Patents by Inventor Hung-Ti Li

Hung-Ti Li has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Infrared imaging sensor and vacuum packaging method thereof
    Publication number: 20060219924
    Abstract: An infrared imaging sensor and a vacuum packaging method thereof are described. The infrared imaging sensor includes a ceramic base, a metal cap and an infrared filter. The ceramic base has an infrared imaging chip attached thereon and the metal cap includes a getter deposited on an inner surface of the metal cap. The infrared filter seals an opening of the metal cap. The ceramic base, the metal cap and the infrared filter are heated in a vacuum chamber to activate the getter, and to solder the ceramic base, the metal cap and the infrared filter together thereby vacuum packaging the infrared imaging sensor.
    Type: Application
    Filed: May 26, 2005
    Publication date: October 5, 2006
    Inventors: Tzong-Sheng Lee, Ping-Wei Lin, Hsiang-Fu Chen, Hung-Ti Li, Jeng-Long Ou