Patents by Inventor Hung Phi Nguyen
Hung Phi Nguyen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10209501Abstract: A three-dimensional (3D) microscope for patterned substrate measurement can include an objective lens, a reflected illuminator, a transmitted illuminator, a focusing adjustment device, an optical sensor, and a processor. The focusing adjustment device can automatically adjust the objective lens focus at a plurality of Z steps. The optical sensor can be capable of acquiring images at each of these Z steps. The processor can control the reflected illuminator, the transmitted illuminator, the focusing adjustment device, and the optical sensor. The processor can be configured to capture first and second images at multiple Z steps, the first image with the pattern using the reflected illuminator and the second image without the pattern using one of the reflected illuminator and the transmitted illuminator.Type: GrantFiled: May 9, 2016Date of Patent: February 19, 2019Assignee: KLA-Tencor CorporationInventors: Zhen Hou, James Jianguo Xu, Ken Kinsun Lee, James Nelson Stainton, Hung Phi Nguyen, Rusmin Kudinar, Ronny Soetarman
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Publication number: 20180356623Abstract: A three-dimensional (3D) microscope includes various insertable components that facilitate multiple imaging and measurement capabilities. These capabilities include Nomarski imaging, polarized light imaging, quantitative differential interference contrast (q-DIC) imaging, motorized polarized light imaging, phase-shifting interferometry (PSI), and vertical-scanning interferometry (VSI).Type: ApplicationFiled: August 7, 2018Publication date: December 13, 2018Inventors: James Jianguo Xu, Ken Kinsun Lee, Rusmin Kudinar, Ronny Soetaman, Hung Phi Nguyen, Zhen Hou
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Patent number: 10048480Abstract: A three-dimensional (3D) microscope includes various insertable components that facilitate multiple imaging and measurement capabilities. These capabilities include Nomarski imaging, polarized light imaging, quantitative differential interference contrast (q-DIC) imaging, motorized polarized light imaging, phase-shifting interferometry (PSI), and vertical-scanning interferometry (VSI).Type: GrantFiled: December 21, 2011Date of Patent: August 14, 2018Assignee: Zeta Instruments, Inc.Inventors: James Jianguo Xu, Ken Kinsun Lee, Rusmin Kudinar, Ronny Soetarman, Hung Phi Nguyen, Zhen Hou
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Publication number: 20160252714Abstract: A three-dimensional (3D) microscope for patterned substrate measurement can include an objective lens, a reflected illuminator, a transmitted illuminator, a focusing adjustment device, an optical sensor, and a processor. The focusing adjustment device can automatically adjust the objective lens focus at a plurality of Z steps. The optical sensor can be capable of acquiring images at each of these Z steps. The processor can control the reflected illuminator, the transmitted illuminator, the focusing adjustment device, and the optical sensor. The processor can be configured to capture first and second images at multiple Z steps, the first image with the pattern using the reflected illuminator and the second image without the pattern using one of the reflected illuminator and the transmitted illuminator.Type: ApplicationFiled: May 9, 2016Publication date: September 1, 2016Inventors: Zhen Hou, James Jianguo Xu, Ken Kinsun Lee, James Nelson Stainton, Hung Phi Nguyen, Rusmin Kudinar, Ronny Soetarman
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Publication number: 20160253813Abstract: A three-dimensional (3D) microscope for patterned substrate measurement can include an objective lens, a reflected illuminator, a transmitted illuminator, a focusing adjustment device, an optical sensor, and a processor. The focusing adjustment device can automatically adjust the objective lens focus at a plurality of Z steps. The optical sensor can be capable of acquiring images at each of these Z steps. The processor can control the reflected illuminator, the transmitted illuminator, the focusing adjustment device, and the optical sensor. The processor can be configured to capture first and second images at multiple Z steps, the first image with the pattern using the reflected illuminator and the second image without the pattern using one of the reflected illuminator and the transmitted illuminator.Type: ApplicationFiled: May 9, 2016Publication date: September 1, 2016Inventors: Zhen Hou, James Jianguo Xu, Ken Kinsun Lee, James Nelson Stainton, Hung Phi Nguyen, Rusmin Kudinar, Ronny Soetarman
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Patent number: 9422950Abstract: A piston-cylinder actuator includes a unique mount for an absolute-position sensor. The mount is made from a bearing material provides a flexible connection between the sensor mount and the cylinder housing. This flexible connection allows the piston rod to deflect naturally, under its own weight or under other laterally-directed forces, while maintaining the distance and perpendicularity between the sensor and the rod surface, within acceptable limits. The sensor mount is made from a bearing material that will allow it to float directly on the rod surface without scuffing or otherwise damaging the rod surface, particularly the markings or other indicia on that surface. Due to the flexible connection between the sensor mount and the cylinder housing, the proper distance between the sensor and the rod surface can be maintained at all times.Type: GrantFiled: February 21, 2012Date of Patent: August 23, 2016Assignee: Parker-Hannifin CorporationInventors: John Hartzell, James Cirillo, Dustin Hromyak, Hung phi Nguyen, David B. Crowley, Michael A. Laurich
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Publication number: 20160231148Abstract: A piston-cylinder actuator (20) includes a unique mount (36) for an absolute-position sensor (30). The mount (36) is made from a bearing material provides a flexible connection between the sensor mount (36) and the cylinder housing (40). This flexible connection allows the piston rod (32) to deflect naturally, under its own weight or under other laterally-directed forces, while maintaining the distance and perpendicularity between the sensor (30) and the rod surface (34), within acceptable limits. The sensor mount (36) is made from a bearing material that will allow it to float directly on the rod surface (34) without scuffing or otherwise damaging the rod surface (34), particularly the markings or other indicia on that surface (34). Due to the flexible connection between the sensor mount (36) and the cylinder housing (40), the proper distance between the sensor (30) and the rod surface (34) can be maintained at all times.Type: ApplicationFiled: April 13, 2016Publication date: August 11, 2016Applicant: Parker-Hannifin CorporationInventors: John Hartzell, James Cirillo, Dustin Hromyak, Hung phi Nguyen, David B. Crowley, Michael A. Laurich
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Patent number: 9389408Abstract: A three-dimensional (3D) microscope for patterned substrate measurement can include an objective lens, a reflected illuminator, a transmitted illuminator, a focusing adjustment device, an optical sensor, and a processor. The focusing adjustment device can automatically adjust the objective lens focus at a plurality of Z steps. The optical sensor can be capable of acquiring images at each of these Z steps. The processor can control the reflected illuminator, the transmitted illuminator, the focusing adjustment device, and the optical sensor. The processor can be configured to capture first and second images at multiple Z steps, the first image with the pattern using the reflected illuminator and the second image without the pattern using one of the reflected illuminator and the transmitted illuminator.Type: GrantFiled: June 29, 2011Date of Patent: July 12, 2016Assignee: Zeta Instruments, Inc.Inventors: Zhen Hou, James Jianguo Xu, Ken Kinsun Lee, James Nelson Stainton, Hung Phi Nguyen, Rusmin Kudinar, Ronny Soetarman
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Patent number: 9335207Abstract: A sensor includes an enclosure having a housing and a lower cassette that cooperate to provide a sealed volume in which an optical sensor assembly is enclosed and protected. The optical sensor assembly includes a circuit board with a light source and a light detector. The sensor assembly further includes a light pipe that guides light from the sensor onto a target and a lens guides reflected light from the target onto the light detector. Lower ends of the light pipe and the lens are supported by a recess in the lower cassette. Upper ends of the light pipe and the lens are supported by an upper cassette. The upper cassette is positively located and mounted to the circuit board and received in an internal receptacle in the lower cassette. Mounting the lower cassette to the housing encloses the optical sensor assembly in the proper alignment.Type: GrantFiled: February 21, 2012Date of Patent: May 10, 2016Assignee: Parker-Hannifin CorporationInventors: David Bina, James Cirillo, Laird Daubenspeck, Hung phi Nguyen
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Patent number: 8976366Abstract: A measurement system for monitoring an LED chip surface roughening process is described. A reflective illuminator can run reflectance measurements. A vertical positioning means can adjust a distance between an objective lens and an industrial sample. A horizontal positioning means can move objects in XY plane, and is specifically configured to hold the industrial sample and a reference sample. An optical sensor can acquire images of the industrial sample. A spectrometer can acquire reflectance spectrums of the industrial sample and the reference sample. A processor can control these components. The processor can perform deskew, and calculate an average reflectance and an oscillation amplitude from the reflectance spectrums of the industrial sample.Type: GrantFiled: June 12, 2012Date of Patent: March 10, 2015Assignee: Zeta Instruments, Inc.Inventors: James Jianguo Xu, Ken Kinsun Lee, Rusmin Kudinar, Ronny Soetarman, Hung Phi Nguyen, Zhen Hou
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Publication number: 20130341496Abstract: A sensor includes an enclosure having a housing and a lower cassette that cooperate to provide a sealed volume in which an optical sensor assembly is enclosed and protected. The optical sensor assembly includes a circuit board with a light source and a light detector. The sensor assembly further includes a light pipe that guides light from the sensor onto a target and a lens guides reflected light from the target onto the light detector. Lower ends of the light pipe and the lens are supported by a recess in the lower cassette. Upper ends of the light pipe and the lens are supported by an upper cassette. The upper cassette is positively located and mounted to the circuit board and received in an internal receptacle in the lower cassette. Mounting the lower cassette to the housing encloses the optical sensor assembly in the proper alignment.Type: ApplicationFiled: February 21, 2012Publication date: December 26, 2013Applicant: Parker-Hannifin CcorporationInventors: David Bina, James Cirillo, Laird Daubenspeck, Hung phi Nguyen
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Publication number: 20130319224Abstract: A piston-cylinder actuator includes a unique mount for an absolute-position sensor. The mount is made from a bearing material provides a flexible connection between the sensor mount and the cylinder housing. This flexible connection allows the piston rod to deflect naturally, under its own weight or under other laterally-directed forces, while maintaining the distance and perpendicularity between the sensor and the rod surface, within acceptable limits. The sensor mount is made from a bearing material that will allow it to float directly on the rod surface without scuffing or otherwise damaging the rod surface, particularly the markings or other indicia on that surface. Due to the flexible connection between the sensor mount and the cylinder housing, the proper distance between the sensor and the rod surface can be maintained at all times.Type: ApplicationFiled: February 21, 2012Publication date: December 5, 2013Applicant: PARKER-HANNIFIN CORPORATIONInventors: John Hartzell, James Cirillo, Dustin Hromyak, Hung phi Nguyen, David B. Crowley, Michael A. Laurich
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Publication number: 20120327414Abstract: A measurement system for monitoring an LED chip surface roughening process is described. A reflective illuminator can run reflectance measurements. A vertical positioning means can adjust a distance between an objective lens and an industrial sample. A horizontal positioning means can move objects in XY plane, and is specifically configured to hold the industrial sample and a reference sample. An optical sensor can acquire images of the industrial sample. A spectrometer can acquire reflectance spectrums of the industrial sample and the reference sample. A processor can control these components. The processor can perform deskew, and calculate an average reflectance and an oscillation amplitude from the reflectance spectrums of the industrial sample.Type: ApplicationFiled: June 12, 2012Publication date: December 27, 2012Applicant: Zeta Instruments, Inc.Inventors: James Jianguo Xu, Ken Kinsun Lee, Rusmin Kudinar, Ronny Soetarman, Hung Phi Nguyen, Zhen Hou
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Publication number: 20120176475Abstract: A three-dimensional (3D) microscope includes various insertable components that facilitate multiple imaging and measurement capabilities. These capabilities include Nomarski imaging, polarized light imaging, quantitative differential interference contrast (q-DIC) imaging, motorized polarized light imaging, phase-shifting interferometry (PSI), and vertical-scanning interferometry (VSI).Type: ApplicationFiled: December 21, 2011Publication date: July 12, 2012Applicant: Zeta Instruments, Inc.Inventors: James Jianguo Xu, Ken Kinsun Lee, Rusmin Kudinar, Ronny Soetarman, Hung Phi Nguyen, Zhen Hou
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Publication number: 20120019626Abstract: A three-dimensional (3D) microscope for patterned substrate measurement can include an objective lens, a reflected illuminator, a transmitted illuminator, a focusing adjustment device, an optical sensor, and a processor. The focusing adjustment device can automatically adjust the objective lens focus at a plurality of Z steps. The optical sensor can be capable of acquiring images at each of these Z steps. The processor can control the reflected illuminator, the transmitted illuminator, the focusing adjustment device, and the optical sensor. The processor can be configured to capture first and second images at multiple Z steps, the first image with the pattern using the reflected illuminator and the second image without the pattern using one of the reflected illuminator and the transmitted illuminator.Type: ApplicationFiled: June 29, 2011Publication date: January 26, 2012Applicant: Zeta Instruments, Inc.Inventors: Zhen Hou, James Jianguo Xu, Ken Kinsun Lee, James Nelson Stainton, Hung Phi Nguyen, Rusmin Kudinar, Ronny Soetarman
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Patent number: 7532318Abstract: In one embodiment, a system to measure defects on a surface of a wafer and an edge of the wafer using a single tool comprises a radial motor to move an optical head in a radial direction to detect defects at locations displaced from the edge of the wafer, and a rotational motor to rotate the optical head around the edge of the wafer to detect defects on the edge of the wafer.Type: GrantFiled: November 16, 2006Date of Patent: May 12, 2009Assignee: KLA-Tencor CorporationInventors: Steven W. Meeks, Rusmin Kudinar, William R. Wheeler, Hung Phi Nguyen, Vamsi Velidandla, Anoop Somanchi, Ronny Soetarman
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Patent number: 7161668Abstract: In one embodiment, a surface analyzer system comprises a radiation targeting assembly to target a radiation beam onto a surface; and a reflected radiation collecting assembly that collects radiation reflected from the surface, wherein the reflected radiation collecting assembly comprises a mirror to collect radiation reflected from the surface.Type: GrantFiled: August 3, 2005Date of Patent: January 9, 2007Assignee: KLA-Tencor Technologies CorporationInventors: Steven W. Meeks, Rusmin Kudinar, William R. Wheeler, Hung Phi Nguyen
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Patent number: 7161667Abstract: In one embodiment, a system to inspect the edge of a wafer, comprises an surface analyzer assembly, a first drive assembly to impart linear motion between the surface analyzer and a first surface of the wafer, and a second drive assembly to impart rotary motion between the surface analyzer and the wafer about an axis parallel to the first surface of the wafer.Type: GrantFiled: May 6, 2005Date of Patent: January 9, 2007Assignee: KLA-Tencor Technologies CorporationInventors: Steven W. Meeks, Rusmin Kudinar, William Wheeler, Hung Phi Nguyen
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Patent number: 6882437Abstract: The thickness of a wafer, substrate, or magnetic disk is measured by a shadow technique. A light source is positioned to pass a portion of light beam intensity on both sides of the wafer, substrate, or magnetic disk. A detector measures the light beam intensity after the light beam passes the wafer, substrate, or magnetic disk.Type: GrantFiled: July 29, 2002Date of Patent: April 19, 2005Assignee: KLA-Tencor TechnologiesInventors: Alireza Shahdoost Moghaddam, Hung Phi Nguyen
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Publication number: 20030197874Abstract: The thickness of a wafer, substrate, or magnetic disk is measured by a shadow technique. A light source is positioned to pass a portion of light beam intensity on both sides of the wafer, substrate, or magnetic disk. A detector measures the light beam intensity after the light beam passes the wafer, substrate, or magnetic disk.Type: ApplicationFiled: July 29, 2002Publication date: October 23, 2003Inventors: Alireza Shahdoost Moghaddam, Hung Phi Nguyen