Patents by Inventor Hung-Tai Ting

Hung-Tai Ting has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Manufacturing method for forming substrate structure comprising vias
    Patent number: 10306767
    Abstract: A manufacturing method of a substrate structure including vias includes the following steps. A substrate is provided, wherein a material of the substrate includes polyimide. An etching stop layer is formed on the substrate, wherein the etching stop layer covers two opposite surfaces of the substrate. A patterned process is performed on the etching stop layer to form a plurality of openings exposing a part of the substrate. An etching process is performed on the substrate to remove the part of the substrate exposed by the openings and form a plurality of vias.
    Type: Grant
    Filed: December 7, 2017
    Date of Patent: May 28, 2019
    Assignee: UNIFLEX Technology Inc.
    Inventors: Yi-Chun Liu, Yuan-Chih Lee, Hung-Tai Ting
  • MANUFACTURING METHOD FOR FORMING SUBSTRATE STRUCTURE COMPRISING VIAS
    Publication number: 20190008049
    Abstract: A manufacturing method of a substrate structure including vias includes the following steps. A substrate is provided, wherein a material of the substrate includes polyimide. An etching stop layer is formed on the substrate, wherein the etching stop layer covers two opposite surfaces of the substrate. A patterned process is performed on the etching stop layer to form a plurality of openings exposing a part of the substrate. An etching process is performed on the substrate to remove the part of the substrate exposed by the openings and form a plurality of vias.
    Type: Application
    Filed: December 7, 2017
    Publication date: January 3, 2019
    Applicant: UNIFLEX Technology Inc.
    Inventors: Yi-Chun Liu, Yuan-Chih Lee, Hung-Tai Ting