Abstract: The disclosure is directed to a method for measuring an angle of arrival (AoA), with a steerable phased array. The method would include but not limited to: receiving a signal by the steerable phased array with a first steering angle and with a second steering angle; obtaining a first power-related information (PRI1) of the signal corresponding to the first steering angle; obtaining a second power-related information (PRI2) of the signal corresponding to the second steering angle; and calculating an AoA of the signal based on the first power-related information and the second power-related information, wherein the first steering angle is different from the second steering angle, and an absolute difference between the first steering angle and the second steering angle is less than FNBW/2.

Abstract: An optical lens adapted to receive an image beam from an imaging element is provided. The optical lens includes a first lens element, a second lens element, a third lens element, and a fourth lens element with diopter arranged along an optical axis from a light incident-side to a light exit-side. The light incident surface of the first lens element is concave. The second lens element has negative diopter, and the light exit surface of the second lens element is convex. The third lens element has positive diopter, and the light incident surface of the third lens element is convex. The fourth lens element has positive diopter, and the light incident surface of the fourth lens element is concave. The image beam forms a stop on the light exit-side, and the image beam has the smallest beam cross-sectional area at the position of the stop.

Abstract: A light-emitting element array substrate includes a temporary base, an adhesive layer, light-emitting elements and at least one support member. The temporary storage base has a first surface and a second surface opposite to each other. The adhesive layer is disposed on the first surface of the temporary storage base. The light-emitting elements are disposed on the adhesive layer. The adhesive layer is located between the light-emitting elements and the temporary storage substrate. The at least one support member is disposed on at least one of the first surface and the second surface of the temporary storage base. In addition, a method for manufacturing a light-emitting element array substrate is also provided.

Abstract: A display device includes a first substrate, a light-emitting unit disposed on the first substrate, an intermediate layer on the light-emitting unit, and a color filter layer on the intermediate layer. The intermediate layer has a first refractive index n1, the color filter layer has a second refractive index n2, and the first refractive index n1 is less than the second refractive index n2.

Abstract: In certain embodiments, an input/output (IO) device includes: an IO interface configured to operatively connect the IO device to one or more computing devices; a device unit operatively connected to the IO interface and comprising a plurality of IO components; an IO internal expansion unit operatively connected to the IO interface and the device unit; a management unit configured to provide remote management capabilities for the IO device; a power unit operatively connected to and configured to provide power for the IO interface, the device unit, the IO internal expansion unit; and the management unit; and a thermal unit configured to provide thermal management for the IO device.

Abstract: An electronic device includes a base, a covering body, a metal member and a protection device. The covering body is made of conductive material and is fixedly connected to the base. The metal member is fixedly disposed on the base. The protection device is disposed on the base and connected between the metal member and the covering body. The covering body and the base are arranged along a first axis, and when viewed along the first axis, the protection device overlaps at least a portion of the metal member.

Abstract: An electronic device includes a first substrate, a first circuit layer, a second circuit layer, a side circuit layer, a light-shielding layer, a protective layer, and a circuit board. The first substrate has a first surface, a second surface, and a side surface. The first surface is opposite to the second surface. The side surface connects the first surface and the second surface. The first circuit layer is disposed on the first surface. The second circuit layer is disposed on the second surface. The side circuit layer is disposed on the side surface and electrically connected to the first circuit layer and the second circuit layer. The light-shielding layer is disposed on the side circuit layer. The protective layer is disposed on the light-shielding layer and the second circuit layer, and continuously extends from the side surface to the second surface. The protective layer includes an opening exposing a portion of the second circuit layer.

Abstract: A display panel including a first substrate, a second substrate, a plurality of light emitting units, and a color filter layer is provided. The second substrate is disposed opposite to the first substrate. The second substrate includes a first surface and a second surface. The light emitting units are disposed on the first substrate. The color filter layer is disposed between the light emitting units and the second substrate. The color filter layer includes a black matrix, a first color resist, and a second color resist. The black matrix is disposed on the first color resist. One portion of the black matrix is disposed between the first color resist and the second color resist. The display panel provided in the disclosure is capable of reducing the reflectivity of external light or enhancing visual perception.

Abstract: A light emitting element array substrate includes a temporary storage base, light emitting elements, and adhesive structures. The light emitting elements are disposed on the temporary storage base. The adhesive structures are respectively located on the light emitting elements. Each of the adhesive structures includes a first adhesive member and a second adhesive member stacked on the first adhesive member. In addition, a manufacturing method of the light emitting element array substrate is also provided.

Abstract: A high-strength composite yarn fabric includes a plurality of first composite yarns and a plurality of second composite yarns. The first composite yarns and the second composite yarns are interwoven. Each first composite yarn has a first core layer and a first wrapping layer. The first core layer is ultra-high molecular weight polyethylene. The first wrapping layer wraps around the first core layer. T second composite yarn has a second core layer and a second wrapping layer. The second core layer is polyester fiber. The second wrapping layer wraps around the second core layer. The high-strength composite yarn fabric is knitted with the first composite yarns and the second composite yarns made of specific materials to enhance the physical strength and the durability of the high-strength composite yarn fabric.

Abstract: Provided is an antenna design solution that requires users to input only a small amount of relevant parameters, allowing the automatic generation of the antenna prototype through a generative model. The various components of the antenna prototype are then adjusted to meet the desired results through simulation and boundary adjustment procedures.

Abstract: A method for manufacturing a circuit board includes providing a composite material film including a metal film and a polymeric film, disposing a dielectric layer on the polymeric film to form a stacked structure, forming a circuit layer with a contact pad on a substrate, bonding the stacked structure onto the substrate and the circuit layer, and forming a first opening extending through the metal film to form a patterned metal film. The dielectric layer directly contacts the substrate and entirely covers the circuit layer. The method further includes plasma etching the dielectric layer with the patterned metal film as a mask to form a second opening in the dielectric layer and expose the contact pad in the second opening, removing the composite material film, and depositing a conductive material in the second opening to form a conductive blind hole electrically connected to the contact pad.

Abstract: A surgical navigation system (100) is provided. The surgical navigation system (100) includes: a head-mounted device (110), which includes a sensor module (111), a processing module (112), and a display module (113); and a plurality of visual markers (120), wherein three-dimensional position and orientation of each visual marker (120) is recognized and tracked by the sensor module (111), and then the processing module (112) calculates spatial conversion relationship between each visual marker (120) to create a local coordinate system, and then the display module (113) generates a virtual image. A method of using the surgical navigation system (100) to assist medical procedure is also provided.

Abstract: A manufacturing system includes: a body having an input section, a pressing section, and an output section, the pressing section located between the input section and the output section; an input roller assembly disposed in the input section, conveying a base film, a first hot melt adhesive film, and a second hot melt adhesive film; an ultrasonic device disposed on one side of the pressing section; a hot roller device disposed on the other side of the pressing section opposite to the ultrasonic device; an output roller disposed in the output section, outputting a waterproof film component. The base film, the first hot melt adhesive film, and the second hot melt adhesive film pass through the pressing section and are pressed by the ultrasonic device and the hot roller device to be the waterproof film component.

Abstract: Disclosed is a head-up display device which includes a projection module and an image light transmission module. The projection module includes an image light source and a projection lens. The image light source is disposed to provide an image beam. The projection lens has a lateral chromatic aberration of a projection lens. The image light transmission module includes an optical waveguide element and an optical lens and has a lateral chromatic aberration of an image light transmission. The optical waveguide element is disposed on a transmission path of the image beam from the projection lens and guides the image beam to form a display beam. The lateral chromatic aberration of the projection lens is a reverse chromatic aberration. The lateral chromatic aberration of the image light transmission module is a positive chromatic aberration. The head-up display device disclosed makes the display image have good optical quality.

Abstract: A semiconductor package structure includes a substrate, a redistribution layer, a first semiconductor die, and a first capacitor. The substrate has a wiring structure. The redistribution layer is disposed over the substrate. The first semiconductor die is disposed over the redistribution layer. The first capacitor is disposed in the substrate and is electrically coupled to the first semiconductor die. The first capacitor includes a first capacitor substrate, a plurality of first capacitor cells, and a first through via. The first capacitor substrate has a first top surface and a first bottom surface. The first capacitor cells are disposed in the first capacitor substrate. The first through via is disposed in the first capacitor substrate and electrically couples the first capacitor cells to the wiring structure on the first top surface and the first bottom surface.

Abstract: A display device includes a first pixel and a second pixel. The first pixel includes first light-emitting diodes. Each first light-emitting diode includes a first bottom semiconductor layer and a first top semiconductor layer stacked along a vertical direction. The second pixel includes second light-emitting diodes. Each second light-emitting diode includes a second bottom semiconductor layer and a second top semiconductor layer stacked along the vertical direction. In one of the first light-emitting diodes of the first pixel, a first mesa region is located in a first direction of a first overlap region, and in another of the first light-emitting diodes of the first pixel, the first mesa region is located in a second direction opposite to the first direction of the first overlap region. In each second light-emitting diode of the second pixel, a second mesa region is located in the second direction of a second overlap region.

Abstract: An electronic device is provided. The electronic device includes a semiconductor die. The semiconductor die has a first region of a first functional cell close to the peripheral edge of the semiconductor die. The semiconductor die includes a semiconductor substrate, a first signal bump, and a first power bump. The first signal bump and the first power bump are disposed on opposite surfaces of the semiconductor substrate and electrically connected to the first functional cell. The first signal bump and the first power bump both overlap the first region.

Abstract: A semiconductor package assembly is provided. The semiconductor package assembly includes first and a second semiconductor dies. The first semiconductor die has a first surface and a second surface opposite the first surface. The first semiconductor die includes a first interface and a second interface. The second interface is arranged beside the first interface. The second interface is farther from the corresponding first edge of the first semiconductor die than the first interface. The second semiconductor die is stacked on the first semiconductor die. The semiconductor package assembly further includes a first conductive bump and a second conductive bump. The first conductive bump is disposed on the first surface of the first semiconductor die. The second conductive bump is disposed on the second surface of the first semiconductor die. The second semiconductor die is electrically coupled to the first semiconductor die by the second interface.

Abstract: An electronic device including a light-emitting element, an IC chip, a substrate, an optical waveguide layer, and an optical signal outlet is provided. The IC chip is configured to control the light-emitting element to emit an optical signal. The light-emitting element is disposed on a first surface of the substrate, and the IC chip is disposed on a second surface of the substrate. The optical waveguide layer is disposed on the first surface of the substrate, and the optical waveguide layer includes a core layer, a cladding layer, and a metal layer. The metal layer is disposed on at least a portion of an interface between the core layer and the cladding layer. The optical signal outlet corresponds to the light-emitting element, and the optical signal reaches the optical signal outlet after being transmitted in the core layer.