Abstract: A multilayer board includes laminates. Each of the laminates includes a liquid crystal polymer substrate and a metal layer. Each of the liquid crystal polymer substrates has a melting point. When a number of the liquid crystal polymer substrates is an odd number, they include a first middle substrate that is located in the most middle position and has a first melting point lowest among the melting points. The melting points increase in a direction away from the first middle substrate. When the number of the liquid crystal polymer substrates is an even number, they include second and third middle substrates that are located in the most middle position and respectively have second and third melting points that are substantially same. The second or third melting point is lowest among the melting points. The melting points increase in a direction away from the second and third middle substrates.

Abstract: A method of manufacturing a modified liquid crystal polymer includes: providing a liquid crystal polymer having a first melting point; heating the liquid crystal polymer to a first temperature and maintaining at the first temperature for a first time period, in which the first temperature is lower than or equal to the first melting point; and cooling the liquid crystal polymer to a second temperature to form a first modified liquid crystal polymer, the second temperature being lower than the first temperature, the first modified liquid crystal polymer having a second melting point, in which the second melting point is higher than the first melting point.

Abstract: A metal substrate includes a first insulating substrate, a second insulating substrate, a first metal layer, a second metal layer and a release layer. The first insulating substrate has a first modified surface and a second surface opposite to the first modified surface. The first metal layer faces the second surface. The release layer is bonded on the first modified surface. The second insulating substrate is bonded on a side of the release layer, such that the release layer is between the first modified surface and the second insulating substrate. The second metal layer is disposed on a side of the second insulating substrate, such that the second insulating substrate is between the release layer and the second metal layer. An original surface roughness of the first modified surface has a variation substantially less than 10% after the first modified surface is released from the release layer.

Abstract: A method of manufacturing a liquid crystal polymer film, which includes the following operations: providing a liquid crystal polymer powder; uniformly dispersing the liquid crystal polymer powder in a solvent to form a mixed solution; coating the mixed solution on a carrier board to form a coating layer; heating the coating layer to a first temperature to remove the solvent in the coating layer; heating the liquid crystal polymer powder to a second temperature after the solvent is removed to form the liquid crystal polymer film.

Abstract: A method of manufacturing circuit board structure includes operations below. First, a first substrate is provided. A first wire structure is formed on the first substrate, in which the first wire structure includes a first wire having a first height and a second wire having a second height, and the first height is greater than the second height. A liquid crystal polymer layer is then formed on the first substrate and covers the first wire structure.

Abstract: The present disclosure is related to a composite substrate, including a first metal base material, a first bonding layer, and a second metal base material. The first metal base material includes a first metal layer and a first insulating layer, and the first insulating layer is disposed on the first metal layer. The first bonding layer, disposed on the first insulating layer, in which a dielectric constant of the first bonding layer is lower than 3 and a dissipation factor of the first bonding layer is lower than 0.005. The second metal base material includes a second metal layer and a second insulating layer; the second insulating layer is disposed on the first bonding layer, and the second metal layer is disposed on the second insulating layer. A method of manufacturing a composite substrate is further provided in the present disclosure.

Abstract: The disclosure provides a composite for forming an insulating substrate. The composite includes 100 parts by weight of a liquid crystal polymer and 0.5-85 parts by weight of a dielectric additive. The liquid crystal polymer has a repeating unit represented by in which Ar is 1,4-phenylene, 1,3-phenylene, 2,6-naphthalene, or 4,4?-biphenylene, Y is —O— or —NH—, and X is carboxamido, imido/imino, amidino, aminocarbonylamino, aminothiocarbonyl, aminocarbonyloxy, aminosulfonyl, aminosulfonyloxy, aminosulfonylamino, carboxyl ester, (carboxyl ester)amino, (alkoxycarbonyl)oxy, alkoxycarbonyl, hydroxyamino, alkoxyamino, cyanato, isocyanato, or a combination thereof.

Abstract: A circuit board includes a first insulating structure, a first redistribution layer, a second insulating structure, and a second redistribution layer. The first insulating structure has an upper surface and includes a first liquid crystal polymer layer. The first redistribution layer is disposed on the upper surface of the first insulating structure. The second insulating structure is disposed on the upper surface of the first insulating structure and covers the first redistribution layer. The second insulating structure has a top surface opposite to the upper surface and includes a second liquid crystal polymer layer. The second redistribution layer is disposed on the top surface of the second insulating structure.

Abstract: The present disclosure provides a high-frequency composite substrate which includes a metal layer and an insulating structure. The insulating structure includes at least one liquid crystal polymer (LCP) layer with dielectric constant ranged from about 2 to about 4. The liquid crystal polymer layer adheres to the metal layer. The high-frequency composite substrate may reduce the adverse effects caused by the Resistor-Capacitor delay (RC delay).

Abstract: A method of manufacturing a modified liquid crystal polymer includes: providing a liquid crystal polymer having a first melting point; heating the liquid crystal polymer to a first temperature and maintaining at the first temperature for a first time period, in which the first temperature is lower than or equal to the first melting point; and cooling the liquid crystal polymer to a second temperature to form a first modified liquid crystal polymer, the second temperature being lower than the first temperature, the first modified liquid crystal polymer having a second melting point, in which the second melting point is higher than the first melting point.

Abstract: A liquid crystal polymer composite is disclosed herein. The liquid crystal polymer composite includes a solvent, a soluble liquid crystal polymer, and an additive. The soluble liquid crystal polymer is dissolved in the solvent. The additive includes an organic polymer or inorganic filler, while the additive is dispersed or dissolved in the solvent.

Abstract: A manufacturing method of a composite substrate is provided. A first conductive layer is formed on a first liquid crystal polymer layer. The first conductive layer is patterned to form a patterned first conductive layer. A second liquid crystal polymer layer including a soluble liquid crystal polymer is formed to cover the patterned first conductive layer. The second liquid crystal polymer layer which is on the patterned first conductive layer is removed.

Abstract: The disclosure provides a composite for forming an insulating substrate. The composite includes 100 parts by weight of a modified liquid crystal polymer and 0.5-85 parts by weight of a dielectric additive. The modified liquid crystal polymer has a repeating unit represented by in which Ar is 1,4-phenylene, 1,3-phenylene, 2,6-naphthalene, or 4,4?-biphenylene, Y is —O— or —NH—, and X is carboxamido, imido/imino, am idino, aminocarbonylamino, aminothiocarbonyl, aminocarbonyloxy, aminosulfonyl, aminosulfonyloxy, aminosulfonylamino, carboxyl ester, (carboxyl ester)amino, (alkoxycarbonyl)oxy, alkoxycarbonyl, hydroxyamino, alkoxyamino, cyanato, isocyanato, or a combination thereof.

Abstract: A method of manufacturing a liquid crystal polymer film, which includes the following operations: providing a liquid crystal polymer powder; uniformly dispersing the liquid crystal polymer powder in a solvent to form a mixed solution; coating the mixed solution on a carrier board to form a coating layer; heating the coating layer to a first temperature to remove the solvent in the coating layer; heating the liquid crystal polymer powder to a second temperature after the solvent is removed, such that the liquid crystal polymer powder is melted, thereby forming the liquid crystal polymer film.

Abstract: A manufacturing method of a composite substrate is provided. A first conductive layer is formed on a first liquid crystal polymer layer. The first conductive layer is patterned to form a patterned first conductive layer. A second liquid crystal polymer layer including a soluble liquid crystal polymer is formed to cover the patterned first conductive layer. The second liquid crystal polymer layer which is on the patterned first conductive layer is removed.

Abstract: A liquid crystal polymer composite is disclosed herein. The liquid crystal polymer composite includes a solvent, a soluble liquid crystal polymer, and an additive. The soluble liquid crystal polymer is dissolved in the solvent. The additive includes an organic polymer or inorganic filler, while the additive is dispersed or dissolved in the solvent.

Abstract: A metal substrate includes a first insulating substrate, a second insulating substrate, a first metal layer and a second metal layer. The first insulating substrate has a first modified surface and a second surface opposite to the first modified surface. The first metal layer faces the second surface. The second insulating substrate is bonded on the first modified surface, such that the first insulating substrate is between the second insulating substrate and the first metal layer. The second metal layer is disposed on a side of the second insulating substrate, such that the second insulating substrate is between the first modified surface and the second metal layer. An original surface roughness of the first modified surface has a variation substantially less than 10% after the first modified surface is released from the second insulating substrate.

Abstract: A circuit board includes a first insulating structure, a first redistribution layer, a second insulating structure, and a second redistribution layer. The first insulating structure has an upper surface and includes a first liquid crystal polymer layer. The first redistribution layer is disposed on the upper surface of the first insulating structure. The second insulating structure is disposed on the upper surface of the first insulating structure and covers the first redistribution layer. The second insulating structure has a top surface opposite to the upper surface and includes a second liquid crystal polymer layer. The second redistribution layer is disposed on the top surface of the second insulating structure.

Abstract: The present disclosure provides a high-frequency composite substrate which includes a metal layer and an insulating structure. The insulating structure includes at least one liquid crystal polymer (LCP) layer with dielectric constant ranged from about 2 to about 4. The liquid crystal polymer layer adheres to the metal layer. The high-frequency composite substrate may reduce the adverse effects caused by the Resistor-Capacitor delay (RC delay).

Abstract: A metal substrate includes a first insulating substrate, a second insulating substrate, a first metal layer and a second metal layer. The first insulating substrate has a first modified surface and a second surface opposite to the first modified surface. The first metal layer faces the second surface. The second insulating substrate is bonded on the first modified surface, such that the first insulating substrate is between the second insulating substrate and the first metal layer. The second metal layer is disposed on a side of the second insulating substrate, such that the second insulating substrate is between the first modified surface and the second metal layer. An original surface roughness of the first modified surface has a variation substantially less than 10% after the first modified surface is released from the second insulating substrate.