Patents by Inventor Hung-Sub Song

Hung-Sub Song has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6863707
    Abstract: Disclosed is a method of forming a W—Cu composite powder having a Cu particle surrounded by tungsten by mixing and pulverizing tungsten oxide powder and copper oxide powder using turbular mixing or ball milling, reducing the Cu powder firstly at 200˜400° C. under a hydrogen atmosphere or a reducing gas environment including hydrogen, generating W nuclei on the reduced Cu powder at 500˜700° C., and growing the generated W nuclei at 750˜1080° C. as well as a use of the same for the use of powder injection molding.
    Type: Grant
    Filed: May 6, 2003
    Date of Patent: March 8, 2005
    Assignee: Agency for Defense Development
    Inventors: Seong Lee, Moon-Hee Hong, Joon-Woong Noh, Eun-Pyo Kim, Hung-Sub Song, Woon-Hyung Baek
  • Publication number: 20030205108
    Abstract: Disclosed is a method of forming a W—Cu composite powder having a Cu particle surrounded by tungsten by mixing and pulverizing tungsten oxide powder and copper oxide powder using turbular mixing or ball milling, reducing the Cu powder firstly at 200˜400° C. under a hydrogen atmosphere or a reducing gas environment including hydrogen, generating W nuclei on the reduced Cu powder at 500˜700° C., and growing the generated W nuclei at 750˜1080° C. as well as a use of the same for the use of powder injection molding.
    Type: Application
    Filed: May 6, 2003
    Publication date: November 6, 2003
    Applicant: Agency for Defense Development
    Inventors: Seong Lee, Moon-Hee Hong, Joon-Woong Noh, Eun-Pyo Kim, Hung-Sub Song, Woon-Hyung Baek