Patents by Inventor Hung Wei Lin

Hung Wei Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11127827
    Abstract: Various embodiments of the present application are directed towards a control gate layout to improve an etch process window for word lines. In some embodiments, an integrated chip comprises a memory array, an erase gate, a word line, and a control gate. The memory array comprises a plurality of cells in a plurality of rows and a plurality of columns. The erase gate and the word line are elongated in parallel along a row of the memory array. The control gate is elongated along the row and is between and borders the erase gate and the word line. Further, the control gate has a pad region protruding towards the erase gate and the word line. Because the pad region protrudes towards the erase gate and the word line, a width of the pad region is spread between word-line and erase-gate sides of the control gate.
    Type: Grant
    Filed: January 16, 2019
    Date of Patent: September 21, 2021
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yu-Ling Hsu, Ping-Cheng Li, Hung-Ling Shih, Po-Wei Liu, Wen-Tuo Huang, Yong-Shiuan Tsair, Chia-Sheng Lin, Shih Kuang Yang
  • Patent number: 11128227
    Abstract: A secondary controller applied to a secondary side of a power converter includes a control signal generation circuit. The control signal generation circuit is coupled to an output terminal of the secondary side of the power converter for detecting an output voltage of the secondary side and enabling a pulse signal to a signal source of the secondary side of the power converter, wherein the signal source enables a turning-on signal according to the pulse signal. The turning-on signal is coupled to a primary-side auxiliary winding of the power converter through a secondary-side auxiliary winding of the power converter to make the primary-side auxiliary winding generate a voltage, and a primary controller of a primary side of the power converter makes the primary side of the power converter be turned on according to the voltage.
    Type: Grant
    Filed: January 2, 2020
    Date of Patent: September 21, 2021
    Assignee: Leadtrend Technology Corp.
    Inventors: Hung-Ching Lee, Chung-Wei Lin, Tsung-Chien Wu, Bo-Yi Wu
  • Publication number: 20210265280
    Abstract: A semiconductor device package includes an electronic component, an electrical contact and a reinforcement layer. The electronic component has a first conductive layer on a first surface of the electronic component. The electronic component has a through-silicon-via (TSV) penetrating the electronic component and electrically connected to the first conductive layer. The electrical contact is disposed on the first surface of the electronic component and electrically connected to the first conductive layer. The reinforcement layer is disposed on the first surface of the electronic component.
    Type: Application
    Filed: February 21, 2020
    Publication date: August 26, 2021
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Hsu-Chiang SHIH, Hung-Yi LIN, Meng-Wei HSIEH, Yu Sheng CHANG, Hsiu-Chi LIU, Mark GERBER
  • Patent number: 11101209
    Abstract: An embodiment semiconductor package includes a bare semiconductor chip, a packaged semiconductor chip adjacent the bare semiconductor chip, and a redistribution structure bonded to the bare semiconductor chip and the packaged semiconductor chip. The redistribution structure includes a first redistribution layer having a first thickness; a second redistribution layer having a second thickness; and a third redistribution layer between the first redistribution layer and the second redistribution layer. The third redistribution layer has a third thickness greater than the first thickness and the second thickness. The package further includes an underfill disposed between the bare semiconductor chip and the redistribution structure and a molding compound encapsulating the bare semiconductor chip, the packaged semiconductor chip, and the underfill.
    Type: Grant
    Filed: August 1, 2018
    Date of Patent: August 24, 2021
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chung-Shi Liu, Chien-Hsun Lee, Jiun Yi Wu, Hao-Cheng Hou, Hung-Jen Lin, Jung Wei Cheng, Tsung-Ding Wang, Yu-Min Liang, Li-Wei Chou
  • Publication number: 20210062866
    Abstract: A bearing assembly and a rotary shaft apparatus employing the same are provided. The bearing assembly is rotatably coupled with a first shaft and a second shaft. The first bearing housing includes a first annular recess having a first axial depth. The first bearing is connected with the first annular recess and the first shaft and has a first axial thickness. The second bearing housing includes a second annular recess having a second axial depth. The second bearing is connected with the first annular recess, the second annular recess and the second shaft and has a second axial thickness. The spacer is disposed between the first bearing and the second bearing and has a third axial thickness. The sum of the first axial thickness, the second axial thickness and the third axial thickness is greater than the sum of the first axial depth and the second axial depth.
    Type: Application
    Filed: February 11, 2020
    Publication date: March 4, 2021
    Inventors: Chi-Wen Chung, En-Yi Chu, Ming-Li Tsao, Hung-Wei Lin, Jen-Yuan Chen, Hsien-Lung Tsai
  • Patent number: 10935033
    Abstract: A fan frame module comprises a frame and a wire-stopping structure. In the frame, an outer wall is divided into a first side section, a first mid section, a central section, a second mid section and a second side section in a first direction. The extension direction of the major axis of the central section is parallel to the central axis of the frame, and the first direction is perpendicular to the extension direction of the major axis of the central section. A wire groove is formed on the first mid section to accommodate a wire. A fastening portion is disposed on one side of the wire groove. A positioning portion is disposed on the other one side of the wire groove. The wire-stopping structure is held by the fastening portion and the positioning portion, and fixed to the outer wall.
    Type: Grant
    Filed: March 9, 2018
    Date of Patent: March 2, 2021
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Hung-Wei Lin, Chih-Hui Wu, Ming-Kai Hsieh
  • Patent number: 10841390
    Abstract: A system and method for synchronizing publication and subscription of message queues are provided. The method includes: providing a message broker cluster including a plurality of message brokers each having a buffer queue and a data queue; as any one of the message brokers requests a synchronization requirement, selecting, by an orchestration server, one of the message brokers in the message broker cluster to perform data synchronization; setting a data read-lock to the data queue of the selected message broker sequentially to write data contents in the buffer queues of all of the plurality of message brokers into the data queue of the selected message broker; and copying the complete data contents in the data queue of the selected message broker to the data queues of the other message brokers, allowing the data contents in the data queues of each of the message brokers to be consistent.
    Type: Grant
    Filed: April 16, 2019
    Date of Patent: November 17, 2020
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Yu-Lun Chen, Hung-Wei Lin, Li-Ting Huang
  • Publication number: 20200232542
    Abstract: A cycloid speed reducer includes a weight element, an input shaft and a cycloid disc. The weight element is disposed within an accommodation space of the cycloid disc. An eccentric part is disposed on the input shaft. Since the length of the input shaft is reduced, the overall length of the cycloid speed reducer is shortened. Moreover, the mass center of the weight element and the mass center of the eccentric part and the cycloid disc are arranged along the same axial direction. That is, the line passing through the mass center of the weight element and the mass center of the eccentric part and the cycloid disc is perpendicular to the input shaft. Consequently, the efficacy of the dynamic balance of the cycloid speed reducer is enhanced.
    Type: Application
    Filed: January 10, 2020
    Publication date: July 23, 2020
    Inventors: Chi-Wen Chung, En-Yi Chu, Hung-Wei Lin, Ming-Li Tsao
  • Publication number: 20200227608
    Abstract: A flip-chip light-emitting module includes a thermal dissipation substrate, a package assembly, and a light-emitting chip. The package assembly includes a frame surrounding the thermal dissipation substrate, and a lens unit disposed on the frame. The frame includes a conductive path. The light-emitting chip is disposed on the thermal dissipation substrate, and includes a top conductive contact and a light-emitting surface at the same side. The top conductive contact is electrically connected with the conductive path by a conductor.
    Type: Application
    Filed: March 31, 2020
    Publication date: July 16, 2020
    Inventors: KUNG-AN LIN, CHUNG-CHE YANG, HUNG-WEI LIN, HSIANG-YUN CHENG
  • Publication number: 20200169616
    Abstract: A system and method for synchronizing publication and subscription of message queues are provided. The method includes: providing a message broker cluster including a plurality of message brokers each having a buffer queue and a data queue; as any one of the message brokers requests a synchronization requirement, selecting, by an orchestration server, one of the message brokers in the message broker cluster to perform data synchronization; setting a data read-lock to the data queue of the selected message broker sequentially to write data contents in the buffer queues of all of the plurality of message brokers into the data queue of the selected message broker; and copying the complete data contents in the data queue of the selected message broker to the data queues of the other message brokers, allowing the data contents in the data queues of each of the message brokers to be consistent.
    Type: Application
    Filed: April 16, 2019
    Publication date: May 28, 2020
    Inventors: Yu-Lun Chen, Hung-Wei Lin, Li-Ting Huang
  • Publication number: 20200144888
    Abstract: A speed reducing device includes a motor and a speed reducing mechanism. The speed reducing mechanism includes at least one roller assembly, a cycloid disc, at least one fixing disc and a positioning assembly. The roller assembly is disposed within a rotor portion of the motor. While the roller assembly is rotated with the rotor portion, the roller assembly is eccentrically revolved. The roller assembly includes a wheel disc and at least one roller. The cycloid disc includes a main body and at least one cycloid tooth structure. The cycloid tooth structure is protruded from an outer periphery of the main body and in contact with the corresponding roller. While the roller assembly is eccentrically revolved, the at least one cycloid tooth structure is pushed against the corresponding roller, so that the cycloid disc is correspondingly rotated.
    Type: Application
    Filed: September 27, 2019
    Publication date: May 7, 2020
    Inventors: Chi-Wen Chung, En-Yi Chu, Hung-Wei Lin, Ming-Li Tsao
  • Publication number: 20200141478
    Abstract: A speed reducer comprises a transmission shaft, an eccentric wheel, a first wheel assembly, a rotating wheel and a second wheel assembly. The first wheel assembly comprises a first wheel disc and at least one first roller. The at least one first roller is disposed on the inner wall of first wheel disc. The rotating wheel comprises a main body comprising an outer ring structure and a concave structure. The outer ring structure comprises at least one first tooth. The at least one first tooth is in contact with the corresponding first roller. At least one second roller is disposed within the concave structure. The second wheel assembly comprises a second wheel disc and at least one second tooth. The at least one second tooth is disposed on an outer periphery of the second wheel assembly. The at least one second tooth is in contact with the corresponding second roller.
    Type: Application
    Filed: September 27, 2019
    Publication date: May 7, 2020
    Inventors: Chi-Wen Chung, En-Yi Chu, Hung-Wei Lin, Ming-Li Tsao
  • Publication number: 20200132166
    Abstract: A two-stage cycloid speed reducer comprises two rotating disc assemblies. Each rotating disc assembly comprises two cycloid discs. In other words, the cycloid speed reducer has four cycloid discs to be in contact with the corresponding rollers. Consequently, the load withstood by each cycloid disc is reduced. Since the cycloid speed reducer has stronger structural strength, the cycloid speed reducer can be applied to the high-load circumstance. Moreover, an eccentric assembly of the eccentric device includes a plurality of eccentric cylinders. The eccentric cylinders are disposed within the axle holes of the corresponding cycloid discs. Due to the eccentric cylinders, the eccentric direction of two cycloid discs is opposite to the eccentric direction of the other two cycloid discs. Consequently, it is not necessary to install an additional weight compensation device in the cycloid speed reducer to compensate the dynamic equilibrium. Moreover, the cycloid speed reducer can be assembled easily.
    Type: Application
    Filed: December 27, 2019
    Publication date: April 30, 2020
    Inventors: Chi-Wen Chung, En-Yi Chu, Hung-Wei Lin, Ming-Li Tsao, Ching-Hsiung Tsai
  • Publication number: 20200075342
    Abstract: Generally, this disclosure provides examples relating to tuning etch rates of dielectric material. In an embodiment, a dielectric material is conformally deposited in first and second trenches in a substrate. Merged lateral growth fronts of the first dielectric material in the first trench form a seam in the first trench. The dielectric material is treated. The treating causes a species to be on first and second upper surfaces of the dielectric material in the first and second trenches, respectively, to be in the seam, and to diffuse into the respective dielectric material in the first and second trenches. After the treating, the respective dielectric material is etched. A ratio of an etch rate of the dielectric material in the second trench to an etch rate of the dielectric material in the first trench is altered by presence of the species in the dielectric material during the etching.
    Type: Application
    Filed: August 31, 2018
    Publication date: March 5, 2020
    Inventors: Shih-Chiang Chen, Chun-Hung Lee, Ryan Chia-jen Chen, Hung-Wei Lin, Lung-Kai Mao
  • Patent number: 10580780
    Abstract: Provided is a semiconductor structure including a substrate, an isolation structure, a fuse and two gate electrodes. The isolation structure is located in the substrate and defines active regions of the substrate. The fuse is disposed on the isolation structure. The gate electrodes are disposed on the active regions and connected to ends of the fuse. In an embodiment, a portion of a bottom surface of the fuse is lower than top surfaces of the active regions of the substrate.
    Type: Grant
    Filed: June 11, 2018
    Date of Patent: March 3, 2020
    Assignee: United Microelectronics Corp.
    Inventors: Zi-Jun Liu, Ping-Chia Shih, Chi-Cheng Huang, Kuo-Lung Li, Hung-Wei Lin, An-Hsiu Cheng, Chih-Hao Pan, Cheng-Hua Chou, Chih-Hung Wang
  • Publication number: 20190378961
    Abstract: A flip-chip light-emitting module includes a thermal dissipation substrate, a package assembly, and a light-emitting chip. The package assembly includes a frame surrounding the thermal dissipation substrate, and a lens unit disposed on the frame. The frame includes a conductive path. The light-emitting chip is disposed on the thermal dissipation substrate, and includes a top conductive contact and a light-emitting surface at the same side. The top conductive contact is electrically connected with the conductive path by a conductor.
    Type: Application
    Filed: August 13, 2018
    Publication date: December 12, 2019
    Inventors: KUNG-AN LIN, CHUNG-CHE YANG, HUNG-WEI LIN, HSIANG-YUN CHENG
  • Publication number: 20190378846
    Abstract: Provided is a semiconductor structure including a substrate, an isolation structure, a fuse and two gate electrodes. The isolation structure is located in the substrate and defines active regions of the substrate. The fuse is disposed on the isolation structure. The gate electrodes are disposed on the active regions and connected to ends of the fuse. In an embodiment, a portion of a bottom surface of the fuse is lower than top surfaces of the active regions of the substrate.
    Type: Application
    Filed: June 11, 2018
    Publication date: December 12, 2019
    Applicant: United Microelectronics Corp.
    Inventors: Zi-Jun Liu, Ping-Chia Shih, Chi-Cheng Huang, Kuo-Lung Li, Hung-Wei Lin, An-Hsiu Cheng, Chih-Hao Pan, Cheng-Hua Chou, Chih-Hung Wang
  • Publication number: 20190222816
    Abstract: A light source generating device, a projection apparatus and a light source generation method are provided. The light source generating device includes a first light source, an auxiliary light source, a control device, a driver and a current command generator. The first light source generates a first light beam. The auxiliary light source generates an auxiliary light beam corresponding to the first light beam. The control device generates a first driving signal to drive the first light source. The driver generates an auxiliary driving signal to drive the auxiliary light source according to the gate control signal and a current command. The current command generator receives an indication signal, and generates the current command according to the indication signal, wherein the indication signal corresponds to a driving current of the first light source. The invention has an effect of enhancing brightness/chrominance.
    Type: Application
    Filed: January 10, 2019
    Publication date: July 18, 2019
    Applicant: Coretronic Corporation
    Inventors: Chi-Wen Ke, Hung-Wei Lin, Chun-Yi Lee
  • Patent number: 10198054
    Abstract: A power supply device includes a first body and a second body. The first body has an opening and an adapter module which is electrically connected to a first electronic device. The opening is divided into a first part and a second part via a first axis, and the shape of the first part is asymmetrical to the shape of the second part. The second body has an energy storage unit. The energy storage unit is electrically connected to the adapter module to supply power to the first electronic device, when the second body is detached from the first body, the energy storage unit is adapted to supply power to a second electronic device.
    Type: Grant
    Filed: October 29, 2014
    Date of Patent: February 5, 2019
    Assignee: ASUSTeK COMPUTER INC.
    Inventors: Ching-Hua Chen, Hung-Wei Lin
  • Patent number: D916408
    Type: Grant
    Filed: March 30, 2020
    Date of Patent: April 13, 2021
    Inventor: Hung-Wei Lin