Patents by Inventor Hung Kit CHAN

Hung Kit CHAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Direct transfer apparatus for electronic components
    Patent number: 11136202
    Abstract: Electronic components are transferred from a source surface for supplying electronic components to a destination surface for receiving electronic components by an ejector device that is locatable at an ejection position for pushing an electronic component mounted on the source surface towards the destination surface. A support device that is locatable at a receiving position supports the electronic component that is pushed onto the destination surface. Further, a pre-transfer imaging device inspects the electronic component before it is transferred from the source surface and a post-transfer imaging device inspects the electronic component after it has been transferred onto the destination surface, wherein the pre-transfer and post-transfer imaging devices are located on opposite sides of the source and destination surfaces.
    Type: Grant
    Filed: January 6, 2020
    Date of Patent: October 5, 2021
    Assignee: ASM TECHNOLOGY SINGAPORE PTE LTD
    Inventors: Kui Kam Lam, Kai Siu Lam, Yen Hsi Tang, Hung Kit Chan, Ka Yee Mak
  • DIRECT TRANSFER APPARATUS FOR ELECTRONIC COMPONENTS
    Publication number: 20210206585
    Abstract: Electronic components are transferred from a source surface for supplying electronic components to a destination surface for receiving electronic components by an ejector device that is locatable at an ejection position for pushing an electronic component mounted on the source surface towards the destination surface. A support device that is locatable at a receiving position supports the electronic component that is pushed onto the destination surface. Further, a pre-transfer imaging device inspects the electronic component before it is transferred from the source surface and a post-transfer imaging device inspects the electronic component after it has been transferred onto the destination surface, wherein the pre-transfer and post-transfer imaging devices are located on opposite sides of the source and destination surfaces.
    Type: Application
    Filed: January 6, 2020
    Publication date: July 8, 2021
    Inventors: Kui Kam LAM, Kai Siu LAM, Yen Hsi TANG, Hung Kit CHAN, Ka Yee MAK