Abstract: ESD suppressor and manufacturing method thereof. The ESD suppressor include at least two printed circuit boards, one insulating frame, two terminal electrodes and two or more interior electrodes. The insulating frame is positioned between the two printed circuit boards, so as to form a main structure with a cavity. For each printed circuit board, at least one interior electrode is positioned on the surface facing the cavity and separated from other interior electrode(s). Two terminal electrodes are positioned on two different surfaces of the main structure and electrically connected to different interior electrodes respectively. Optionally, the insulating frame is a hallowed out printed circuit board or a frame formed by printing insulating material.

Abstract: The invention provides a LED lamp comprising a circuit board and a tube body. The circuit board has a plurality of LED chips and a first heat dissipation body connecting to each LED chip on one surface thereof. Also, the circuit board provides a through hole thereon and has a heat conductor inserting the through hole for connecting the first heat dissipation body to a second heat dissipation body on the other surface. The tube body has a hollow casing for seal packing the circuit board. The LED lamp of the invention has a heat dissipation body with large surface area and seal packing the circuit board in the tube body made of high heat conducting plastics so that it may have effect of heat dissipation and prevent from moisture and dust.

Abstract: A lamp holder of a LED streetlamp includes a lamp cover, a LED unit and a plurality of heat-conducting posts. The LED unit is provided below the lamp cover. A transparent lamp cover covers outside the LED unit. Further, the heat-conducting posts are arranged upright in the lamp cover and separated from each other by a distance. Each of the heat-conducting posts is connected to the inner edge surface of the lamp cover opposite to the LED unit and extends toward the top edge of the lamp cover to be located between the top and bottom of the lamp cover. On both sides of the lamp cover laterally facing the heat-conducting posts, venting holes are provided to form an open structure, thereby allowing outside air to enter the lamp cover and flow among the heat-conducting posts.

Abstract: A method for manufacturing flip-chip light emitting diode (LED) package fabricates a silicon submount with at least one groove by wet etching. Two vias are defined on base of the groove, wherein each via has a contact pad thereon and a bottom electrode on bottom thereof. An LED die is flip-chip mounted in the groove with the electrodes thereof electrically connected to the contact pads. A protective glue is applied to fill the groove and provides a flat top face. A phosphor layer is formed on the flat top face by printing. The phosphor layer is formed with excellent uniformity due to the flat top face, and provides uniform wavelength conversion effect. Alternatively, a phosphor plate is manufactured in advance and selected with desired color temperature parameter. The phosphor plate with desired color temperature parameter is attached to the flat top face of the protective glue instead of printing.

Abstract: A method for manufacturing light emitting diode (LED) package first fabricates a silicon submount with at least one groove by wet etching, wherein a reflective layer, a transparent insulation layer and a metal bump are successively formed in the silicon submount. An LED die is mounted in the groove of the silicon submount. A protective glue is applied to fill the groove and provides a flat top face. A phosphor layer is formed on the flat top face by printing. The phosphor layer is formed with excellent uniformity due to the flat top face, and provides uniform wavelength conversion effect. Alternatively, a phosphor plate is manufactured in advance and selected with desired color temperature parameter. The phosphor plate with desired color temperature parameter is attached to the flat top face of the protective glue instead of printing.

Abstract: A method of dissipating heat, packaging and shaping for light emitting diodes enhances the heat dissipation performance of light emitting diodes, and its structure includes a substrate and a light emitting diode chip. An antioxidation is performed at a high temperature at a predetermined position for installing a chip on the surface of the substrate; a layer of intermetallic layer is coated; a solder material is placed on the intermetallic layer and at the predetermined position of the chip; an intermetallic layer is also coated onto the adhering surface of the chip; the adhering surface of the chip is coupled with the solder material; meanwhile the intermetallic layer and the solder material are heated by furnace to form a stable metal alloy structure, so that the chip can be fixed onto the substrate; and finally the light emitting diode structure is completed by a wirebond process.