Abstract: A semiconductor structure includes a substrate, an isolation structure disposed in the substrate, and a hybrid structure disposed over the isolation structure. The hybrid structure is substantially conformal with respect to a profile of the isolation structure. The hybrid structure includes an oxide component, a nitride component surrounding the oxide component, and a first polysilicon component alongside the nitride component. The nitride component includes a first upper surface closed to the first polysilicon component, and a second upper surface distal to the first polysilicon component. The second upper surface is lower than the first upper surface.

Abstract: A transfer robot (100) for transferring a silicon wafer includes a base support (110), an end-effector (130) having a main body (131) and two spaced fingers (132) extending from the main body, an articulated arm (120) assembly interconnecting the base support and the end-effector, a pair of first linear optical sensors (1331, 1332) arranged on the respective fingers of the end-effector, a second linear optical sensor (1333) arranged on the main body of the end-effector, and a plurality of displacement sensors (134) arranged non-collinearly on the end-effector, for ascertaining a vertical position and a leveling of the silicon wafer. The first and second linear optical sensors are arranged non-collinearly on the end-effector for ascertaining a center of the silicon wafer.