Abstract: A method of forming films for a component includes providing a curing device. The curing device includes a receiving die defining a groove, a suction device, and a UV curing system. The suction device suctions a component suctioning the component into the groove and defining a gap between the component and the groove. A UV curing glue is injected into the gap, the UV curing glue selected from a monomer, an oligomer, and a photoinitiator. The UV curing glue is cured by the UV curing system so as to form a cured film for easy demolding.

Abstract: A method for cutting chemically strengthened glass is provided. The chemically strengthened glass includes a first stress layer, a second stress layer, and a tension layer sandwich between the first stress layer and the second stress layer. The method includes: using a green pulsed laser to cut the first stress layer, wherein the green pulsed laser includes a first green pulsed laser having femtosecond level and a second green pulsed laser having nanosecond level; using a ultraviolet pulsed laser to cut the tension layer, wherein the ultraviolet pulsed laser includes a first ultraviolet pulsed laser having femtosecond level and a second ultraviolet pulsed laser having nanosecond level; and using the green pulse layer to cut the second stress layer.