Abstract: A slider may include a first side-edge surface, a second side-edge surface, and an air-bearing surface (ABS) comprising: a first side cavity adjacent to the first side-edge surface, and a first island side blocker situated at a mouth of the first side cavity, wherein: a first outer surface of the first island side blocker forms a portion of the first side-edge surface, a second outer surface of the first island side blocker is recessed from the first side-edge surface, a first side opening is situated on a leading side of the first island side blocker, and a second side opening is situated on a trailing side of the first island side blocker.

Abstract: A vaporization apparatus includes a control unit configured to receive a pod or cartridge. The control unit is configured to communicate with the pod or cartridge. The vaporization apparatus further includes an electronic controller configured to authorize use of the control unit to vaporize a substance within the pod or cartridge.

Abstract: A process for separating soluble silica species such as monomeric silicic acid (or monosilicic acid) and low molecular weight soluble polymeric silica from impure water soluble compounds by membrane nanofiltration is provided. A process for separating soluble silica species and colloidal silica from impure water soluble compounds by reverse phase liquid chromatography is also provided.

Abstract: Optical subassembly grounding in an optoelectronic module. In one example embodiment, a conductive OSA grounding gasket assembly includes a top gasket and a bottom gasket. The top gasket includes a top shell surface and a top OSA surface. The top shell surface is configured to be in direct physical contact with a conductive top shell of an optoelectronic module. The top OSA surface is configured to make direct physical contact with a conductive housing of an OSA. The bottom gasket includes a bottom OSA surface and a bottom shell surface. The bottom OSA surface is configured to be in direct physical contact with the conductive housing of the OSA. The bottom shell surface is configured to make direct physical contact with a conductive bottom shell of the optoelectronic module.

Abstract: Optical subassembly grounding in an optoelectronic module. In one example embodiment, a conductive OSA grounding gasket assembly includes a top gasket and a bottom gasket. The top gasket includes a top shell surface and a top OSA surface. The top shell surface is configured to be in direct physical contact with a conductive top shell of an optoelectronic module. The top OSA surface is configured to make direct physical contact with a conductive housing of an OSA. The bottom gasket includes a bottom OSA surface and a bottom shell surface. The bottom OSA surface is configured to be in direct physical contact with the conductive housing of the OSA. The bottom shell surface is configured to make direct physical contact with a conductive bottom shell of the optoelectronic module.

Abstract: A process for separating soluble silica species such as monomeric silicic acid (or monosilicic acid) and low molecular weight soluble polymeric silica from impure water soluble compounds by membrane nanofiltration is provided. A process for separating soluble silica species and colloidal silica from impure water soluble compounds by reverse phase liquid chromatography is also provided.

Abstract: A disk drive includes a rotatable data storage disk, a transducer, an actuator, and a controller. The transducer is configured to read and write data on the disk. The actuator is configured to position the transducer relative to defined portions of the disk. The controller is configured to determine how many times data has been written to the defined portions of the disk. The controller is also configured to refresh data residing at a particular one of the defined portions of the disk when the number of times data has been written to the particular defined portion of the disk satisfies a threshold value.

Abstract: A process for creating an array of bumps to texture a brittle nonmetallic surface, such as a glass substrate for data recording disks. The texturing process uses a laser to provide pulses of proper energy fluence to the brittle glass surface to produce a plurality of raised bumps in the surface. The bump creation is accomplished without unwanted micro-cracking or ejection of surface material by limiting the laser pulse fluence to a value in a narrow operating region discovered below the abrupt thermal shock fluence threshold for the brittle nonmetallic surface material. The process is also applicable to other brittle surface textures, such as those intended for use as "stamping surfaces" for the contact reproduction of the negative of a surface pattern, such as an optical disk.

Abstract: A process for creating an array of bumps to texture a brittle nonmetallic surface, such as a glass substrate for data recording disks. The texturing process uses a laser to provide pulses of proper energy fluence to the brittle glass surface to produce a plurality of raised bumps in the surface. The bump creation is accomplished without unwanted micro-cracking or ejection of surface material by limiting the laser pulse fluence to a value in a narrow operating region discovered below the abrupt thermal shock fluence threshold for the brittle nonmetallic surface material. The process is also applicable to other brittle surface textures, such as those intended for use as "stamping surfaces" for the contact reproduction of the negative of a surface pattern, such as an optical disk.