Abstract: Various embodiments of the present disclosure are directed towards a method for forming a semiconductor structure. The method includes forming a gate dielectric structure on a substrate. A sidewall spacer is formed around the gate dielectric structure. A metal structure is formed over the gate dielectric structure. A gate body layer is formed over the metal structure. A lower portion of the gate body layer is cupped by the metal structure. A top surface of the gate body layer is vertically offset from a top surface of the metal structure. A conductive via is formed over the metal structure. The conductive via is disposed between outer sidewalls of the gate body layer.

Abstract: A semiconductor device package and a method of manufacturing a semiconductor device package are provided. The semiconductor device package includes at least one electronic component, a heat source, and a heat dissipation element. The heat source is adjacent to the electronic component. The heat dissipation element is disposed adjacent to the heat source and the electronic component. The heat dissipation element includes a heat transmitting structure configured to reduce heat, which is from the heat source, through the heat dissipation element, and transmitting in a direction toward the electronic component.

Abstract: An electrical connector includes: an insulating body defining a mating space; and a terminal module assembled to the insulating body and having a circuit board and plural mating terminals mounted on the circuit board, wherein: each of the mating terminals has a contact portion extending obliquely backward, a bending portion bent backward from a front end of the contact portion, a connecting portion extending rearward from a rear end of the bending portion, and a mounting portion vertically extending from a rear end of the connecting portion for mounting on the circuit board; and a front end of the circuit board extends forward into the mating space.

Abstract: A semiconductor package includes a first semiconductor substrate, an array of conductive bumps, a second semiconductor substrate, and a spacing pattern. The first semiconductor substrate includes a pad region and an array of first pads disposed within the pad region. The array of conductive bumps is disposed on the array of first pads respectively. The second semiconductor substrate is disposed over the first semiconductor substrate and includes an array of second pads bonded to the array of conductive bumps respectively. The spacing pattern is disposed between the first semiconductor substrate and the second semiconductor substrate, wherein the spacing pattern is located at a periphery of the pad region.

Abstract: A shell structure is for containing one of a plurality of optic-lenses with different assembling positions to respectively assemble different kinds of optic equipments. The shell structure comprises an optic-lenses assembling frame and a containing shell provided with an assembling hole. The optic-lenses assembling frame is vertically assembled into the assembling hole and comprises a frame body provided with a frame center axis and a perforating hole formed within the frame body for the optic-lens perforating through. The perforating hole provides a hole center axis deviating from the frame center axis, so that the perforating hole can rotate to different positions to be adapted for the optic-lenses with different assembling positions perforating through when the frame body rotates around the frame center axis corresponding to the assembling hole.