Patents by Inventor Hung Sang Kim

Hung Sang Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • GAS FLOW FOR CONDENSATION REDUCTION WITH A SUBSTRATE PROCESSING CHUCK
    Publication number: 20190115240
    Abstract: A gas flow is described to reduce condensation with a substrate processing chuck. In one example, a workpiece holder in the chamber having a puck to carry the workpiece for fabrication processes, a top plate thermally coupled to the puck, a cooling plate fastened to and thermally coupled to the top plate, the cooling plate having a cooling channel to carry a heat transfer fluid to transfer heat from the cooling plate, a base plate fastened to the cooling plate opposite the puck, and a dry gas inlet of the base plate to supply a dry gas under pressure to a space between the base plate and the cooling plate to drive ambient air from between the base plate and the cooling plate.
    Type: Application
    Filed: December 7, 2018
    Publication date: April 18, 2019
    Inventors: Hung Sang Kim, Michael D. Willwerth
  • Mask passivation using plasma
    Patent number: 9418867
    Abstract: A gas comprising hydrogen is supplied to a plasma source. Plasma comprising hydrogen plasma particles is generated from the gas. A passivation layer is deposited on a first mask layer on a second mask layer over a substrate using the hydrogen plasma particles.
    Type: Grant
    Filed: January 10, 2014
    Date of Patent: August 16, 2016
    Assignee: Applied Materials, Inc.
    Inventors: Byungkook Kong, Hung Sang Kim, Hoon Sang Lee, Jeong Hyun Yoo, Jun-Wan Kim
  • MASK PASSIVATION USING PLASMA
    Publication number: 20150200109
    Abstract: A gas comprising hydrogen is supplied to a plasma source. Plasma comprising hydrogen plasma particles is generated from the gas. A passivation layer is deposited on a first mask layer on a second mask layer over a substrate using the hydrogen plasma particles.
    Type: Application
    Filed: January 10, 2014
    Publication date: July 16, 2015
    Inventors: Byungkook Kong, Hung Sang Kim, Hoon Sang Lee, Jeong Hyun Yoo, Jun-Wan Kim