Abstract: A control method for bidirectional DC-DC converter includes: operating a bidirectional DC-DC converter having a low voltage side including a plurality of low-voltage-side switches, a voltage clamping switch and a voltage clamping capacitor, and a high voltage side including a plurality of high-voltage-side switches in a boost mode; switching the voltage clamping switch with a predetermined duty cycle prior to switching on all of the low-voltage-side switches; adjusting the predetermined duty cycle of the voltage clamping switch to be smaller than a turn-off interval of the low-voltage-side switches to reduce the conduction loss of the low-voltage-side switches and the voltage clamping switch; alternatively, operating the DC-DC converter in a buck mode; and adjusting and extending the duty cycle of the low-voltage-side switches to overlap a turn-off time of the high-voltage-side switches to reduce the conduction loss of the low-voltage-side switches.

Abstract: A portable electronic device including a main body and a connecting port is provided. The main body has an containing cavity. The connecting port includes a base and at least one movable component. The base is disposed at the main body. The movable component is movably connected to the base and moves between an accommodated position and an operation position relatively to the base. When the movable component is located at the accommodated position, the height of the connecting port is less than or equal to the height of the containing cavity such that the connecting port is adapted to be accommodated in the containing cavity. When the movable component is located at the operation position, the height of the connecting port is greater than the height of the containing cavity, and a connector is adapted to be fixed between the base and the movable component.

Abstract: A control method for bidirectional DC-DC converter includes: operating a bidirectional DC-DC converter in a boost mode, the bidirectional DC-DC converter including a low voltage side and a high voltage side, the low voltage side including low-voltage-side switches, a voltage clamping switch and a voltage clamping capacitor and the high voltage side including high-voltage-side switches; switching the voltage clamping switch with a predetermined duty cycle prior to switching on all of the low-voltage-side switches; adjusting the duty cycle of the voltage clamping switch being smaller than a turn-off interval of the low-voltage-side switches to reduce the conduction loss of the low-voltage-side switches and the voltage clamping switch; alternatively, operating the DC-DC converter in a buck mode; adjusting and extending the duty cycle of the low-voltage-side switches to overlap a turn-off time of the high-voltage-side switches so as to reduce the conduction loss of the low-voltage-side switches.

Abstract: A power connector suitable for being mounted on a circuit board includes an insulating housing and a center terminal. The insulating housing has a plug hole. The center terminal has a center fixing portion, a center contact portion and a center soldering portion. The center fixing portion is fixed into the insulating housing, the center contact portion extends into the plug hole, and the center soldering portion is suitable for passing through a center soldering hole of the circuit board to be soldered to the circuit board. The center soldering portion has a waist segment and a tail segment extending from the waist segment, the waist segment is located inside the center soldering hole, and the minimum transection area of the waist segment is less than the maximum transection area of the tail segment. A center terminal suitable for being utilized in a power connector is also provided.

Abstract: An electrical connector includes a first terminal and a second terminal. The second terminal is fixed at the first terminal and enclosed by the first terminal, in which the second terminal includes a tube-shaped structure, the tube-shaped structure has a clipping portion and two end-surfaces, the two end-surfaces lean against each other to form a seam. The inner diameter of the clipping portion is smaller than the inner diameters of other portions of the tube-shaped structure. When a third terminal of a coupling connector is inserted into the tube-shaped structure to make the tube-shaped structure elastically deformed, the two end-surfaces are separated from each other and the clipping portion clips the third terminal.

Abstract: A portable electronic device including a main body and a connecting port is provided. The main body has an containing cavity. The connecting port includes a base and at least one movable component. The base is disposed at the main body. The movable component is movably connected to the base and moves between an accommodated position and an operation position relatively to the base. When the movable component is located at the accommodated position, the height of the connecting port is less than or equal to the height of the containing cavity such that the connecting port is adapted to be accommodated in the containing cavity. When the movable component is located at the operation position, the height of the connecting port is greater than the height of the containing cavity, and a connector is adapted to be fixed between the base and the movable component.

Abstract: A portable electronic device including a main body and a connection port is provided. The main body has a containing cavity. The connection port includes a supporting component and a connector. The supporting component is slidably disposed at the main body along a sliding direction and slides between an accommodating position and an operation position relative to the main body. The connector is disposed on the supporting component and has a plugging direction. When the supporting component is located at the accommodating position, the connector is contained in the containing cavity and the plugging direction is perpendicular to the sliding direction. When the supporting component is located at the operation position, the connector is located out of the containing cavity, and the supporting component has a tilting angle relative to the main body.

Abstract: This invention provides a detecting device and a method for a passive optical network (PON), which includes: a laser device; a detector coupled to the laser device and generating an output signal at one of a first level when the laser device emits light and a second level when the laser device does not emit light; and a processor repeatedly detecting the output signal in a fixed period, and simultaneously counting a total number of changes that the output signal changes from the first level to the second level and the output signal changes from the second level to the first level so as to detect whether a light leakage occurs in the PON.

Abstract: A non-contact laser carving process and the equipment. By the orientation of an orienting module, the center of a wafer can be amended and oriented to the orienting module precisely. By the rotation of the orienting module and an optical sensor of a transmission mechanical module, the center of the wafer can be obtained precisely. By the compensation of the optical sensor, a specific boundary position is oriented. No matter what the external diameter of the wafer is, the specific boundary position in the wafer can be carved by laser precisely through the transmission mechanical module cooperated with a laser-carving unit, and a specific number can be carved at the specific boundary position of each wafer. Therefore, the wafer can be efficiently traced and controlled, and the amount of the wafer can be figured out easily to raise the quality of the wafer.

Abstract: A tunable optical add-drop multiplexer (OADM) based on an SOI (silicon-on-insulator) wafer is disclosed. The tunable OADM includes a multimode interference region, at least a grating formed on the multimode interference region, and at least two electrodes formed on two sides of the multimode interference region and having carriers induced thereinto, thereby a variation of an optical waveguide in the grating is controlled through controlling the carriers induced into the electrodes so as to further control different propagation of wavelength signals.

Abstract: An optical transceiver module comprises a circuit structure, an optical fiber, a fixture, an optical transceiver and a cover. The optical fiber transmits optical signal. The fixture partially or completely covers the optical fiber, wherein optical signals are transmitted in the optical fiber. The optical transceiver is coupled to the fixture and connected to the circuit structure, and is for receiving/transmitting the optical signals. The cover is connecting one end of the optical fiber to the optical transceiver.

Abstract: An optical transceiver module comprises a circuit structure, an optical fiber, a fixture, an optical transceiver and a cover. The optical fiber transmits optical signal. The fixture partially or completely covers the optical fiber, wherein optical signals are transmitted in the optical fiber. The optical transceiver is coupled to the fixture and connected to the circuit structure, and is for receiving/transmitting the optical signals. The cover is connecting one end of the optical fiber to the optical transceiver.

Abstract: A reproduction method for reproducing BCA data for optical discs using the defect signal. The reproduction method for reproducing BCA data includes the steps of: generating a defect signal as a BCA signal by detecting an RF signal of the BCA; generating a BCA data bit stream by sampling the BCA signal according to a sampling clock; and decoding the BCA data bit stream to generate BCA data. Because the defect signal is utilized as the BCA signal of the invention, no additional BCA signal extracting device is needed.

Abstract: A deposition method for filling recesses in a substrate is described. In the method, the substrate is exposed to an energized deposition gas comprising first and second components, to deposit a first layer of a material in the recess, and thereafter, the ratio of the first component to the second component is reduced, to deposit a second layer of the material over the first layer in the recess. The deposition method may be used to fill recesses in a substrate and smoothen out reentrant cavities in a silicon nitride liner, in the fabrication of polysilicon gates in a substrate.

Abstract: A tunable optical add-drop multiplexer (OADM) based on an SOI (silicon-on-insulator) wafer is disclosed. The tunable OADM includes a multimode interference region, at least a grating formed on the multimode interference region, and at least two electrodes formed on two sides of the multimode interference region and having carriers induced thereinto, thereby a variation of an optical waveguide in the grating is controlled through controlling the carriers induced into the electrodes so as to further control different propagation of wavelength signals.

Abstract: A reproduction method for reproducing BCA data for optical discs using the defect signal. The reproduction method for reproducing BCA data includes the steps of: generating a defect signal as a BCA signal by detecting an RF signal of the BCA; generating a BCA data bit stream by sampling the BCA signal according to a sampling clock; and decoding the BCA data bit stream to generate BCA data. Because the defect signal is utilized as the BCA signal of the invention, no additional BCA signal extracting device is needed.

Abstract: In a method of filling a trench in a substrate, a substrate is placed in a process zone, the substrate comprising a trench. A first deposition process is performed by providing a first gas into the process zone, maintaining first process conditions to deposit a first silicon oxide material in the trench in the substrate, and exhausting the first gas. Thereafter, a second deposition process is performed by providing a second gas into the process zone, maintaining second process conditions to deposit a second silicon oxide material to fill the trench and optionally overfill the trench, and exhausting the second gas. The multiple process deposition process allows the trench to be filled and overfilled with different types of silicon oxide materials to render the trench filling process more economical.

Abstract: In a method of filling a trench in a substrate, a substrate is placed in a process zone, the substrate comprising a trench. A first deposition process is performed by providing a first gas into the process zone, maintaining first process conditions to deposit a first silicon oxide material in the trench in the substrate, and exhausting the first gas. Thereafter, a second deposition process is performed by providing a second gas into the process zone, maintaining second process conditions to deposit a second silicon oxide material to fill the trench and optionally overfill the trench, and exhausting the second gas. The multiple process deposition process allows the trench to be filled and overfilled with different types of silicon oxide materials to render the trench filling process more economical.

Abstract: A deposition method for filling recesses in a substrate is described. In the method, the substrate is exposed to an energized deposition gas comprising first and second components, to deposit a first layer of a material in the recess, and thereafter, the ratio of the first component to the second component is reduced, to deposit a second layer of the material over the first layer in the recess. The deposition method may be used to fill recesses in a substrate and smoothen out reentrant cavities in a silicon nitride liner, in the fabrication of polysilicon gates in a substrate.

Abstract: A pair of pliers has a driving handle, a fixed handle, a block plate, a U-shaped spring, a first torsion spring, and a second torsion spring. The driving handle couples with the fixed handle pivotally. The first torsion spring and the second torsion spring are connected to the driving handle and the fixed handle. The U-shaped spring is connected to the driving handle and the fixed handle.