Patents by Inventor Hung Pan Kwok

Hung Pan Kwok has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070176283
    Abstract: A solderable CCM (Compact Camera Module) includes a PCB (Printed Circuit Board) with solder balls disposed on a bottom face thereof, a sensor chip mounted on a top face of the PCB, a holder mounted on the top face of the PCB and above the sensor chip, and a protecting cup assembled on the holder to protect the sensor chip from dust. Because the CCM has the solderable solder balls, the CCM can be automatically mounted on a circuit board by a SMT procedure. Thus, the extra cables or connectors can be saved, and the trend of the thinned and minimized portable mobile device can be satisfied.
    Type: Application
    Filed: October 20, 2006
    Publication date: August 2, 2007
    Inventor: Hung Pan Kwok