Abstract: An airflow guide structure and manufacture thereof is used to allow components of an airflow guide are cut by molds in a factory to form thin plates in each of which has a plurality of bendable lines, and transported into a mainframe assembly plant to store therein. Each component of the airflow guide is folded into a three-dimensional type at a production line when a mainframe wants to be assembled. Because each component of the airflow guide is a thin plate and lighter in weight, it can be stacked together with another component before a three-dimensional cover body is assembled. Therefore, the space is saved and the transportation and storage are more convenient.

Abstract: A fan control system having a temperature sensor, a temperature control module, a first logic, a second logic and a fan control circuit is provided to resolve the heat problem and the noise problem. The temperature sensor is used to detect the operation temperature of an integrated circuit, and the temperature control module receives the detected temperature to output a first logic signal. According to the first logic signal, the first logic outputs a second logic signal. One or more than one operation relationship between the fan rotation speed and operation temperature is set up in the second logic. According to the second logic signal, a curve showing the relationship between the fan rotation speed and the operation temperature is selected, and a second control signal is output. The control circuit can thus output a voltage to make the fan rotating, in responding to the second control signal.