Abstract: The present invention relates to an ethylene disposal apparatus comprising: a plasma discharge part having an inlet and an outlet and being filled with an adsorbent; and an electrode part for generating plasma inside the plasma discharge part, wherein the adsorbent has a catalyst supported thereon. The present invention relates to an ethylene disposal method using the ethylene disposal apparatus, the method comprising the steps of: (a) injecting ethylene-containing gas into a plasma discharge part filled with the adsorbent; (b) applying voltage to the electrode part and generating plasma in the plasma discharge part, thereby degrading the injected ethylene; and (c) cooling the plasma discharge part.

Abstract: The present invention relates to an ethylene disposal apparatus comprising: a plasma discharge part having an inlet and an outlet and being filled with an adsorbent; and an electrode part for generating plasma inside the plasma discharge part, wherein the adsorbent has a catalyst supported thereon. The present invention relates to an ethylene disposal method using the ethylene disposal apparatus, the method comprising the steps of: (a) injecting ethylene-containing gas into a plasma discharge part filled with the adsorbent; (b) applying voltage to the electrode part and generating plasma in the plasma discharge part, thereby degrading the injected ethylene; and (c) cooling the plasma discharge part.

Abstract: A monolithic or essentially monolithic single layer capacitor with high structural strength and capacitance, a printed circuit board having the capacitor mounted thereon, and a method of making. Sheets of green-state ceramic dielectric material and glass/metal composite material are laminated together, diced into individual chips, and fired to sinter the glass and the ceramic together. The composite material contains an amount of metal sufficient to render the composite conductive whereby the composite may be used for one or both electrodes and for mounting the capacitor to the printed circuit board. Vertically-oriented surface mountable capacitors and hybrid capacitors are provided.

Abstract: A monolithic or essentially monolithic single layer capacitor with high structural strength and capacitance, a printed circuit board having the capacitor mounted thereon, and a method of making. Sheets of green-state ceramic dielectric material and glass/metal composite material are laminated together, diced into individual chips, and fired to sinter the glass and the ceramic together. The composite material contains an amount of metal sufficient to render the composite conductive whereby the composite may be used for one or both electrodes and for mounting the capacitor to the printed circuit board. Vertically-oriented surface mountable capacitors and hybrid capacitors are provided.

Abstract: A method of making a monolithic or essentially monolithic single layer capacitor with high structural strength and capacitance. Sheets of green-state ceramic dielectric material and ceramic/metal composite material are laminated together, diced into individual chips, and fired to sinter the ceramic together. The composite material may contain an amount of metal sufficient to render the composite conductive whereby the composite may be used for one or both electrodes and for mounting the capacitor to the pc board. Alternatively, the composite material may contain an amount of metal insufficient to render the composite conductive but sufficient to act as seed points for an electroplating process wherein the composite is preferentially coated with conductive metal, and the coated composite is mounted to the pc board and the coating provides an electrical connection to an internal electrode. Vertically-oriented surface mountable capacitors and hybrid capacitors are provided.

Abstract: A monolithic or essentially monolithic single layer capacitor with high structural strength and capacitance, a printed circuit board having the capacitor mounted thereon, and a method of making. Sheets of green-state ceramic dielectric material and glass/metal composite material are laminated together, diced into individual chips, and fired to sinter the glass and the ceramic together. The composite material contains an amount of metal sufficient to render the composite conductive whereby the composite may be used for one or both electrodes and for mounting the capacitor to the printed circuit board. Vertically-oriented surface mountable capacitors and hybrid capacitors are provided.

Abstract: A method of making a monolithic or essentially monolithic single layer capacitor with high structural strength and capacitance. Sheets of green-state ceramic dielectric material and ceramic/metal composite material are laminated together, diced into individual chips, and fired to sinter the ceramic together. The composite material may contain an amount of metal sufficient to render the composite conductive whereby the composite may be used for one or both electrodes and for mounting the capacitor to the pc board. Alternatively, the composite material may contain an amount of metal insufficient to render the composite conductive but sufficient to act as seed points for an electroplating process wherein the composite is preferentially coated with conductive metal, and the coated composite is mounted to the pc board and the coating provides an electrical connection to an internal electrode. Vertically-oriented surface mountable capacitors and hybrid capacitors are provided.

Abstract: A monolithic or essentially monolithic single layer capacitor with high structural strength and capacitance. Sheets of green-state ceramic dielectric material and ceramic/metal composite material are laminated together, diced into individual chips, and fired to sinter the ceramic together. The composite material contains an amount of metal sufficient to render the composite conductive whereby the composite may be used for one or both electrodes and for mounting the capacitor to the pc board. Vertically-oriented surface mountable capacitors and hybrid capacitors are provided.

Abstract: A capacitor including at least one interior metallization plane or plate and a multiplicity of vias for forming multiple redundant electrical connections within the capacitor. Series capacitors are provided having at least two interior plates redundantly electrically connected to at least two respective exterior plates. R-C devices are provided having multiple redundant vias filled with resistor material and/or conductor material to provide a resistor either in series with or parallel to a capacitor. Capacitors and R-C devices are provided having end terminations for applying voltage differential. Further, a method for making single capacitors, multiple parallel array capacitors, series capacitors and R-C devices is provided in which the chips are formed from the bottom up.

Abstract: A capacitor including at least one interior metallization plane or plate and a multiplicity of vias for forming multiple redundant electrical connections within the capacitor. Series capacitors are provided having at least two interior plates redundantly electrically connected to at least two respective exterior plates. R-C devices are provided having multiple redundant vias filled with resistor material and/or conductor material to provide a resistor either in series with or parallel to a capacitor. Capacitors and R-C devices are provided having end terminations for applying voltage differential. Further, a method for making single capacitors, multiple parallel array capacitors, series capacitors and R-C devices is provided in which the chips are formed from the bottom up.

Abstract: A monolithic or essentially monolithic single layer capacitor with high structural strength and capacitance that may be easily and inexpensively manufactured. To this end, sheets of green-state ceramic dielectric material and ceramic/metal composite material are laminated together, diced into individual chips, and fired to sinter the ceramic together. The composite material may comprise an amount of metal sufficient to render the composite conductive whereby the composite may be used for one or both electrodes and for mounting the capacitor to the pc board. Alternatively, the composite material may comprise an amount of metal insufficient to render the composite conductive but sufficient to act as seed points for an electroplating process wherein the composite is preferentially coated with conductive metal, and the coated composite is mounted to the pc board and the coating provides an electrical connection to an internal electrode.

Abstract: A monolithic or essentially monolithic single layer capacitor with high structural strength and capacitance. Sheets of green-state ceramic dielectric material and ceramic/metal composite material are laminated together, diced into individual chips, and fired to sinter the ceramic together. The composite material may contain an amount of metal sufficient to render the composite conductive whereby the composite may be used for one or both electrodes and for mounting the capacitor. Alternatively, the composite material may contain an amount of metal insufficient to render the composite conductive but sufficient to act as seed points for an electroplating process wherein the composite is preferentially coated with conductive metal, the coated composite is mounted, and the coating provides an electrical connection to an internal electrode. Vertically-oriented surface mountable capacitors and hybrid capacitors are provided.

Abstract: A feed-through capacitor has layers of dielectric material and a first hole that passes through the layers of dielectric material for receiving an electrical conductor connected to the filter capacitor. First, second and third electrodes are disposed between layers of the dielectric material and extend in a first direction substantially perpendicular to a centerline of the first hole. The third electrodes are disposed intermediate the first and second electrodes. Any one of the first, second and third electrodes is non-overlapping with any of another of the first, second and third electrodes in a direction substantially parallel to the centerline of the first hole. A filtering capacitor is formed substantially wholly by fringe-effect capacitance between the first and third electrodes, and a coupling capacitor is formed substantially wholly by fringe-effect capacitance between the second and third electrodes. The filtering and coupling are electrically connected in series.

Abstract: A capacitor including at least one interior metallization plane or plate and a multiplicity of vias for forming multiple redundant electrical connections within the capacitor. Series capacitors are provided having at least two interior plates redundantly electrically connected to at least two respective exterior plates. R-C devices are provided having multiple redundant vias filled with resistor material and/or conductor material to provide a resistor either in series with or parallel to a capacitor. Capacitors and R-C devices are provided having end terminations for applying voltage differential. Further, a method for making single capacitors, multiple parallel array capacitors, series capacitors and R-C devices is provided in which the chips are formed from the bottom up.

Abstract: A capacitor including at least one interior metallization plane or plate and a multiplicity of vias for forming multiple redundant electrical connections within the capacitor. Series capacitors are provided having at least two interior plates redundantly electrically connected to at least two respective exterior plates. R-C devices are provided having multiple redundant vias filled with resistor material and/or conductor material to provide a resistor either in series with or parallel to a capacitor. Capacitors and R-C devices are provided having end terminations for applying voltage differential. Further, a method for making single capacitors, multiple parallel array capacitors, series capacitors and R-C devices is provided in which the chips are formed from the bottom up.

Abstract: The size and placement of internal metallization areas as do collectively form each of two electrodes is improved in a typically discoidal feed-through ceramic filter capacitor having (i) multiple ceramic layers, (ii) a hole passing a wire that carries electrical signals which are to be filtered, (iii) metal lining the hole so as to make electrical contact with the wire, and (iv) an exterior metal band connected to ground. First internal metallization areas, each in the shape of a relatively smaller small-aperture disk, are centered about the body's hole in contact with the metal lining, each area being upon one of the body's multiple ceramic layers, the areas collectively serving as a first electrode of the capacitor.

Abstract: A capacitor including at least one interior metallization plane or plate and a multiplicity of vias for forming multiple redundant electrical connections within the capacitor. Series capacitors are provided having at least two interior plates redundantly electrically connected to at least two respective exterior plates. R-C devices are provided having multiple redundant vias filled with resistor material and/or conductor material to provide a resistor either in series with or parallel to a capacitor. Capacitors and R-C devices are provided having end terminations for applying voltage differential. Further, a method for making single capacitors, multiple parallel array capacitors, series capacitors and R-C devices is provided in which the chips are formed from the bottom up.

Abstract: A feed-through capacitor has layers of dielectric material and a first hole that passes through the layers of dielectric material for receiving an electrical conductor connected to the filter capacitor. First, second and third electrodes are disposed between layers of the dielectric material and extend in a first direction substantially perpendicular to a centerline of the first hole. The third electrodes are disposed intermediate the first and second electrodes Any one of the first, second and third electrodes is non-overlapping with any of another of the first, second and third electrodes in a direction substantially parallel to the centerline of the first hole. A filtering capacitor is formed substantially wholly by fringe-effect capacitance between the first and third electrodes, and a coupling capacitor is formed substantially wholly by fringe-effect capacitance between the second and third electrodes The filtering and coupling are electrically connected in series.

Abstract: The size and placement of internal metallization areas as do collectively form each of two electrodes is improved in a typically discoidal feed-through ceramic filter capacitor having (i) multiple ceramic layers, (ii) a hole passing a wire that carries electrical signals which are to be filtered, (iii) metal lining the hole so as to make electrical contact with the wire, and (iv) an exterior metal band connected to ground. First internal metallization areas, each in the shape of a relatively smaller small-aperture disk, are centered about the body's hole in contact with the metal lining, each area being upon one of the body's multiple ceramic layers, the areas collectively serving as a first electrode of the capacitor.

Abstract: A ceramic electrical device or component, normally a barium titanate ceramic capacitor, having a first coefficient of thermal expansion (CTE), typically about 10 parts per million per degree centigrade (10 ppm/.degree.C.), is physically and electrically mounted through an intermediary solder layer, normally copper, to a lead frame, normally made from a selected alloy of nickel-iron, having a second CTE at least one-fifth (20%) less, and more typically about 5 ppm/.degree.C., or one-half (50%) less, than is the CTE of the ceramic capacitor. Because ceramics are stronger in compression than in tension, the ceramic capacitor held within the lead frame is less likely to undergo a stress fracture at temperatures elevated above those of assembly than would be the case should the CTE's be equal, or should the CTE of the lead frame be greater than the CTE of the ceramic capacitor.