Patents by Inventor Hung Wei Chuang

Hung Wei Chuang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250110372
    Abstract: A backlight module has a back plate having a supporting surface, a reflective sheet, a light board, and at least one connecting structure. The reflective sheet is arranged on the supporting surface of the back plate along an assembling direction. The light board is disposed between the reflective sheet and the back plate. The at least one connecting structure has a recess and a post. The recess has an opening and a guiding surface connected to the opening and inclined along a guiding direction relative to the supporting surface. The post has an end portion configured to pass through the opening of the recess and hook the guiding surface. The back plate and the reflective sheet are mounted via the recess and the post. A display device is also provided.
    Type: Application
    Filed: October 22, 2024
    Publication date: April 3, 2025
    Inventors: Cheng-Te CHANG, Hung-Wei CHUANG, Pei-Fen HOU
  • Patent number: 11686893
    Abstract: A backlight module comprises a back plate, a reflective sheet arranged on the back plate and forming a plurality of openings, a plurality of light-emitting elements located in the plurality of openings, at least one optical element arranged on the reflective sheet, and at least a supporting element configured between the back plate and the reflective sheet. The supporting element can move along with the reflective sheet. The supporting element has a base portion and a supporting portion extending from the base portion towards the optical element. The base portion of the supporting element is located between the back plate and the reflective sheet. The supporting portion of the supporting element passes through the reflective sheet to support the optical element. The supporting element is not a fixed design and can move along with the reflective sheet.
    Type: Grant
    Filed: September 20, 2022
    Date of Patent: June 27, 2023
    Assignee: Radiant Opto-Electronics Corporation
    Inventors: Cheng-Te Chang, Hung-Wei Chuang, Yu-Ju Lee, Pei-Fen Hou
  • Publication number: 20230099119
    Abstract: A backlight module comprises a back plate, a reflective sheet arranged on the back plate and forming a plurality of openings, a plurality of light-emitting elements located in the plurality of openings, at least one optical element arranged on the reflective sheet, and at least a supporting element configured between the back plate and the reflective sheet. The supporting element can move along with the reflective sheet. The supporting element has a base portion and a supporting portion extending from the base portion towards the optical element. The base portion of the supporting element is located between the back plate and the reflective sheet. The supporting portion of the supporting element passes through the reflective sheet to support the optical element. The supporting element is not a fixed design and can move along with the reflective sheet.
    Type: Application
    Filed: September 20, 2022
    Publication date: March 30, 2023
    Applicant: Radiant Opto-Electronics Corporation
    Inventors: Cheng-Te CHANG, Hung-Wei CHUANG, Yu-Ju LEE, Pei-Fen HOU
  • Publication number: 20150205334
    Abstract: A heat dissipation assembly including a metal substrate, a heat conducting sheet and a copper foil is provided. The metal substrate has a recess defined therethrough. The heat conducting sheet has a same dimension as the recess, and is embedded in the recess. A thermal conductivity of the heat conducting sheet is greater than a thermal conductivity of the metal substrate. The copper foil is coupled to a surface of the metal substrate. A portable electronic device using the dissipation assembly is also provided. Since the heat conducting sheet has a high thermal conductivity, the metal substrate integrated with the heat conducting sheet can achieve a good strength, low weight and good heat conduct performance.
    Type: Application
    Filed: December 22, 2014
    Publication date: July 23, 2015
    Inventors: HUNG-WEI CHUANG, MONG-HAU TSAI
  • Patent number: 8252896
    Abstract: The present invention relates to the efficient commercial synthesis of Bivalirudin.
    Type: Grant
    Filed: September 3, 2009
    Date of Patent: August 28, 2012
    Assignee: ScnioPharm Taiwan, Ltd.
    Inventors: Tsung Yu Hsiao, Jin Guo Ding, Hung Wei Chuang
  • Publication number: 20100056755
    Abstract: The present invention relates to the efficient commercial synthesis of Bivalirudin.
    Type: Application
    Filed: September 3, 2009
    Publication date: March 4, 2010
    Inventors: Tsung Yu Hsiao, Jin Guo Ding, Hung Wei Chuang