Patents by Inventor HUNG-SHENG HAN

HUNG-SHENG HAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Radiative cooling substrate and manufacturing method of the same
    Patent number: 11078593
    Abstract: A radiative cooling substrate and a manufacturing method of the radiative cooling substrate are provided. The radiative cooling substrate includes a metallic substrate and a chitosan layer disposed on the metallic substrate with a thickness of 0.5 ?m to 10 ?m. The chitosan layer emits radiation within a waveband between 8 ?m and 13 ?m.
    Type: Grant
    Filed: February 22, 2019
    Date of Patent: August 3, 2021
    Assignee: National Tsing Hua University
    Inventors: Yu-Bin Chen, Hung-Sheng Han
  • RADIATIVE COOLING SUBSTRATE AND MANUFACTURING METHOD OF THE SAME
    Publication number: 20200131660
    Abstract: A radiative cooling substrate and a manufacturing method of the radiative cooling substrate are provided. The radiative cooling substrate includes a metallic substrate and a chitosan layer disposed on the metallic substrate with a thickness of 0.5 ?m to 10 ?m. The chitosan layer emits radiation within a waveband between 8 ?m and 13 ?m.
    Type: Application
    Filed: February 22, 2019
    Publication date: April 30, 2020
    Inventors: YU-BIN CHEN, HUNG-SHENG HAN