Patents by Inventor Hung-Tse Wang

Hung-Tse Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Packaging structure of electronic card
    Publication number: 20050243532
    Abstract: A packaging structure of an electronic card includes a metal cover, a plastic frame and a printed circuit board. The metal cover is produced by providing a metal plate having a central portion and an edge portion and performing a draft operation on the metal plate such that the edge portion is vertical to the central portion. The plastic frame has a first surface combined with the metal cover. The printed circuit board is combined with a second surface of the plastic frame.
    Type: Application
    Filed: March 31, 2005
    Publication date: November 3, 2005
    Applicant: 3 VIEW TECHNOLOGY CO., LTD
    Inventors: Hank Wang, Hung-Tse Wang
  • Packaging structure and process of electronic card
    Publication number: 20050176172
    Abstract: A packaging process of an electronic card is provided. Firstly, a first embedding operation is performed to embed a first metal cover into a first surface of a plastic frame. Then, a circuit board is placed on the plastic frame. Afterward, a second embedding operation is performed to embed a second metal cover into a second surface of the plastic frame. The circuit board is encapsulated into the plastic frame so as to form an electronic card package. The first metal cover, the plastic frame and the second metal cover are separately formed.
    Type: Application
    Filed: September 17, 2004
    Publication date: August 11, 2005
    Applicant: 3 VIEW TECHNOLOGY CO., LTD
    Inventors: Hank Wang, Sheng-Yuan Chen, Hung-Tse Wang