Abstract: A light metal joint filler is provided. The light metal joint filler is formed by uniformly mixing a solvent with a light metal powder and a silver powder, where a powder particle size of the light metal powder is on a micron scale, and a powder particle size of the silver powder is on a nanometer scale or a submicron scale. A metal joining method of the present disclosure includes: coating a joint of two to-be-joined light metal pieces with the light metal joint filler; and hot pressing the two to-be-joined light metal pieces, so that the silver powder is sintered and bonded with the light metal powder and surfaces of the two to-be-joined light metal pieces, and completing joining of the two to-be-joined light metal pieces after the silver powder is condensed.

Abstract: A light metal joint filler is provided. The light metal joint filler is formed by uniformly mixing a solvent with a light metal powder and a silver powder, where a powder particle size of the light metal powder is on a micron scale, and a powder particle size of the silver powder is on a nanometer scale or a submicron scale. A metal joining method of the present disclosure includes: coating a joint of two to-be-joined light metal pieces with the light metal joint filler; and hot pressing the two to-be-joined light metal pieces, so that the silver powder is sintered and bonded with the light metal powder and surfaces of the two to-be-joined light metal pieces, and completing joining of the two to-be-joined light metal pieces after the silver powder is condensed.

Abstract: A method of fabricating a conductive thin film includes the following steps: forming a polymer fiber made of a polymer and a metal precursor distributed in a surface layer near the surface of the polymer fiber; and applying a plasma treatment on the polymer fiber to concurrently etch the polymer and reduce the metal precursor in the surface layer of the polymer fiber. When the plasma treatment is completed, a metal membrane is formed on the surface of the polymer fiber.

Abstract: A method for forming a flexible transparent conductive film includes steps of: (a) electrospinning a first solution, which contains a polymer, a solvent and a metal ion-containing precursor, to form an polymeric fiber onto a soluble substrate; (b) providing energy to reduce the metal ion-containing precursor of the polymeric fiber, so as to form metal seeds on the polymeric fiber; and (c) placing the polymeric fiber together with the soluble substrate into a second solution, such that the soluble substrate dissolves in the second solution to form an electroless-plating bath and such that the polymeric fiber is subjected to electroless plating to form a metal coating from the metal seeds.

Abstract: A method for forming a flexible transparent conductive film includes steps of: (a) electrospinning a first solution, which contains a polymer, a solvent and a metal ion-containing precursor, to form an polymeric fiber onto a soluble substrate; (b) providing energy to reduce the metal ion-containing precursor of the polymeric fiber, so as to form metal seeds on the polymeric fiber; and (c) placing the polymeric fiber together with the soluble substrate into a second solution, such that the soluble substrate dissolves in the second solution to form an electroless-plating bath and such that the polymeric fiber is subjected to electroless plating to form a metal coating from the metal seeds.