Abstract: A layout method for electronic components of a double-sided surface mount circuit board is presented, which includes the following steps. At least one first electronic component is fixed on a first side surface of a circuit board through a reflow soldering process. At least one second electronic component is inserted on the first side surface of the circuit board. The other first electronic component is placed on a second side surface of the circuit board, and the other second electronic component is inserted on the second side surface of the circuit board. Finally, a reflow soldering process is performed on the circuit board disposed with the first electronic components and the second electronic components, thereby completing a layout process for the electronic components on the two side surfaces of the circuit board at the same time.

Abstract: A pad layout method for surface mount circuit board and a surface mount circuit board are described. The layout method includes the following steps. Firstly, coefficients of thermal expansion of a circuit board and a surface mounted component are obtained, and the circuit board is supplied with a plurality of predetermined layout positions in advance. Then, an operating temperature for combining the surface mounted component with the circuit board is determined, and a room temperature is measured. A plurality of actual layout positions on the circuit board is determined according to d=(CTEa?CTEb)×(Ts?Tr), where d is an offset distance between the actual layout position and the predetermined layout position. Finally, a plurality of pads is laid out on the actual layout positions, such that the pads are formed on the circuit board.

Abstract: A layout method for electronic components of a double-sided surface mount circuit board is presented, which includes the following steps. At least one first electronic component is fixed on a first side surface of a circuit board through a reflow soldering process. At least one second electronic component is inserted on the first side surface of the circuit board. The other first electronic component is placed on a second side surface of the circuit board, and the other second electronic component is inserted on the second side surface of the circuit board. Finally, a reflow soldering process is performed on the circuit board disposed with the first electronic components and the second electronic components, thereby completing a layout process for the electronic components on the two side surfaces of the circuit board at the same time.

Abstract: A pad layout method for surface mount circuit board and a surface mount circuit board are described. The layout method includes the following steps. Firstly, coefficients of thermal expansion of a circuit board and a surface mounted component are obtained, and the circuit board is supplied with a plurality of predetermined layout positions in advance. Then, an operating temperature for combining the surface mounted component with the circuit board is determined, and a room temperature is measured. A plurality of actual layout positions on the circuit board is determined according to d=(CTEa?CTEb)×(Ts?Tr), where d is an offset distance between the actual layout position and the predetermined layout position. Finally, a plurality of pads is laid out on the actual layout positions, such that the pads are formed on the circuit board.

Abstract: A method for soldering electronic components of a circuit board and a circuit board structure thereof are presented. The method includes providing a circuit board first; disposing at least one solder hole and at least one heat collecting hole on the circuit board, in which the heat collecting hole is disposed around the solder hole to form a heat collecting area; extending a pin of an electronic component into the solder hole; filling a solder within the solder hole through a soldering process; and keeping heat of the solder in the heat collecting area by the heat collecting hole. Thus, the pin of the electronic component within the solder hole is successfully combined with the solder.