Abstract: A method of fabrication of a multi-gate semiconductor device that includes providing a fin having a plurality of a first type of epitaxial layers and a plurality of a second type of epitaxial layers. The plurality of the second type of epitaxial layers is oxidized in the source/drain region. A first portion of a first layer of the second type of epitaxial layers is removed in a channel region of the fin to form an opening between a first layer of the first type of epitaxial layer and a second layer of the first type of epitaxial layer. A portion of a gate structure is then formed in the opening.

Abstract: A package structure including a photonic, an electronic die, an encapsulant and a waveguide is provided. The photonic die includes an optical coupler. The electronic die is electrically coupled to the photonic die. The encapsulant laterally encapsulates the photonic die and the electronic die. The waveguide is disposed over the encapsulant and includes an upper surface facing away from the encapsulant. The waveguide includes a first end portion and a second end portion, the first end portion is optically coupled to the optical coupler, and the second end portion has a groove on the upper surface.

Abstract: A semiconductor structure includes: an etch-stop dielectric layer overlying a substrate and including a first opening therethrough; a silicon oxide plate overlying the etch-stop dielectric layer and including a second opening therethrough; a first conductive structure including a first electrode and extending through the second opening and the first opening; a memory film contacting a top surface of the first conductive structure and including a material that provides at least two resistive states having different electrical resistivity; and a second conductive structure including a second electrode and contacting a top surface of the memory film.

Abstract: A package includes a photonic layer on a substrate, the photonic layer including a silicon waveguide coupled to a grating coupler; an interconnect structure over the photonic layer; an electronic die and a first dielectric layer over the interconnect structure, where the electronic die is connected to the interconnect structure; a first substrate bonded to the electronic die and the first dielectric layer; a socket attached to a top surface of the first substrate; and a fiber holder coupled to the first substrate through the socket, where the fiber holder includes a prism that re-orients an optical path of an optical signal.

Abstract: A microelectromechanical system (MEMS) structure and method of forming the MEMS device, including forming a first metallization structure over a complementary metal-oxide-semiconductor (CMOS) wafer, where the first metallization structure includes a first sacrificial oxide layer and a first metal contact pad. A second metallization structure is formed over a MEMS wafer, where the second metallization structure includes a second sacrificial oxide layer and a second metal contact pad. The first metallization structure and second metallization structure are then bonded together. After the first metallization structure and second metallization structure are bonded together, patterning and etching the MEMS wafer to form a MEMS element over the second sacrificial oxide layer. After the MEMS element is formed, removing the first sacrificial oxide layer and second sacrificial oxide layer to allow the MEMS element to move freely about an axis.

Abstract: A semiconductor device is provided. The semiconductor device includes a substrate, a stacked gate structure, and a wall structure. The stacked gate structure is on the substrate and extending along a first direction. The wall structure is on the substrate and laterally aside the stacked gate structure. The wall structure extends along the first direction and a second direction perpendicular to the first direction. The stacked gate structure is overlapped with the wall structure in the first direction and the second direction.

Abstract: A fast installation/removal building partition structure is applicable to an indoor or outdoor partition wall and includes a top retention member, a bottom retention member, and a plurality of form boards. The top retention member and the bottom retention member are respectively set at top side and floor of an indoor or outdoor space. The form boards each include two surface panels, which define therebetween a receiving chamber for reducing weight. The form boards each have four side edges each forming a connection section, whereby the connection sections are coupled to the top and bottom retention members through projection-and-groove engagement. The connection sections located between the form boards are coupled to each other through projection-and-groove engagement. As such, the form boards can be conveniently and efficiently installed and removed for easy transportation to achieve easy installation, construction, repeated use, and adjustment as an indoor or outdoor partition wall.

Abstract: A method for rendering an image from a light-field camera, which generates a raw light-field image, includes: generating feature data, which includes feature elements associated with position information and obtained based on the raw light-field image and a preset threshold condition; generating a raw focused image from the raw light-field image; obtaining a virtual focus position that is designated on the raw focused image; and refocusing the raw focused image according to the virtual focus position by updating pixel values of pixels of the raw focused image that correspond respectively in position to the feature elements of the feature data, so as to generate a refocused image.

Abstract: A method for rendering an image from a light-field camera, which generates a raw light-field image, includes: generating feature data, which includes feature elements associated with position information and obtained based on the raw light-field image and a preset threshold condition; generating a raw focused image from the raw light-field image; obtaining a virtual focus position that is designated on the raw focused image; and refocusing the raw focused image according to the virtual focus position by updating pixel values of pixels of the raw focused image that correspond respectively in position to the feature elements of the feature data, so as to generate a refocused image.

Abstract: A method for testing TSV structures includes providing a wafer having a front side and a back side, the wafer further comprising a plurality of TSV structures formed therein; thinning the wafer from the back side of the wafer; forming a first under bump metallization layer on the back side of the wafer blanketly; providing a probing card to the front side of the wafer to test the TSV structures; and patterning the first UBM layer.

Abstract: A method for testing TSV structures includes providing a wafer having a front side and a back side, the wafer further comprising a plurality of TSV structures formed therein; thinning the wafer from the back side of the wafer; forming a first under bump metallization layer on the back side of the wafer blanketly; providing a probing card to the front side of the wafer to test the TSV structures; and patterning the first UBM layer.

Abstract: An LED lamp includes a lamp seat and a light assembly. The lamp seat includes a heat-dispersing unit having a plurality of tubular members extending in a horizontal direction and disposed in a side-by-side manner. Each of the tubular members defines a tubular space. The light assembly includes a light module having an LED element. The light module is mounted directly or indirectly on the tubular members of the heat-dispersing unit.

Abstract: An LED lamp includes a lamp seat and a light assembly. The lamp seat includes a heat-dispersing unit having a plurality of tubular members extending in a horizontal direction and disposed in a side-by-side manner. Each of the tubular members defines a tubular space. The light assembly includes a light module having an LED element. The light module is mounted directly or indirectly on the tubular members of the heat-dispersing unit.

Abstract: The present invention relates to a ceiling loudspeaker, primarily including adjustable fixing pieces at sides of speaker housing for installing the loudspeaker on the ceiling in position. Besides, a plurality of hooks are fitted to the speaker set, and tension springs are connected to the hooks while the speaker seat is hooked by the tension springs on the spring seats of the housing. Accordingly, the ceiling loudspeaker is convenient in assembly and stable in connection.

Abstract: The present invention relates to a ceiling loudspeaker, primarily including adjustable fixing pieces at sides of speaker housing for installing the loudspeaker on the ceiling in position. Besides, a plurality of hooks are fitted to the speaker set, and tension springs are connected to the hooks while the speaker seat is hooked by the tension springs on the spring seats of the housing. Accordingly, the ceiling loudspeaker is convenient in assembly and stable in connection.