Patents by Inventor Hung-tse Daniel Chen

Hung-tse Daniel Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of making ceramic multilayer circuit boards mounted in a patterned metal support substrate
    Patent number: 6739047
    Abstract: A package for an electronic component includes a metal support substrate having a pattern of openings therethrough and a body of an insulating material, such as glass or ceramic, on and bonded to the surface of the support substrate. The body is formed from a plurality of layers of an insulating material, and conductive vias extending through the plurality of layers to the support substrate; said insulating body having an opening therein, an electronic component directly mounted in said opening to the patterned base plate. The base plate can be cut into one or more modules and directly soldered to a motherboard having additional devices mounted thereon.
    Type: Grant
    Filed: October 30, 2002
    Date of Patent: May 25, 2004
    Assignee: Lamina Ceramics, Inc.
    Inventors: Mark Stuart Hammond, Ellen Schwartz Tormey, Barry Jay Thaler, Leszek Hozer, Hung-tse Daniel Chen, Bernard Dov Geller, Gerard Frederickson
  • Ceramic multilayer circuit boards mounted on a patterned metal support substrate and method of making
    Publication number: 20030062185
    Abstract: A package for an electronic component includes a metal support substrate having a pattern of openings therethrough and a body of an insulating material, such as glass or ceramic, on and bonded to the surface of the support substrate. The body is formed from a plurality of layers of an insulating material, and conductive vias extending through the plurality of layers to the support substrate; said insulating body having an opening therein, an electronic component directly mounted in said opening to the patterned base plate. The base plate can be cut into one or more modules and directly soldered to a motherboard having additional devices mounted thereon.
    Type: Application
    Filed: October 30, 2002
    Publication date: April 3, 2003
    Applicant: Lamina Ceramics, Inc.
    Inventors: Mark Stuart Hammond, Ellen Schwartz Tormey, Barry Jay Thaler, Leszek Hozer, Hung-tse Daniel Chen, Bernard Dov Geller, Gerard Frederickson
  • Ceramic multilayer circuit boards mounted on a patterned metal support substrate
    Patent number: 6518502
    Abstract: A package for an electronic component includes a metal support substrate having a pattern of openings therethrough and a body of an insulating material, such as glass or ceramic, on and bonded to the surface of the support substrate. The body is formed from a plurality of layers of an insulating material, and conductive vias extending through the plurality of layers to the support substrate; said insulating body having an opening therein, an electronic component directly mounted in said opening to the patterned base plate. The base plate can be cut into one or more modules and directly soldered to a motherboard having additional devices mounted thereon.
    Type: Grant
    Filed: May 10, 2001
    Date of Patent: February 11, 2003
    Assignee: Lamina Ceramics, In
    Inventors: Mark Stuart Hammond, Ellen Schwartz Tormey, Barry Jay Thaler, Leszek Hozer, Hung-tse Daniel Chen, Bernard Dov Geller, Gerard Frederickson
  • CERAMIC MULTILAYER CIRCUIT BOARDS MOUNTED ON A PATTERNED METAL SUPPORT SUBSTRATE AND METHOD OF MAKING
    Publication number: 20020166684
    Abstract: A package for an electronic component includes a metal support substrate having a pattern of openings therethrough and a body of an insulating material, such as glass or ceramic, on and bonded to the surface of the support substrate. The body is formed from a plurality of layers of an insulating material, and conductive vias extending through the plurality of layers to the support substrate; said insulating body having an opening therein, an electronic component directly mounted in said opening to the patterned base plate. The base plate can be cut into one or more modules and directly soldered to a motherboard having additional devices mounted thereon.
    Type: Application
    Filed: May 10, 2001
    Publication date: November 14, 2002
    Inventors: Mark Stuart Hammond, Ellen Schwartz Tormey, Barry Jay Thaler, Leszek Hozer, Hung-tse Daniel Chen, Bernard Dov Geller, Gerard Frederickson
  • High dielectric constant buried capacitors with extended operating temperature ranges
    Patent number: 6300267
    Abstract: Various mixtures of lead magnesium niobate and lead titanate are made, each mixture having a different Curie temperature, wherein these mixtures are mixed together to form capacitor inks that can be used to make capacitors embedded in multilayer ceramic circuit boards. These capacitors have extended temperature ranges of operation as well as low loss tangents and high dielectric constants.
    Type: Grant
    Filed: November 4, 1999
    Date of Patent: October 9, 2001
    Assignee: Sarnoff Corporation
    Inventors: Hung-tse Daniel Chen, Barry Jay Thaler