Abstract: A precision cleaning device for cleaning and clearing a glue-dispensing needle includes a base, a supporting unit disposed on the base, a moving unit movably connected to the supporting unit, a clearing needle connected to the moving unit and facing the supporting unit, and an adjusting unit connected to the moving unit. The adjusting unit adjusts a movement of the moving unit to drive the clearing needle to move towards the glue-dispensing needle on the supporting unit, allowing the clearing needle to pass through the glue-dispensing needle to completely clean and clear the glue-dispensing needle. The cleaning device also prolongs the service life of the glue-dispensing needle.

Abstract: A precision cleaning device for cleaning and clearing a glue-dispensing needle includes a base, a supporting unit disposed on the base, a moving unit movably connected to the supporting unit, a clearing needle connected to the moving unit and facing the supporting unit, and an adjusting unit connected to the moving unit. The adjusting unit adjusts a movement of the moving unit to drive the clearing needle to move towards the glue-dispensing needle on the supporting unit, allowing the clearing needle to pass through the glue-dispensing needle to completely clean and clear the glue-dispensing needle. The cleaning device also prolongs the service life of the glue-dispensing needle.

Abstract: A lens module includes a circuit board, a carrier, and a photosensitive chip. The carrier and the photosensitive chip are arranged on a surface of the circuit board. The carrier includes a first surface arranged facing the circuit board and a second surface facing away from the circuit board. A window is defined in the carrier penetrating the first surface and the second surface. The photosensitive chip is received in the window. The carrier, the photosensitive chip, and the circuit board cooperatively form an enclosed space. An adhesive filler is arranged in the enclosed space. At least one air hole is defined in the adhesive filler. The at least one air hole communicates an inside of the enclosed space to outside the enclosed space.

Abstract: A lens module includes a circuit board, a carrier, and a photosensitive chip. The carrier and the photosensitive chip are arranged on a surface of the circuit board. The carrier includes a first surface arranged facing the circuit board and a second surface facing away from the circuit board. A window is defined in the carrier penetrating the first surface and the second surface. The photosensitive chip is received in the window. The carrier, the photosensitive chip, and the circuit board cooperatively form an enclosed space. An adhesive filler is arranged in the enclosed space. At least one air hole is defined in the adhesive filler. The at least one air hole communicates an inside of the enclosed space to outside the enclosed space.