewalls, a circuit board, an inner connector, and an outer connector. The plural of container sidewalls form an accommodating space. One of the plural of container sidewalls has an opening. The circuit board is fixed to the one of the plural of container sidewalls and seals the opening. The circuit board has a first surface and a second surface opposite to the first surface. The first surface is exposed to the accommodating space. The inner connector is fixed on the first surface and is located in the accommodating space. The outer connector is fixed on the second surface and is electrically connected to the inner connector through the circuit board. The outer connector is exposed out of the container. Therein, the circuit board, the inner connector, and the outer connector form an adapter module for the container.

Abstract: An immersion cooling apparatus includes a heat-generating member, a chamber and a plurality of metal tubes. The chamber has a plurality of upper steam-discharging outlets. The chamber stores a cooling solution and contains the heat-generating member to make the heat-generating member immersed in the cooling solution. The plurality of metal tubes is communicated with the plurality of the upper steam-discharging outlets respectively. Each metal tube extends upward from the upper steam-discharging outlet to guide steam generated by the cooling solution when the cooling solution absorbs heat of the heat-generating member to leave the chamber through the upper steam-discharging outlets and then enter the metal tubes. When the metal tubes cool the steam into liquid, the liquid flows downward along each metal tube and then flows into the cooling solution through the plurality of upper steam-discharging outlets.

Abstract: A container for immersion cooling system includes a plural of container sidewalls, a circuit board, an inner connector, and an outer connector. The plural of container sidewalls form an accommodating space. One of the plural of container sidewalls has an opening. The circuit board is fixed to the one of the plural of container sidewalls and seals the opening. The circuit board has a first surface and a second surface opposite to the first surface. The first surface is exposed to the accommodating space. The inner connector is fixed on the first surface and is located in the accommodating space. The outer connector is fixed on the second surface and is electrically connected to the inner connector through the circuit board. The outer connector is exposed out of the container. Therein, the circuit board, the inner connector, and the outer connector form an adapter module for the container.

Abstract: A cooling system includes a housing, a dielectric liquid and a dielectric vapor. The housing has an accommodating space configured to accommodate a heat generating component. The dielectric liquid partially fills the accommodating space and is configured to contact the heat generating component. The dielectric vapor partially fills the accommodating space and is configured to contact the housing.

Abstract: A cooling device includes a sink, a dielectric liquid disposed in the sink, a heat exchanger, a first tube, a second tube, a gas storage unit, a first valve, a second valve and a third valve. A first interface of the first tube is connected to a first sink interface of the sink. A second interface of the first tube is connected to a first heat exchanger interface of the heat exchanger. The second tube is connected between a second sink interface of the sink and a second heat exchanger interface of the heat exchanger. The first valve is disposed on a third interface of the first tube. The second valve is disposed between the first valve and a first gas storage unit interface of the gas storage unit. The third valve is disposed between a second gas storage unit interface of the gas storage unit and an external space.

Abstract: An immersion cooling apparatus includes a chamber, a steam-discharging tube, a liquid-returning tube, and a heat-dissipating tube. The chamber has a steam-discharging outlet and a liquid-returning inlet for storing a cooling solution and containing a heat-generating member. The steam-discharging tube is communicated with the steam-discharging outlet to discharge steam generated by the cooling solution. The liquid-returning tube passes through the liquid-returning inlet to be immersed in the cooling solution. The heat-dissipating tube is communicated with the steam-discharging tube and the liquid-returning tube and is spaced apart from the chamber for cooling the steam into liquid and returning the liquid to the cooling solution through the liquid-returning tube.

Abstract: The disclosure is related to a method for verifying an immersion cooling system. The immersion cooling system includes a first sensor, a second sensor and at least one third sensor. The method includes: obtaining a first difference value; determining whether the first difference value is smaller than a first threshold value; determining that the first sensor and the second sensor are in normal operation when the first difference value is smaller than the first threshold value; when the first difference value is not smaller than the first threshold value, determining an operating condition of the first sensor or the second sensor according to a relationship between a sensor value of the at least one third sensor and the sensor value of the first sensor, or a relationship between the sensor value of the at least one third sensor and the sensor value of the second sensor.

Abstract: A gas storage device includes a hollow casing, a gas storage bag, a gas tube, and a retractable module. The hollow casing has a casing top, a casing sidewall, and a casing bottom. The gas storage bag is located in the hollow casing. The gas tube is arranged through the casing bottom and in fluid communication between the gas storage bag and an exterior space. The retractable module is connected between a top surface of the gas storage bag and the casing top. The gas storage bag expands when fluid is filled into the gas storage bag through the gas tube, such that the retractable module is folded. The gas storage bag contracts when fluid is drawn out of the gas storage bag through the gas tube, such that the retractable module is unfolded.

Abstract: A gas storage device includes a hollow casing, a gas storage bag, a gas tube, and a retractable module. The hollow casing has a casing top, a casing sidewall, and a casing bottom. The gas storage bag is located in the hollow casing. The gas tube is arranged through the casing bottom and in fluid communication between the gas storage bag and an exterior space. The retractable module is connected between a top surface of the gas storage bag and the casing top. The gas storage bag expands when fluid is filled into the gas storage bag through the gas tube, such that the retractable module is folded. The gas storage bag contracts when fluid is drawn out of the gas storage bag through the gas tube, such that the retractable module is unfolded.

Abstract: A cooling device is configured to cool a heat source. The cooling device includes a tank, a cover and a cooling liquid. The tank includes a bottom surface, a tank inlet and a tank outlet. The cover is disposed on the tank. The cover and the tank form a space therebetween, and the space is configured to accommodate the heat source. The cooling liquid is located in the space.

Abstract: A heat dissipation control method is applied to an immersion cooling apparatus for cooling a heat generating member. The immersion cooling apparatus includes a cooling chamber, a fan device, and a pump communicated with the cooling chamber and the fan device for transmitting vapor generated by a cooling solution to the fan device and transmitting the cooling solution to the cooling chamber. The heat generating member is immersed in the cooling solution stored in the cooling chamber. The fan device cools the vapor into liquid. The heat dissipation control method includes utilizing a sensing processor to detect a vapor temperature, the sensing processor preferentially increasing power of the pump when determining the vapor temperature is larger than a maximum of a temperature control range, and the sensing processor preferentially decreasing power of the fan device when determining the vapor temperature is less than a minimum of the temperature control range.

Abstract: The disclosure is related to a method for verifying an immersion cooling system. The immersion cooling system includes a first sensor, a second sensor and at least one third sensor. The method includes: obtaining a first difference value; determining whether the first difference value is smaller than a first threshold value; determining that the first sensor and the second sensor are in normal operation when the first difference value is smaller than the first threshold value; when the first difference value is not smaller than the first threshold value, determining an operating condition of the first sensor or the second sensor according to a relationship between a sensor value of the at least one third sensor and the sensor value of the first sensor, or a relationship between the sensor value of the at least one third sensor and the sensor value of the second sensor.

Abstract: A heat dissipation control method is applied to an immersion cooling apparatus for cooling a heat generating member. The immersion cooling apparatus includes a cooling chamber, a fan device, and a pump communicated with the cooling chamber and the fan device for transmitting steam generated by a cooling solution to the fan device and transmitting the cooling solution to the cooling chamber. The heat generating member is immersed in the cooling solution stored in the cooling chamber. The fan device cools the steam into liquid. The heat dissipation control method includes utilizing a sensing processor to detect a steam temperature, the sensing processor preferentially increasing power of the pump when determining the steam temperature is larger than a maximum of a temperature control range, and the sensing processor preferentially decreasing power of the fan device when determining the steam temperature is less than a minimum of the temperature control range.

Abstract: A radiator includes a plurality of first pipe bodies. The first pipe bodies are mutually connected to form a first annular structure. The first pipe bodies are configured to allow a cooling fluid to flow through. Each of the first pipe bodies has a width and a height perpendicular to each other. The height is longer than the width.

Abstract: A radiator includes a first conducting pipe, a second conducting pipe, a plurality of radiating pipes, and a plurality of fins. The second conducting pipe is opposite to the first conducting pipe. The radiating pipes are parallel to each other and are in fluid communication with the first conducting pipe and the second conducting pipe. One of the radiating pipes has a vertical projection on an adjacent one of the radiating pipes. The vertical projection partially overlaps on the adjacent one of the radiating pipes. The fins are connected between adjacent two of the radiating pipes.