Abstract: A semiconductor package including a ring structure with one or more indents and a method of forming are provided. The semiconductor package may include a substrate, a first package component bonded to the substrate, wherein the first package component may include a first semiconductor die, a ring structure attached to the substrate, wherein the ring structure may encircle the first package component in a top view, and a lid structure attached to the ring structure. The ring structure may include a first segment, extending along a first edge of the substrate, and a second segment, extending along a second edge of the substrate. The first segment and the second segment may meet at a first corner of the ring structure, and a first indent of the ring structure may be disposed at the first corner of the ring structure.

Abstract: The light emitting diode (LED) device includes a substrate formed with at least one electrode; an LED chip disposed on the substrate, and formed with at least one solder pad; at least one wire electrically connected between the solder pad and the electrode; and a fluorescent material layer covering the LED chip. Thermal conductivity of the substrate is 80˜120 W/mK and a color rendering index of the LED device under correlated color temperatures 2600K˜3700K is greater than 90.

Abstract: The invention provides a method for manufacturing a circuit board comprising the steps of: (a) forming a through hole in a substrate; (b) providing a photo resist to cover a predetermined area adjacent to the through hole on a first surface and a second surface opposite to the first surface of the substrate; and (c) performing an etching process to make the through hole has a shape of dumbbell.

Abstract: A size adjusting mechanism for inline roller skate includes a boot seat, and a toe cap longitudinally movably mounted above the boot seat. An engaging element is controlled by a control element to transversely slide in the boot seat. The control element has a curved inner end contacting with an end of the engaging element, and turnable about an eccentric pivot shaft. A first and a second adjusting element are respectively provided on the engaging element and below the toe cap to normally engage with each other and thereby keep the toe cap immovable on the boot seat. When the control element is turned for the engaging element to engage with a point on the curved inner end farther from the pivot shaft, the first adjusting element is disengaged from the second adjusting element, allowing the toe cap to move relative to the boot seat.

Abstract: A size adjusting mechanism for inline roller skate includes a boot seat, and a toe cap longitudinally movably mounted above the boot seat. An engaging element is controlled by a control element to transversely slide in the boot seat. The control element has a curved inner end contacting with an end of the engaging element, and turnable about an eccentric pivot shaft. A first and a second adjusting element are respectively provided on the engaging element and below the toe cap to normally engage with each other and thereby keep the toe cap immovable on the boot seat. When the control element is turned for the engaging element to engage with a point on the curved inner end farther from the pivot shaft, the first adjusting element is disengaged from the second adjusting element, allowing the toe cap to move relative to the boot seat.

Abstract: A method for controlling heat dissipation of an electronic device, such as a central processing unit, by controlling rotational speed of a fan and supplying a clock signal with slower clock frequency to the electronic device is disclosed. The fan rotates at a speed in proportion to the temperature of the electronic device when the temperature of the electronic device is below a maximum reference temperature. The fan rotates at a maximum rotational speed when the temperature of the electronic device is beyond the maximum reference temperature. The fan rotates at a maximum rotational speed and a clock signal with slower clock frequency is supplied to the electronic device when the temperature of the electronic device is beyond both the maximum reference temperature and a slowing-clock starting reference temperature, until the temperature of the electronic device drops below a slowing-clock ending reference temperature.

Abstract: A method for controlling heat dissipation of an electronic device, such as a central processing unit, by controlling rotational speed of a fan and supplying a clock signal with slower clock frequency to the electronic device is disclosed. The fan rotates at a speed in proportion to the temperature of the electronic device when the temperature of the electronic device is below a maximum reference temperature. The fan rotates at a maximum rotational speed when the temperature of the electronic device is beyond the maximum reference temperature. The fan rotates at a maximum rotational speed and a clock signal with slower clock frequency is supplied to the electronic device when the temperature of the electronic device is beyond both the maximum reference temperature and a slowing-clock starting reference temperature, until the temperature of the electronic device drops below a slowing-clock ending reference temperature.