Patents by Inventor Hung-Tsung Huang

Hung-Tsung Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11043151
    Abstract: The invention provides a chemical-mechanical polishing composition comprising (a) an abrasive selected from the group consisting of alumina, ceria, titania, zirconia, and combinations thereof, wherein the abrasive is surface-coated with a copolymer comprising a combination of sulfonic acid monomeric units and carboxylic acid monomeric units a combination of sulfonic acid monomeric units and phosphonic acid monomeric units, (b) an oxidizing agent, and (c) water, wherein the polishing composition has a pH of about 2 to about 5. The invention further provides a method of chemically-mechanically polishing a substrate with the inventive chemical-mechanical polishing composition. Typically, the substrate comprises tungsten or cobalt and silicon oxide.
    Type: Grant
    Filed: October 3, 2017
    Date of Patent: June 22, 2021
    Assignee: CMC Materials, Inc.
    Inventors: Ji Cui, Helin Huang, Kevin P. Dockery, Pankaj K. Singh, Hung-Tsung Huang, Chih-Hsien Chien
  • Publication number: 20200332150
    Abstract: The invention provides a chemical-mechanical polishing composition comprising (a) an abrasive comprising silica particles and alumina particles, wherein the alumina particles are surface-coated with an anionic polymer, and (b) water. The invention also provides a method of chemically mechanically polishing a substrate, especially a substrate comprising tungsten, silicon oxide, and nitride, with the polishing composition.
    Type: Application
    Filed: April 15, 2020
    Publication date: October 22, 2020
    Inventors: Chih-Hsien CHIEN, Lung-Tai LU, Hung-Tsung HUANG, Helin HUANG
  • Publication number: 20200308451
    Abstract: The invention provides a chemical-mechanical polishing composition comprising (a) about 0.05 wt. % to about 10 wt. % of an abrasive; (b) a dispersant, wherein the dispersant is a linear or branched C2-C10 alkylenediol; and (c) water, wherein the chemical-mechanical polishing composition has a pH of about 2 to about 6. The invention also provides a method of chemically-mechanically polishing a substrate by contacting the substrate with the inventive chemical-mechanical polishing composition.
    Type: Application
    Filed: March 23, 2020
    Publication date: October 1, 2020
    Inventors: Yang-Yao LEE, Hsin-Yen WU, Cheng-Yuan KO, Lung-Tai LU, Hung-Tsung HUANG
  • Publication number: 20200181454
    Abstract: The invention provides a chemical-mechanical polishing composition comprising(a) an abrasive having a Vickers hardness of 16 GPa or more, and (b) a liquid carrier, wherein the polishing composition is substantially free of an oxidizing agent and wherein the polishing composition has a pH of about 0 to about 7. The invention further provides a method of polishing a substrate, especially a substrate comprising ruthenium, with the polishing composition.
    Type: Application
    Filed: December 9, 2019
    Publication date: June 11, 2020
    Inventors: Cheng-Yuan KO, Hung-Tsung HUANG, Tyler J. CARTER
  • Publication number: 20190100677
    Abstract: The invention provides a chemical-mechanical polishing composition comprising (a) an abrasive selected from the group consisting of alumina, ceria, titania, zirconia, and combinations thereof, wherein the abrasive is surface-coated with a copolymer comprising a combination of sulfonic acid monomeric units and carboxylic acid monomeric units a combination of sulfonic acid monomeric units and phosphonic acid monomeric units, (b) an oxidizing agent, and (c) water, wherein the polishing composition has a pH of about 2 to about 5. The invention further provides a method of chemically-mechanically polishing a substrate with the inventive chemical-mechanical polishing composition. Typically, the substrate comprises tungsten or cobalt and silicon oxide.
    Type: Application
    Filed: October 3, 2017
    Publication date: April 4, 2019
    Inventors: Ji CUI, Helin HUANG, Kevin P. DOCKERY, Pankaj K. SINGH, Hung-Tsung HUANG, Chih-Hsien CHIEN
  • Publication number: 20190085205
    Abstract: The invention provides a chemical-mechanical polishing composition comprising (a) abrasive particles, b) a removal rate inhibitor selected from (I) a surfactant comprising a polyoxyalkylene functional group and a sulfonate functional group, (II) a surfactant comprising a polyoxyalkylene functional group and a sulfate functional group, (III) a first surfactant comprising a polyoxyalkylene functional group and a second surfactant comprising a sulfonate functional group, and (IV) a first surfactant comprising a polyoxyalkylene functional group and a second surfactant comprising a sulfate functional group, and (c) an aqueous carrier. The invention also provides a method of chemically-mechanically polishing a substrate comprising TiN and SiN with the inventive chemical-mechanical polishing composition.
    Type: Application
    Filed: September 15, 2017
    Publication date: March 21, 2019
    Inventors: Chih-Hsien CHIEN, Yi-Hong CHIU, Hung-Tsung HUANG, Ming-Chih YEH
  • Patent number: 9803109
    Abstract: The invention provides a chemical-mechanical polishing composition comprising: (a) colloidal silica particles that are surface modified with metal ions selected from Mg, Ca, Al, B, Be, and combinations thereof, and wherein the colloidal silica particles have a surface hydroxyl group density of from about 1.5 hydroxyls per nm2 to about 8 hydroxyls per nm2 of a surface area of the particles, (b) an anionic surfactant, (c) a buffering agent, and (d) water, wherein the polishing composition has a pH of about 2 to about 7, and wherein the polishing composition is substantially free of an oxidizing agent that oxidizes a metal. The invention further provides a method of chemically-mechanically polishing a substrate with the inventive chemical-mechanical polishing composition. Typically, the substrate contains silicon nitride, silicon oxide, and/or polysilicon.
    Type: Grant
    Filed: February 3, 2015
    Date of Patent: October 31, 2017
    Assignee: Cabot Microelectronics Corporation
    Inventors: Hung-Tsung Huang, Ming-Chih Yeh, Chih-Pin Tsai
  • Publication number: 20160222254
    Abstract: The invention provides a chemical-mechanical polishing composition comprising: (a) colloidal silica particles that are surface modified with metal ions selected from Mg, Ca, Al, B, Be, and combinations thereof, and wherein the colloidal silica particles have a surface hydroxyl group density of from about 1.5 hydroxyls per nm2 to about 8 hydroxyls per nm2 of a surface area of the particles, (b) an anionic surfactant, (c) a buffering agent, and (d) water, wherein the polishing composition has a pH of about 2 to about 7, and wherein the polishing composition is substantially free of an oxidizing agent that oxidizes a metal. The invention further provides a method of chemically-mechanically polishing a substrate with the inventive chemical-mechanical polishing composition. Typically, the substrate contains silicon nitride, silicon oxide, and/or polysilicon.
    Type: Application
    Filed: February 3, 2015
    Publication date: August 4, 2016
    Inventors: Hung-Tsung HUANG, Ming-Chih YEH, Chih-Pin TSAI
  • Patent number: 8481728
    Abstract: A process of making entecavir comprising converting a compound of formula (M5) to entecavir, wherein the two PGs on the formula (M5) are taken together to form an optionally substituted six- or seven-member cyclic ring.
    Type: Grant
    Filed: February 15, 2011
    Date of Patent: July 9, 2013
    Assignee: Scinopharm Taiwan, Ltd.
    Inventors: Tsung-Cheng Hu, Hung-Tsung Huang
  • Publication number: 20110201809
    Abstract: A process of making entecavir comprising converting a compound of formula (M5) to entecavir, wherein the two PGs on the formula (M5) are taken together to form an optionally substituted six- or seven-member cyclic ring.
    Type: Application
    Filed: February 15, 2011
    Publication date: August 18, 2011
    Inventors: Tsung-Cheng Hu, Hung-Tsung Huang