Patents by Inventor Hung-Wen Tsao

Hung-Wen Tsao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12096174
    Abstract: A headphone includes a headgear and two earmuffs connected to opposite ends of the headgear, and each of the earmuffs includes an adjustment assembly. The adjustment assembly includes a base, two elastic members, two protrusions, and two sliding blocks. The base has two opposite accommodating parts and two guiding grooves. The elastic members are disposed in the accommodating parts, respectively, and the elastic members extend along a first axial direction. The protrusions are slidably connected to the guiding grooves, respectively, and protrude into the accommodating parts. The sliding blocks are disposed in the accommodating parts, respectively, and each of the sliding blocks is respectively connected between the corresponding protrusion and the corresponding elastic member.
    Type: Grant
    Filed: October 19, 2022
    Date of Patent: September 17, 2024
    Assignee: Merry Electronics(Shenzhen) Co., Ltd.
    Inventors: Wen-Chung Lee, Yung-Lung Tsai, Hung-Wen Tsao
  • Publication number: 20240089645
    Abstract: A headphone includes a headgear and two earmuffs connected to opposite ends of the headgear, and each of the earmuffs includes an adjustment assembly. The adjustment assembly includes a base, two elastic members, two protrusions, and two sliding blocks. The base has two opposite accommodating parts and two guiding grooves. The elastic members are disposed in the accommodating parts, respectively, and the elastic members extend along a first axial direction. The protrusions are slidably connected to the guiding grooves, respectively, and protrude into the accommodating parts. The sliding blocks are disposed in the accommodating parts, respectively, and each of the sliding blocks is respectively connected between the corresponding protrusion and the corresponding elastic member.
    Type: Application
    Filed: October 19, 2022
    Publication date: March 14, 2024
    Applicant: Merry Electronics(Shenzhen) Co., Ltd.
    Inventors: Wen-Chung Lee, Yung-Lung Tsai, Hung-Wen Tsao
  • Publication number: 20130142375
    Abstract: A headphone having a headband and two acoustic transducers disposed at two ends of the headband is disclosed. Each acoustic transducer includes a baffle plate installed with a speaker, a spacer, a vent and an acoustic modulator. The baffle plate and speaker divide the acoustic transducer into a front and a back chamber. The front chamber is configured for communicating with a user's ear. The spacer is disposed behind the speaker to divide the back chamber into a first back chamber and a second back communicated with each other. The vent is disposed in a back wall of the acoustic transducer to communicate the first back chamber with outside. The first acoustic modulator is disposed between the front and second back chambers. The headphone modulates resonance frequency at low frequency bands through the acoustic modulator.
    Type: Application
    Filed: December 2, 2011
    Publication date: June 6, 2013
    Applicant: Merry Electronics Co., Ltd.
    Inventors: Po-Hsun Sung, Chun-Fu Wang, Hung-Wen Tsao
  • Patent number: 8447058
    Abstract: A headphone having a headband and two acoustic transducers disposed at two ends of the headband is disclosed. Each acoustic transducer includes a baffle plate installed with a speaker, a spacer, a vent and an acoustic modulator. The baffle plate and speaker divide the acoustic transducer into a front and a back chamber. The front chamber is configured for communicating with a user's ear. The spacer is disposed behind the speaker to divide the back chamber into a first back chamber and a second back communicated with each other. The vent is disposed in a back wall of the acoustic transducer to communicate the first back chamber with outside. The first acoustic modulator is disposed between the front and second back chambers. The headphone modulates resonance frequency at low frequency bands through the acoustic modulator.
    Type: Grant
    Filed: December 2, 2011
    Date of Patent: May 21, 2013
    Assignee: Merry Electronics Co., Ltd.
    Inventors: Po-Hsun Sung, Chun-Fu Wang, Hung-Wen Tsao