Patents by Inventor Hung-Sen KUO

Hung-Sen KUO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Test methods for packaged integrated circuits
    Patent number: 10859630
    Abstract: A circuit test method for a test device to test a device under test is provided. The circuit test method includes the steps of applying zero volts to a plurality of power pins of the device under test; applying a test voltage to a first signal pin among a plurality of signal pins of the device under test; and measuring a current on a second signal pin among the plurality of signal pins of the device under test and determining whether there is a leakage current in the device under test.
    Type: Grant
    Filed: November 15, 2017
    Date of Patent: December 8, 2020
    Assignee: SILICON MOTION, INC.
    Inventors: Hung-Sen Kuo, Te-Wei Chen, Hung-Sheng Chang, Ming-Wan Kuan
  • CIRCUIT TEST METHODS
    Publication number: 20180259580
    Abstract: A circuit test method for a test device to test a device under test is provided. The circuit test method includes the steps of applying zero volts to a plurality of power pins of the device under test; applying a test voltage to a first signal pin among a plurality of signal pins of the device under test; and measuring a current on a second signal pin among the plurality of signal pins of the device under test and determining whether there is a leakage current in the device under test.
    Type: Application
    Filed: November 15, 2017
    Publication date: September 13, 2018
    Inventors: Hung-Sen KUO, Te-Wei CHEN, Hung-Sheng CHANG, Ming-Wan KUAN