Patents by Inventor Hung-Ming Chu

Hung-Ming Chu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • INTEGRATED CIRCUIT WITH COMPACT LAYOUT ARRANGEMENT
    Publication number: 20220366116
    Abstract: An integrated circuit (IC) may include a plurality of functional blocks, and each functional block of the plurality of functional blocks may include hardware circuits, wherein the plurality of functional blocks may include a first functional block. In addition, the first functional block may include a first macro circuit that is positioned within a first sub-region of the first functional block, wherein among multiple sides of the first sub-region, a first side of the first sub-region is closest to a boundary of the first functional block. Additionally, a first intermediate sub-region of the first functional block is positioned between the first side of the first sub-region and the boundary of the first functional block, and there is no tap cell in the first intermediate sub-region of the first functional block.
    Type: Application
    Filed: February 16, 2022
    Publication date: November 17, 2022
    Applicant: MEDIATEK INC.
    Inventors: Yu-Tung Chang, Yi-Chun Tsai, Tung-Kai Tsai, Yi-Te Chiu, Shih-Yun Lin, Hung-Ming Chu, Yi-Feng Chen