Abstract: The present invention is composed of a main body, a rotary ring, a fixing member, and a spring plate. The main body includes a sleeve projecting from a top end of a driving hole and including a guide aperture extending through the driving hole. The rotary ring has a bore rotatably coupled to the sleeve to be rotatable between first and second positions. The bore has an inside surface forming a retention chamber having first and second recessed curved faces. The fixing member is movably received in the guide aperture. The spring plate is arranged between the fixing member and the retention chamber and has one side fixed to the sleeve and a curved section formed between two sides thereof. In the first position, the first recessed curved face positions the curved section. In the second position, the second recessed curved face positions the curved section.

Abstract: A driving wrench device includes an adaptor for engaging with a non-circular compartment of a wrench member, the adaptor includes a non-circular outer peripheral portion for engaging with the non-circular compartment of the wrench member, and the adaptor includes an upper portion having an upper engaging hole, and a bottom portion having a bottom engaging hole communicating with the upper engaging hole of the adaptor, the engaging holes of the adaptor include an inner diameter different from each other for engaging with the fasteners or tool members of different outer diameters. The adaptor includes an outer notch for engaging with a retaining ring of the wrench member.

Abstract: Methods for removing particles from a wafer for photolithography. A method is provided including providing a semiconductor wafer; attaching a polyimide layer to a backside of the semiconductor wafer; and performing an etch on an active surface of the semiconductor wafer; wherein particles that impinge on the backside during the etch are captured by the polyimide layer. In another method, includes attaching a layer of polyimide film to a backside of a semiconductor wafer; dry etching a material on an active surface of the semiconductor wafer; depositing of an additional layer of material on the active surface of the semiconductor wafer; removing the layer of polyimide film from the backside of the semiconductor wafer; patterning the layer of material using an immersion photolithography process to expose a photoresist on the active surface of the wafer; and repeating the attaching, dry etching, depositing, removing and patterning steps.

Abstract: A diaper having wetness detectors, a system thereof and a wetness detecting method are adapted to detect the excreting status of an animal. The diaper includes a first set of contacts and a second set of contacts which are constituted by conductive material. The first set of contacts and the second set of contacts are respectively disposed on proximal and distal area of the diaper corresponding to the excretory organ of the animal. A detecting circuit detects the electrical property of the first set of contacts and the second set of contacts and then determines the excretion status of the animal to be a reference for a caregiver.

Abstract: The present invention discloses a device for spin cleaning and etching wet processor. The support is kept in a fixed level, and the drain tank can be lifting and lowering to collect and drain out the liquid from the support. This device consists of a suport, a set of drain tank and a lifting and lowering device to move the drain tank so that one of the drain tank is in the same level with the suport. The suport is used to support a wafer to process etching and cleaning, can spin with different speed and supply etching solution and DI water. The number of drain tanks are selected by the number of etching solutions and DI water. A stationary axaust appratus kept in a fixed level as the support is used to axaust the acidic gas from the drain tanks.

Abstract: A stepped light guide has an incident surface, an emitting surface and a stepped reflecting structure. The emitting surface is adjacent to the incident surface. The stepped reflecting structure is adjacent to the incident surface, faces the emitting surface and has a proximal end, a distal end, multiple planar surfaces and multiple inclined surfaces. The proximal end is adjacent to the incident surface. The distal end is opposite to the proximal end. The planar surfaces are parallel to and separated from the emitting surface by a depth, the depth being gradually reduced from the proximal end to the distal end. The inclined surfaces are formed between every two adjacent planar surfaces. The light guide effectively changes a linear or point light source into a surface light source having uniform illumination.

Abstract: A charge pump voltage regulating circuit which uses a constant current generator and a second current generator, controlled by the output voltage of the charge pump circuit. The current from the constant current generator is divided between the input to a current controlled oscillator and the second current generator. When the output voltage of the charge pump circuit increases the current in the second current generator increases, the current flowing into the current controlled oscillator decreases, the frequency of the clock signals supplied to the charge pump circuit decreases, and the output voltage of the charge pump circuit decreases. When the output voltage of the charge pump circuit decreases the current in the second current generator decreases, the current flowing into the current controlled oscillator increases, the frequency of the clock signals supplied to the charge pump circuit increases, and the output voltage of the charge pump circuit increases.

Abstract: A method and apparatus for spatially filtering a signal set to enhance interface echoes representing a borehole configuration. The spatial filtering technique provides information regarding the various interfaces formed between materials in the borehole environment, as well as thicknesses of the various materials present in the borehole. Further, the presence of channels formed during the cementing procedure are detected.