Patents by Inventor Hung Jui-Hsiang

Hung Jui-Hsiang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor package with die pad having recessed portion
    Patent number: 6809408
    Abstract: A semiconductor package with a die pad having a recessed portion is proposed, wherein a lead frame is used, having a die pad formed with at least a through hole, and a plurality of leads. A chip is mounted on the die pad and covers the through hole, with a bottom surface of the chip being partly exposed out the through hole. The through hole is formed at its peripheral edge with a recessed portion that dents from a top surface of the die pad and is associated with the through hole. During a molding process, the recessed portion is entirely filled with an encapsulating compound used for encapsulating the chip and die pad. This prevents forming of voids between the chip and die pad, and assures packaged products to be free of die crack or popcorn effect, thereby significantly improving yield and reliability of the packaged products.
    Type: Grant
    Filed: March 29, 2002
    Date of Patent: October 26, 2004
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Chen Shih Yu, Chih-Jen Yang, Hung Jui-Hsiang, Chin Jeng Liu, Chen-Hsung Yang
  • Semiconductor package with die pad having recessed portion
    Publication number: 20030141575
    Abstract: A semiconductor package with a die pad having a recessed portion is proposed, wherein a lead frame is used, having a die pad formed with at least a through hole, and a plurality of leads. A chip is mounted on the die pad and covers the through hole, with a bottom surface of the chip being partly exposed out the through hole. The through hole is formed at its peripheral edge with a recessed portion that dents from a top surface of the die pad and is associated with the through hole. During a molding process, the recessed portion is entirely filled with an encapsulating compound used for encapsulating the chip and die pad. This prevents forming of voids between the chip and die pad, and assures packaged products to be free of die crack or popcorn effect, thereby significantly improving yield and reliability of the packaged products.
    Type: Application
    Filed: March 29, 2002
    Publication date: July 31, 2003
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Chen Shih Yu, Chih-Jen Yang, Hung Jui-Hsiang, Chin Jeng Liu, Chen-Hsung Yang